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Class Information
Number: 361/795
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Plural > Plural contiguous boards > Plural dielectric layers
Description: Subject matter wherein the printed circuit boards contain two or more separate insulating mediums which intervene between two conductors and permit electrostatic attraction and repulsion to take place across them.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7420126 |
Circuit board and circuit apparatus using the same |
Sep. 2, 2008 |
| 7408120 |
Printed circuit board having axially parallel via holes |
Aug. 5, 2008 |
| 7405473 |
Techniques for optimizing electrical performance and layout efficiency in connectors with via placement and routing |
Jul. 29, 2008 |
| 7402760 |
Multi-layer printed wiring board and manufacturing method thereof |
Jul. 22, 2008 |
| 7391622 |
Composite structural member having an integrated electrical circuit |
Jun. 24, 2008 |
| 7385792 |
Electronic control apparatus |
Jun. 10, 2008 |
| 7382629 |
Circuit substrate and method of manufacturing plated through slot thereon |
Jun. 3, 2008 |
| 7378601 |
Signal transmission structure and circuit substrate thereof |
May. 27, 2008 |
| 7375290 |
Printed circuit board via with radio frequency absorber |
May. 20, 2008 |
| 7375288 |
Apparatuses and methods for improving ball-grid-array solder joint reliability |
May. 20, 2008 |
| 7375286 |
Printed circuit board and manufacturing method thereof |
May. 20, 2008 |
| 7365272 |
Circuit board with identifiable information and method for fabricating the same |
Apr. 29, 2008 |
| 7361843 |
AC coupling of power plane sections using improved capacitance stitching material |
Apr. 22, 2008 |
| 7355863 |
High frequency multilayer integrated circuit |
Apr. 8, 2008 |
| 7350292 |
Method for affecting impedance of an electrical apparatus |
Apr. 1, 2008 |
| 7349225 |
Multifunctional composite sandwich element with embedded electronics |
Mar. 25, 2008 |
| 7342802 |
Multilayer wiring board for an electronic device |
Mar. 11, 2008 |
| 7327582 |
Integrated thin film capacitor/inductor/interconnect system and method |
Feb. 5, 2008 |
| 7321496 |
Flexible substrate, multilayer flexible substrate and process for producing the same |
Jan. 22, 2008 |
| 7307853 |
Wired circuit board assembly |
Dec. 11, 2007 |
| 7307852 |
Printed circuit board and method for manufacturing printed circuit board |
Dec. 11, 2007 |
| 7304860 |
Printed circuit board with thin film switches for a keyboard |
Dec. 4, 2007 |
| 7304857 |
Sensor node and circuit board arrangement |
Dec. 4, 2007 |
| 7269029 |
Rapid fire test board |
Sep. 11, 2007 |
| 7262975 |
Multilayer printed wiring board |
Aug. 28, 2007 |
| 7259968 |
Tailoring impedances of conductive traces in a circuit board |
Aug. 21, 2007 |
| 7245506 |
System for reducing noise induced from reference plane currents |
Jul. 17, 2007 |
| 7242592 |
Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics |
Jul. 10, 2007 |
| 7239526 |
Printed circuit board and method of reducing crosstalk in a printed circuit board |
Jul. 3, 2007 |
| 7238603 |
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
Jul. 3, 2007 |
| 7230835 |
Apparatus for reducing signal reflection in a circuit board |
Jun. 12, 2007 |
| 7218530 |
Enhanced blind hole termination of pin to PCB |
May. 15, 2007 |
| 7209368 |
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making |
Apr. 24, 2007 |
| 7193862 |
Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device |
Mar. 20, 2007 |
| 7183492 |
Multi-layer printed circuit with low noise |
Feb. 27, 2007 |
| 7176383 |
Printed circuit board with low cross-talk noise |
Feb. 13, 2007 |
| 7155820 |
Method for manufacturing printed circuit board |
Jan. 2, 2007 |
| 7154760 |
Power amplifier module |
Dec. 26, 2006 |
| 7151228 |
Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using same |
Dec. 19, 2006 |
| 7120031 |
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors |
Oct. 10, 2006 |
| 7109569 |
Dual referenced microstrip |
Sep. 19, 2006 |
| 7095623 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
Aug. 22, 2006 |
| 7075794 |
Electronic control unit |
Jul. 11, 2006 |
| 7059049 |
Electronic package with optimized lamination process |
Jun. 13, 2006 |
| 7047630 |
Method of making circuitized substrate assembly |
May. 23, 2006 |
| 6998540 |
Electrical circuit board and a method for making the same |
Feb. 14, 2006 |
| 6982386 |
Interconnecting substrates for electrical coupling of microelectronic components |
Jan. 3, 2006 |
| 6979892 |
Laminated co-fired sandwiched element for non-thermal plasma reactor |
Dec. 27, 2005 |
| 6977820 |
Electronic circuit board |
Dec. 20, 2005 |
| 6974916 |
Laminated ceramic electronic component having via-hole conductors with different sectional sizes |
Dec. 13, 2005 |
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