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Class Information
Number: 420/469
Name: Alloys or metallic compositions > Copper base
Description: Alloy, or metallic composition which contains over 50 percent of copper by weight.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 420/489 |
Aluminum, gallium, indium, or thallium containing |
66 |
| 420/494 |
Beryllium, magnesium, or alkaline earth metal containing |
47 |
| 420/498 |
Cadmium, or mercury containing |
7 |
| 420/496 |
Iron or cobalt containing |
53 |
| 420/491 |
Lead containing |
23 |
| 420/493 |
Manganese containing |
26 |
| 420/485 |
Nickel containing |
89 |
| 420/497 |
Noble metal containing |
48 |
| 420/495 |
Other refractory metal containing |
50 |
| 420/499 |
Phosphorus, arsenic, antimony, or bismuth containing |
55 |
| 420/490 |
Silicon containing |
45 |
| 420/500 |
Sulfur, selenium, or tellurium containing |
36 |
| 420/470 |
Tin containing |
61 |
| 420/492 |
Titanium, zirconium or hafnium containing |
78 |
| 420/477 |
Zinc containing |
68 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8436216 |
Process for making 1,1,1,4,4,4-Hexafluoro-2-butene |
May. 7, 2013 |
| 8221897 |
Rolled copper foil |
Jul. 17, 2012 |
| 8192596 |
Ultrahigh-purity copper and process for producing the same |
Jun. 5, 2012 |
| 8147624 |
Electrode |
Apr. 3, 2012 |
| 7910512 |
Production process of electrode catalyst for fuel cell |
Mar. 22, 2011 |
| 7858025 |
Method for manufacturing cubic copper or copper oxide nanoparticles |
Dec. 28, 2010 |
| 7771835 |
Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same |
Aug. 10, 2010 |
| 7736448 |
Nano icrystals copper material with super high strength and conductivity and method of preparing thereof |
Jun. 15, 2010 |
| 7662740 |
Platinum-chromium-copper/nickel fuel cell catalyst |
Feb. 16, 2010 |
| 7556189 |
Lead-free bonding systems |
Jul. 7, 2009 |
| 7461772 |
Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys |
Dec. 9, 2008 |
| 7422994 |
Platinum-copper-tungsten fuel cell catalyst |
Sep. 9, 2008 |
| 7404866 |
Sliding member and method for manufacture thereof |
Jul. 29, 2008 |
| 7374651 |
Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it |
May. 20, 2008 |
| 7186370 |
Copper-base alloy and its use |
Mar. 6, 2007 |
| 6953539 |
Composite material |
Oct. 11, 2005 |
| 6921497 |
Composition of matter tailoring: system I |
Jul. 26, 2005 |
| 6914032 |
Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder |
Jul. 5, 2005 |
| 6761306 |
Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers |
Jul. 13, 2004 |
| 6758920 |
Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition |
Jul. 6, 2004 |
| 6645427 |
Copper sputtering target assembly and method of making same |
Nov. 11, 2003 |
| 6645352 |
Optical data storage disk |
Nov. 11, 2003 |
| 6616727 |
Porous metal powder |
Sep. 9, 2003 |
| 6596131 |
Carbon fiber and copper support for physical vapor deposition target assembly and method of forming |
Jul. 22, 2003 |
| 6572792 |
Composition of matter tailoring: system 1 |
Jun. 3, 2003 |
| 6475635 |
Sliding material made of copper alloy, method of producing same, and sliding bearing |
Nov. 5, 2002 |
| 6475642 |
Oxidation-resistant coatings, and related articles and processes |
Nov. 5, 2002 |
| 6451135 |
High-purity copper sputtering targets and thin films |
Sep. 17, 2002 |
| 6413649 |
Silver-copper-nickel infiltration brazing filler metal and composites made therefrom |
Jul. 2, 2002 |
| 6391163 |
Method of enhancing hardness of sputter deposited copper films |
May. 21, 2002 |
| 6197433 |
Rolled copper foil for flexible printed circuit and method of manufacturing the same |
Mar. 6, 2001 |
| 6187071 |
Bond for abrasive tool |
Feb. 13, 2001 |
| 6174344 |
Copper fine powder and method for preparing the same |
Jan. 16, 2001 |
| 6149739 |
Lead-free copper alloy |
Nov. 21, 2000 |
| 6093499 |
Copper alloy foils |
Jul. 25, 2000 |
| 6063506 |
Copper alloys for chip and package interconnections |
May. 16, 2000 |
| 6037067 |
High temperature abrasion resistant copper alloy |
Mar. 14, 2000 |
| 5955176 |
Integrated suspension using a high strength conductive material |
Sep. 21, 1999 |
| 5865910 |
Copper alloy and process for obtaining same |
Feb. 2, 1999 |
| 5858125 |
Magnetoresistive materials |
Jan. 12, 1999 |
| 5675883 |
Method of manufacturing a copper-nickel-silicon alloy casing |
Oct. 14, 1997 |
| 5667751 |
Alloy material with improved catalytic properties |
Sep. 16, 1997 |
| 5578266 |
Alloys suitable for hydrogen storage, method of producing the same and electrode using the same |
Nov. 26, 1996 |
| 5523022 |
Semiconductor compound |
Jun. 4, 1996 |
| 5516484 |
Copper-nickel-tin based alloy |
May. 14, 1996 |
| 5463247 |
Lead frame material formed of copper alloy for resin sealed type semiconductor devices |
Oct. 31, 1995 |
| 5441696 |
Copper-nickel based alloy |
Aug. 15, 1995 |
| 5409520 |
Copper powder for solderable and electroconductive paints and process for producing the same |
Apr. 25, 1995 |
| 5403376 |
Particle size distribution for controlling flow of metal powders melted to form electrical conductors |
Apr. 4, 1995 |
| 5330592 |
Process of deposition and solid state reaction for making alloyed highly conductive copper germanide |
Jul. 19, 1994 |
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