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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/813
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Lead frame
Description: Subject matter wherein a metal skeletal structure is utilized to support a plurality of diverse electrical components, portions of a metal skeletal structure being removed to provide connecting paths.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8692360 Electrical connectivity for circuit applications Apr. 8, 2014
8681479 Various methods and apparatuses for an integrated power distribution platform Mar. 25, 2014
8669652 Lead component and method for manufacturing the same, and semiconductor package Mar. 11, 2014
8643054 Light-emitting device Feb. 4, 2014
8630097 Power module using sintering die attach and manufacturing method thereof Jan. 14, 2014
8598693 Die pad package with a concave portion in the sealing resin Dec. 3, 2013
8582317 Method for manufacturing a semiconductor component and structure therefor Nov. 12, 2013
8547709 Electronic system with a composite substrate Oct. 1, 2013
8537567 Method of manufacturing electronic device and electronic device Sep. 17, 2013
8502363 Semiconductor device packages with solder joint enhancement element and related methods Aug. 6, 2013
8493748 Packaging system with hollow package and method for the same Jul. 23, 2013
8441805 Circuit board mounting structure of compound circuit May. 14, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8400784 Flip chip package for monolithic switching regulator Mar. 19, 2013
8390041 High efficiency module Mar. 5, 2013
8358514 Electronic control device Jan. 22, 2013
8344263 Housing for an optoelectronic component emitting electromagnetic radiation, component emitting electromagnetic radiation, and method for the production of a housing or a component Jan. 1, 2013
8288178 Lead frame, method of manufacturing the same, and method of manufacturing semiconductor device Oct. 16, 2012
8269334 Multichip package leadframe including electrical bussing Sep. 18, 2012
8259467 Multi-piece board and fabrication method therefor Sep. 4, 2012
8253041 Electronic element packaging module Aug. 28, 2012
8254147 Box for an electronics module for controlling a machine Aug. 28, 2012
8183607 Semiconductor device May. 22, 2012
8184453 Increased capacity semiconductor package May. 22, 2012
8157415 Light emitting diode lighting module and method for making the same Apr. 17, 2012
8158460 Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Apr. 17, 2012
8159835 Laser apparatus Apr. 17, 2012
8154111 Near chip size semiconductor package Apr. 10, 2012
8153478 Method for manufacturing integrated circuit package system with under paddle leadfingers Apr. 10, 2012
8125784 Seal apparatus and method of manufacturing the same Feb. 28, 2012
8116102 Integrated circuit device and method of producing Feb. 14, 2012
8110752 Wiring substrate and method for manufacturing the same Feb. 7, 2012
8097496 Method of forming quad flat package Jan. 17, 2012
8097935 Quad flat package Jan. 17, 2012
8085553 Lead assembly for a flip-chip power switch Dec. 27, 2011
8067779 Light emitting device with a recess lead portion Nov. 29, 2011
8058720 Semiconductor package Nov. 15, 2011
8053876 Multi lead frame power package Nov. 8, 2011
8054647 Electronic device mounting structure for busbar Nov. 8, 2011
8050048 Lead frame with solder flow control Nov. 1, 2011
8045330 Method and apparatus for providing an alternative power source for a graphics card Oct. 25, 2011
8040690 Inner-connecting structure of lead frame and its connecting method Oct. 18, 2011
8039946 Chip package structure and fabricating method thereof Oct. 18, 2011
8021928 System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices Sep. 20, 2011
7998790 Integrated circuit packaging system with isolated pads and method of manufacture thereof Aug. 16, 2011
7989931 Integrated circuit package system with under paddle leadfingers Aug. 2, 2011
7985991 MOSFET package Jul. 26, 2011
7982293 Multi-chip package including die paddle with steps Jul. 19, 2011
7968807 Package having a plurality of mounting orientations Jun. 28, 2011
7935899 Circuit device and method of manufacturing the same May. 3, 2011

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