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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/803
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Plural > Interconnection details
Description: Subject matter wherein a conductive path or connecting line between the printed circuit boards has specific details.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
7616452 Flex circuit constructions for high capacity circuit module systems and methods Nov. 10, 2009
7613012 Standing apparatus for electrical components Nov. 3, 2009
7606042 High capacity thin module system and method Oct. 20, 2009
7606048 Integrated circuit stacking system Oct. 20, 2009
7602618 Methods and apparatuses for transferring heat from stacked microfeature devices Oct. 13, 2009
7602613 Thin module system and method Oct. 13, 2009
7599189 Board-housing case and fluid pressure control device including thereof Oct. 6, 2009
7596000 Signal transmitting apparatus using flexible flat cable for an optical disc drive Sep. 29, 2009
7593239 Fixing device for securing circuit board to plate member Sep. 22, 2009
7586758 Integrated circuit stacking system Sep. 8, 2009
7572984 Electronic module with dual connectivity Aug. 11, 2009
7573727 Connecting device for contacting a semiconductor component Aug. 11, 2009
7566968 Biosensor with smart card configuration Jul. 28, 2009
7566960 Interposing structure Jul. 28, 2009
7561437 Electronic element module and electronic device using the same Jul. 14, 2009
7557304 Printed circuit board having closed vias Jul. 7, 2009
7551453 Optically connectable circuit board with optical component(s) mounted thereon Jun. 23, 2009
7551449 Flexible circuit board, electronic circuit device, and mobile communication terminal Jun. 23, 2009
7548431 Optically connectable circuit board with optical component(s) mounted thereon Jun. 16, 2009
7545651 Memory module with a predetermined arrangement of pins Jun. 9, 2009
7544898 Multilayer wiring board, touch panel and manufacturing method of the same Jun. 9, 2009
7542305 Memory module having on-package or on-module termination Jun. 2, 2009
7539027 Force distributing spring element May. 26, 2009
7539026 Sub-mezzanine structure for printed circuit card assemblies May. 26, 2009
7525817 Wiring layout of auxiliary wiring package and printed circuit wiring board Apr. 28, 2009
7522425 High capacity thin module system and method Apr. 21, 2009
7522428 Electric device designed to be attached to a mounting rail, and corresponding mounting method Apr. 21, 2009
7518881 Interposer containing bypass capacitors for reducing voltage noise in an IC device Apr. 14, 2009
7518883 Backplane architecture for enabling configuration of multi-service network elements for use in a global variety of communications networks Apr. 14, 2009
7511968 Buffered thin module system and method Mar. 31, 2009
7511969 Composite core circuit module system and method Mar. 31, 2009
7511965 Circuit board device and manufacturing method thereof Mar. 31, 2009
7508063 Low cost hermetically sealed package Mar. 24, 2009
7504668 Transponder assembly for use with parallel optics modules in fiber optic communications systems Mar. 17, 2009
7489521 Multilayer printed wiring board Feb. 10, 2009
7489524 Assembly including vertical and horizontal joined circuit panels Feb. 10, 2009
7483276 Semiconductor package and method for manufacturing same Jan. 27, 2009
7480152 Thin module system and method Jan. 20, 2009
7477526 Branching fully-buffered memory-module with two downlink and one uplink ports Jan. 13, 2009
7474540 Silicon carrier including an integrated heater for die rework and wafer probe Jan. 6, 2009
7466562 Toolless method for alignment, retention, connection, termination and test on printed circuit boards Dec. 16, 2008
7458821 Electrical interface for memory connector Dec. 2, 2008
7453699 Digital electronic apparatus with suppressed radiant noise Nov. 18, 2008
7446421 Bonding structure with buffer layer and method of forming the same Nov. 4, 2008
7447044 Fixing mechanism for printed circuit board Nov. 4, 2008
7445156 Memory card magazine system Nov. 4, 2008
7442879 Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of maki Oct. 28, 2008
7443696 Riser card to support different kinds of connectors Oct. 28, 2008
7443844 Switched fabric mezzanine storage module Oct. 28, 2008
7443692 Power converter architecture employing at least one capacitor across a DC bus Oct. 28, 2008

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