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Class Information
Number: 420/469
Name: Alloys or metallic compositions > Copper base
Description: Alloy, or metallic composition which contains over 50 percent of copper by weight.

Sub-classes under this class:

Class Number Class Name Patents
420/489 Aluminum, gallium, indium, or thallium containing 67
420/494 Beryllium, magnesium, or alkaline earth metal containing 48
420/498 Cadmium, or mercury containing 7
420/496 Iron or cobalt containing 53
420/491 Lead containing 24
420/493 Manganese containing 26
420/485 Nickel containing 91
420/497 Noble metal containing 48
420/495 Other refractory metal containing 50
420/499 Phosphorus, arsenic, antimony, or bismuth containing 58
420/490 Silicon containing 47
420/500 Sulfur, selenium, or tellurium containing 36
420/470 Tin containing 63
420/492 Titanium, zirconium or hafnium containing 78
420/477 Zinc containing 70

Patents under this class:
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Patent Number Title Of Patent Date Issued
8658009 Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layer Feb. 25, 2014
8647534 Copper-carbon composition Feb. 11, 2014
8465003 Plumbing fixture made of bismuth brass alloy Jun. 18, 2013
8436216 Process for making 1,1,1,4,4,4-Hexafluoro-2-butene May. 7, 2013
8221897 Rolled copper foil Jul. 17, 2012
8192596 Ultrahigh-purity copper and process for producing the same Jun. 5, 2012
8147624 Electrode Apr. 3, 2012
7910512 Production process of electrode catalyst for fuel cell Mar. 22, 2011
7858025 Method for manufacturing cubic copper or copper oxide nanoparticles Dec. 28, 2010
7771835 Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same Aug. 10, 2010
7736448 Nano icrystals copper material with super high strength and conductivity and method of preparing thereof Jun. 15, 2010
7662740 Platinum-chromium-copper/nickel fuel cell catalyst Feb. 16, 2010
7556189 Lead-free bonding systems Jul. 7, 2009
7461772 Silver/aluminum/copper/titanium/nickel brazing alloys for brazing WC-Co to titanium alloys Dec. 9, 2008
7422994 Platinum-copper-tungsten fuel cell catalyst Sep. 9, 2008
7404866 Sliding member and method for manufacture thereof Jul. 29, 2008
7374651 Electrolytic copper plating method, phosphorus-containing anode for electrolytic copper plating, and semiconductor wafer plated using them and having few particles adhering to it May. 20, 2008
7186370 Copper-base alloy and its use Mar. 6, 2007
6953539 Composite material Oct. 11, 2005
6921497 Composition of matter tailoring: system I Jul. 26, 2005
6914032 Method of producing tungsten-copper based composite powder and sintered alloys for heat-sink using said composite powder Jul. 5, 2005
6761306 Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers Jul. 13, 2004
6758920 Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition Jul. 6, 2004
6645427 Copper sputtering target assembly and method of making same Nov. 11, 2003
6645352 Optical data storage disk Nov. 11, 2003
6616727 Porous metal powder Sep. 9, 2003
6596131 Carbon fiber and copper support for physical vapor deposition target assembly and method of forming Jul. 22, 2003
6572792 Composition of matter tailoring: system 1 Jun. 3, 2003
6475642 Oxidation-resistant coatings, and related articles and processes Nov. 5, 2002
6475635 Sliding material made of copper alloy, method of producing same, and sliding bearing Nov. 5, 2002
6451135 High-purity copper sputtering targets and thin films Sep. 17, 2002
6413649 Silver-copper-nickel infiltration brazing filler metal and composites made therefrom Jul. 2, 2002
6391163 Method of enhancing hardness of sputter deposited copper films May. 21, 2002
6197433 Rolled copper foil for flexible printed circuit and method of manufacturing the same Mar. 6, 2001
6187071 Bond for abrasive tool Feb. 13, 2001
6174344 Copper fine powder and method for preparing the same Jan. 16, 2001
6149739 Lead-free copper alloy Nov. 21, 2000
6093499 Copper alloy foils Jul. 25, 2000
6063506 Copper alloys for chip and package interconnections May. 16, 2000
6037067 High temperature abrasion resistant copper alloy Mar. 14, 2000
5955176 Integrated suspension using a high strength conductive material Sep. 21, 1999
5865910 Copper alloy and process for obtaining same Feb. 2, 1999
5858125 Magnetoresistive materials Jan. 12, 1999
5675883 Method of manufacturing a copper-nickel-silicon alloy casing Oct. 14, 1997
5667751 Alloy material with improved catalytic properties Sep. 16, 1997
5578266 Alloys suitable for hydrogen storage, method of producing the same and electrode using the same Nov. 26, 1996
5523022 Semiconductor compound Jun. 4, 1996
5516484 Copper-nickel-tin based alloy May. 14, 1996
5463247 Lead frame material formed of copper alloy for resin sealed type semiconductor devices Oct. 31, 1995
5441696 Copper-nickel based alloy Aug. 15, 1995

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