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Class Information
Number: 420/573
Name: Alloys or metallic compositions > Lead base > Copper containing
Description: Alloys, or metallic composition which additionally contains copper.










Patents under this class:

Patent Number Title Of Patent Date Issued
7005745 Method and structure to reduce risk of gold embrittlement in solder joints Feb. 28, 2006
6337145 Multilayer material for sliding elements and process for the production thereof Jan. 8, 2002
5882587 Lead alloy used for sliding bearing Mar. 16, 1999
5384090 Fine wire for forming bump electrodes using a wire bonder Jan. 24, 1995
5011658 Copper doped low melt solder for component assembly and rework Apr. 30, 1991
4937149 Overlay alloy used for a surface layer of sliding material, sliding material having a surface layer comprising said alloy and the manufacturing method of the sliding material Jun. 26, 1990
4622205 Electromigration lifetime increase of lead base alloys Nov. 11, 1986
4443405 Lead-antimony alloys for electrode supports for lead accumulators Apr. 17, 1984
4427629 Process for metal-enrichment of lead bullion Jan. 24, 1984
4376754 Pyrometallurgical smelting of lead and copper Mar. 15, 1983
4376093 Low antimony alloy Mar. 8, 1983
4261743 Pyrometalurgical smelting of lead and copper Apr. 14, 1981
4206268 Plain bearing laminate having slide-layer alloy based on copper-lead-tin Jun. 3, 1980
3993480 Lead-antimony alloy Nov. 23, 1976











 
 
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