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Class Information
Number: 420/577
Name: Alloys or metallic compositions > Bismuth base
Description: Alloy, or metallic composition which contains over 50 percent of bismuth by weight.










Patents under this class:

Patent Number Title Of Patent Date Issued
8679635 Bonding material, bonded portion and circuit board Mar. 25, 2014
8668841 Bismuth-zinc-mercury amalgam, fluorescent lamps, and related methods Mar. 11, 2014
8303735 Lead-free low-temperature solder Nov. 6, 2012
8293370 Bonding material, bonded portion and circuit board Oct. 23, 2012
8133433 Bismuth-indium amalgam, fluorescent lamps, and methods of manufacture Mar. 13, 2012
7973412 Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead Jul. 5, 2011
7927516 Method for synthesis of colloidal nanoparticles Apr. 19, 2011
7744706 Solder alloy for bonding oxide material, and solder joint using the same Jun. 29, 2010
7192785 Water-soluble luminescent quantum dots and biomolecular conjugates thereof and related compositions and methods of use Mar. 20, 2007
7128981 Sliding member Oct. 31, 2006
6835332 PROCESS FOR PRODUCING AN ELECTRODE MATERIAL FOR A RECHARGEABLE LITHIUM BATTERY, AN ELECTRODE STRUCTURAL BODY FOR A RECHARGEABLE LITHIUM BATTERY, PROCESS FOR PRODUCING SAID ELECTRODE STRUCTURAL Dec. 28, 2004
6703113 Pb-free solder composition and soldered article Mar. 9, 2004
6468808 Water-soluble luminescent quantum dots and biomolecular conjugates thereof and related compositions and method of use Oct. 22, 2002
6367683 Solder braze alloy Apr. 9, 2002
6319617 Oxide-bondable solder Nov. 20, 2001
6306516 Article comprising oxide-bondable solder Oct. 23, 2001
6156132 Solder alloys Dec. 5, 2000
5833921 Lead-free, low-temperature solder compositions Nov. 10, 1998
5755896 Low temperature lead-free solder compositions May. 26, 1998
5641454 Composite material having anti-wear property and process for producing the same Jun. 24, 1997
5593082 Methods of bonding targets to backing plate members using solder pastes and target/backing plate assemblies bonded thereby Jan. 14, 1997
5569433 Lead-free low melting solder with improved mechanical properties Oct. 29, 1996
5505928 Preparation of III-V semiconductor nanocrystals Apr. 9, 1996
5503475 Method for determining the carbon equivalent, carbon content and silicon content of molten cast iron Apr. 2, 1996
5368814 Lead free, tin-bismuth solder alloys Nov. 29, 1994
5248476 Fusible alloy containing bismuth, indium, lead, tin and gallium Sep. 28, 1993
5192377 Process of producing continuously cast monotectic aluminum-silicon alloy strip and wire Mar. 9, 1993
5126168 Preparation of group IIIA-VA compounds such as boron nitride, and of boron nitride films and coatings Jun. 30, 1992
5098656 Alloys for electrically joining superconductors to themselves, to normal conductors, and to semi-conductors Mar. 24, 1992
5039576 Electrodeposited eutectic tin-bismuth alloy on a conductive substrate Aug. 13, 1991
4975336 Article for data storage of magneto-optical disk Dec. 4, 1990
4778541 Directional solidification and densification of permanent magnets having single domain Oct. 18, 1988
4764212 Thermoelectric material for low temperature use and method of manufacturing the same Aug. 16, 1988
4491679 Thermoelectric materials and devices made therewith Jan. 1, 1985
4358422 Low tin jewel metal alloy Nov. 9, 1982
4244737 Method and alloy for introducing machinability increasing ingredients to steel Jan. 13, 1981
4236922 Dental alloy of bismuth-tin with additions of Ag, Sb and Cu Dec. 2, 1980
4214903 Bismuth-tin-indium alloy Jul. 29, 1980
4173468 Alloy for soldering aluminum Nov. 6, 1979
4083718 Bismuth-tin-indium-lead alloy Apr. 11, 1978











 
 
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