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Class Information
Number: 382/146
Name: Image analysis > Applications > Manufacturing or product inspection > Inspection of semiconductor device or printed circuit board > Measuring external leads
Description: Subject matter wherein external leads of a component are inspected, such as for coplanarity, shape, or alignment prior to insertion into a printed circuit board or the like.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5990944 |
Streak tube sweeping method and a device for implementing the same |
Nov. 23, 1999 |
| 5991434 |
IC lead inspection system configurable for different camera positions |
Nov. 23, 1999 |
| 5963662 |
Inspection system and method for bond detection and validation of surface mount devices |
Oct. 5, 1999 |
| 5943125 |
Ring illumination apparatus for illuminating reflective elements on a generally planar surface |
Aug. 24, 1999 |
| 5930381 |
Board recognizing apparatus and method |
Jul. 27, 1999 |
| 5908150 |
Method for inner lead bonding |
Jun. 1, 1999 |
| 5909285 |
Three dimensional inspection system |
Jun. 1, 1999 |
| 5883663 |
Multiple image camera for measuring the alignment of objects in different planes |
Mar. 16, 1999 |
| 5838434 |
Semiconductor device lead calibration unit |
Nov. 17, 1998 |
| 5835622 |
Method and apparatus to locate and measure capillary indentation marks on wire bonded leads |
Nov. 10, 1998 |
| 5828449 |
Ring illumination reflective elements on a generally planar surface |
Oct. 27, 1998 |
| 5812693 |
Integrated machine vision inspection and rework system -- CIP |
Sep. 22, 1998 |
| 5805722 |
Method and apparatus for locating, inspecting, and placing large leaded devices |
Sep. 8, 1998 |
| 5757956 |
Template rotating method for locating bond pads in an image |
May. 26, 1998 |
| 5754679 |
Image rotating method for locating bond pads in an image |
May. 19, 1998 |
| 5745593 |
Method and system for inspecting integrated circuit lead burrs |
Apr. 28, 1998 |
| 5648853 |
System for inspecting pin grid arrays |
Jul. 15, 1997 |
| 5642158 |
Method and apparatus to detect capillary indentations |
Jun. 24, 1997 |
| 5640199 |
Automated optical inspection apparatus |
Jun. 17, 1997 |
| 5627912 |
Inspection method of inclination of an IC |
May. 6, 1997 |
| 5563703 |
Lead coplanarity inspection apparatus and method thereof |
Oct. 8, 1996 |
| 5528371 |
Measurement apparatus for measuring dimensions of semiconductor device and method of measuring the same |
Jun. 18, 1996 |
| 5485398 |
Method and apparatus for inspecting bent portions in wire loops |
Jan. 16, 1996 |
| 5293428 |
Optical apparatus for use in image recognition |
Mar. 8, 1994 |
| 5249239 |
Means for measuring coplanarity of leads on an IC package |
Sep. 28, 1993 |
| 5168217 |
Method of detecting floated lead of electrical component |
Dec. 1, 1992 |
| 5125036 |
Video bond lead locator |
Jun. 23, 1992 |
| 5119436 |
Method of centering bond positions |
Jun. 2, 1992 |
| 5115475 |
Automatic semiconductor package inspection method |
May. 19, 1992 |
| 5007097 |
Lead's position recognizing device |
Apr. 9, 1991 |
| 4969199 |
Apparatus for inspecting the molded case of an IC device |
Nov. 6, 1990 |
| 4851902 |
Auatomatic inspection system for IC lead frames and visual inspection method thereof |
Jul. 25, 1989 |
| 4847911 |
Electronic parts recognition method and apparatus therefore |
Jul. 11, 1989 |
| 4845764 |
Shape recognition apparatus |
Jul. 4, 1989 |
| 4821157 |
System for sensing and forming objects such as leads of electronic components |
Apr. 11, 1989 |
| 4799268 |
Lead sense system for component insertion machine |
Jan. 17, 1989 |
| 4704700 |
Apparatus and method for lead integrity determination for dip devices |
Nov. 3, 1987 |
| 4696047 |
Apparatus for automatically inspecting electrical connecting pins |
Sep. 22, 1987 |
| 4686637 |
Apparatus and method for lead integrity determination for dip devices |
Aug. 11, 1987 |
| 4549087 |
Lead sensing system |
Oct. 22, 1985 |
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