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Browse by Category: Main > Optical & Optics
Class Information
Number: 382/150
Name: Image analysis > Applications > Manufacturing or product inspection > Inspection of semiconductor device or printed circuit board > Fault or defect detection > Faulty soldering
Description: Subject matter wherein means or process is provided for inspecting printed circuit board packages containing IC or other devices to identify defective or missing soldering or bonding points.


Patents under this class:
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Patent Number Title Of Patent Date Issued
7539338 Bump inspection apparatus and method for IC component, bump forming method for IC component, and mounting method for IC component May. 26, 2009
7505149 Apparatus for surface inspection and method and apparatus for inspecting substrate Mar. 17, 2009
7471819 Position detecting apparatus, a position detecting method and an electronic component carrying apparatus Dec. 30, 2008
7450748 Mask inspection process accounting for mask writer proximity correction Nov. 11, 2008
7336816 Method and apparatus for measuring shape of bumps Feb. 26, 2008
7327870 Method for inspecting a region of interest Feb. 5, 2008
7308129 Characteristic amount calculating device for soldering inspection Dec. 11, 2007
7239740 Image processing apparatus and method, medium storing program for image processing, and inspection apparatus Jul. 3, 2007
7213447 Method and apparatus for detecting topographical features of microelectronic substrates May. 8, 2007
7159754 Apparatus and method for corrective soldering Jan. 9, 2007
7149344 Systems and methods for detecting defects in printed solder paste Dec. 12, 2006
7139421 Methods and apparatuses for detecting similar features within an image Nov. 21, 2006
7136714 Procedure for determining modifications made to an electronic card and methods of fabricating an electronic card and an item equipment provided with an electronic card Nov. 14, 2006
7079689 Image processing apparatus and its method, and program Jul. 18, 2006
7072503 Systems and methods for detecting defects in printed solder paste Jul. 4, 2006
7046377 Method for determining corresponding points in three-dimensional measurement May. 16, 2006
7027639 High speed optical image acquisition system with extended dynamic range Apr. 11, 2006
7019826 Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection Mar. 28, 2006
7013038 Method for inspecting a BGA joint Mar. 14, 2006
6993193 Method and system of object classification employing dimension reduction Jan. 31, 2006
6947151 Surface state inspecting method and substrate inspecting apparatus Sep. 20, 2005
6923045 Method and apparatus for detecting topographical features of microelectronic substrates Aug. 2, 2005
6907824 Screen printing apparatus and method of the same Jun. 21, 2005
6895073 High-speed x-ray inspection apparatus and method May. 17, 2005
6891967 Systems and methods for detecting defects in printed solder paste May. 10, 2005
6787378 Method for measuring height of sphere or hemisphere Sep. 7, 2004
6779386 Method and apparatus for detecting topographical features of microelectronic substrates Aug. 24, 2004
6771805 Perspective viewing inspection system Aug. 3, 2004
6768812 Method for locating features on an object using varied illumination Jul. 27, 2004
6765666 System and method for inspecting bumped wafers Jul. 20, 2004
6738505 Method and apparatus for detecting solder paste deposits on substrates May. 18, 2004
6614926 Methods and apparatuses for generating from an image a model of an object Sep. 2, 2003
6608921 Inspection of solder bump lighted with rays of light intersecting at predetermined angle Aug. 19, 2003
6606402 System and method for in-line inspection of stencil aperture blockage Aug. 12, 2003
6549647 Inspection system with vibration resistant video capture Apr. 15, 2003
6529624 Apparatus for inspecting cream solder on PCB and method thereof Mar. 4, 2003
6516086 Method and apparatus for distinguishing regions where a material is present on a surface Feb. 4, 2003
6442291 Machine vision methods and articles of manufacture for ball grid array Aug. 27, 2002
6396942 Method and apparatus for locating ball grid array packages from two-dimensional image data May. 28, 2002
6385335 Apparatus and method for estimating background tilt and offset May. 7, 2002
6342266 Method for monitoring solder paste printing process Jan. 29, 2002
6330354 Method of analyzing visual inspection image data to find defects on a device Dec. 11, 2001
6289117 Analysis of an image of a pattern of discrete objects Sep. 11, 2001
6272204 Integrated X-ray and visual inspection systems Aug. 7, 2001
6249598 Solder testing apparatus Jun. 19, 2001
6177682 Inspection of ball grid arrays (BGA) by using shadow images of the solder balls Jan. 23, 2001
6167149 Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component Dec. 26, 2000
6151406 Method and apparatus for locating ball grid array packages from two-dimensional image data Nov. 21, 2000
6130959 Analyzing an image of an arrangement of discrete objects Oct. 10, 2000
6118893 Analysis of an image of a pattern of discrete objects Sep. 12, 2000

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