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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/803
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Plural > Interconnection details
Description: Subject matter wherein a conductive path or connecting line between the printed circuit boards has specific details.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Patent Number Title Of Patent Date Issued
7692931 Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods Apr. 6, 2010
7688599 Lead frame module for manufacturing light emitting diodes Mar. 30, 2010
7681309 Method for interconnecting an integrated circuit multiple die assembly Mar. 23, 2010
7679928 System-in-package module and mobile terminal having the same Mar. 16, 2010
7672140 Circuit board configuration Mar. 2, 2010
7667982 LSI package with interface module and interface module Feb. 23, 2010
7652890 Wired circuit board Jan. 26, 2010
7643286 Symmetric multiprocessing computer and star interconnection architecture and cooling system thereof Jan. 5, 2010
7639903 Daisy chain optical interconnect Dec. 29, 2009
7633767 Memory modules including SIMM and DIMM-type connection structures and related memory systems Dec. 15, 2009
RE41039 Stackable chip package with flex carrier Dec. 15, 2009
7626831 Circuit board retention system Dec. 1, 2009
7623358 I/O cards and card arrangements for I/O device Nov. 24, 2009
7616446 Mobile terminal device and method for radiating heat therefrom Nov. 10, 2009
7616452 Flex circuit constructions for high capacity circuit module systems and methods Nov. 10, 2009
7613012 Standing apparatus for electrical components Nov. 3, 2009
7606042 High capacity thin module system and method Oct. 20, 2009
7606048 Integrated circuit stacking system Oct. 20, 2009
7602618 Methods and apparatuses for transferring heat from stacked microfeature devices Oct. 13, 2009
7602613 Thin module system and method Oct. 13, 2009
7599189 Board-housing case and fluid pressure control device including thereof Oct. 6, 2009
7596000 Signal transmitting apparatus using flexible flat cable for an optical disc drive Sep. 29, 2009
7593239 Fixing device for securing circuit board to plate member Sep. 22, 2009
7586758 Integrated circuit stacking system Sep. 8, 2009
7572984 Electronic module with dual connectivity Aug. 11, 2009
7573727 Connecting device for contacting a semiconductor component Aug. 11, 2009
7566960 Interposing structure Jul. 28, 2009
7566968 Biosensor with smart card configuration Jul. 28, 2009
7561437 Electronic element module and electronic device using the same Jul. 14, 2009
7557304 Printed circuit board having closed vias Jul. 7, 2009
7551449 Flexible circuit board, electronic circuit device, and mobile communication terminal Jun. 23, 2009
7551453 Optically connectable circuit board with optical component(s) mounted thereon Jun. 23, 2009
7548431 Optically connectable circuit board with optical component(s) mounted thereon Jun. 16, 2009
7545651 Memory module with a predetermined arrangement of pins Jun. 9, 2009
7544898 Multilayer wiring board, touch panel and manufacturing method of the same Jun. 9, 2009
7542305 Memory module having on-package or on-module termination Jun. 2, 2009
7539027 Force distributing spring element May. 26, 2009
7539026 Sub-mezzanine structure for printed circuit card assemblies May. 26, 2009
7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board Apr. 28, 2009
7522428 Electric device designed to be attached to a mounting rail, and corresponding mounting method Apr. 21, 2009
7522425 High capacity thin module system and method Apr. 21, 2009
7518881 Interposer containing bypass capacitors for reducing voltage noise in an IC device Apr. 14, 2009
7518883 Backplane architecture for enabling configuration of multi-service network elements for use in a global variety of communications networks Apr. 14, 2009
7511965 Circuit board device and manufacturing method thereof Mar. 31, 2009
7511968 Buffered thin module system and method Mar. 31, 2009
7511969 Composite core circuit module system and method Mar. 31, 2009
7508063 Low cost hermetically sealed package Mar. 24, 2009
7504668 Transponder assembly for use with parallel optics modules in fiber optic communications systems Mar. 17, 2009
7489524 Assembly including vertical and horizontal joined circuit panels Feb. 10, 2009
7489521 Multilayer printed wiring board Feb. 10, 2009

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