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Class Information
Number: 420/558
Name: Alloys or metallic compositions > Tin base > Lead containing
Description: Alloy, or metallic composition which additionally contains lead.










Sub-classes under this class:

Class Number Class Name Patents
420/559 Antimony, or bismuth containing 37


Patents under this class:

Patent Number Title Of Patent Date Issued
8536047 Methods and systems for material bonding Sep. 17, 2013
7041180 Method for joining workpieces using soldering alloy May. 9, 2006
6921497 Composition of matter tailoring: system I Jul. 26, 2005
6689488 Lead-free solder and solder joint Feb. 10, 2004
6423154 Solder-coating method, and solder paste suitable for use therein Jul. 23, 2002
6319617 Oxide-bondable solder Nov. 20, 2001
6231693 Alloy, in particular a solder alloy, for joining workpieces May. 15, 2001
6221514 High-current circuit trace and composition and method therefor Apr. 24, 2001
6210547 Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties Apr. 3, 2001
6160224 Solder material and electronic part using the same Dec. 12, 2000
6071359 Shot for use as ammunition Jun. 6, 2000
5550407 Semiconductor device having an aluminum alloy wiring line Aug. 27, 1996
5538686 Article comprising a PB-free solder having improved mechanical properties Jul. 23, 1996
5538686 Article comprising a PB-free solder having improved mechanical properties Jul. 23, 1996
5384090 Fine wire for forming bump electrodes using a wire bonder Jan. 24, 1995
5382300 Solder paste mixture Jan. 17, 1995
5308578 Fatigue resistant lead-tin eutectic solder May. 3, 1994
5120498 Solders having exceptional adhesion to glass Jun. 9, 1992
5066544 Dispersion strengthened lead-tin alloy solder Nov. 19, 1991
5011658 Copper doped low melt solder for component assembly and rework Apr. 30, 1991
4938924 Copper doping of eutectic solder Jul. 3, 1990
4588657 Solder composition May. 13, 1986
4563541 Package providing high heat dissipation, in particular for microelectronics Jan. 7, 1986
4512950 Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices Apr. 23, 1985
4318741 Rare earth metal stannides Mar. 9, 1982
4106930 Solder alloys for soldering difficultly solderable material Aug. 15, 1978
4070192 Aluminium soldering composition Jan. 24, 1978
3998677 Technique for using solder etch resist in generation of patterns on printed wiring boards Dec. 21, 1976











 
 
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