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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/790
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Plural > With separable connector or socket means > Stacked
Description: Subject matter wherein the printed circuit boards are arranged one on top of another to formulate a pile.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8711573 Using interrupted through-silicon-vias in integrated circuits adapted for stacking Apr. 29, 2014
8711575 Printed circuit board unit having routing unit mounted thereon and computer device having the same Apr. 29, 2014
8711571 Portable multimedia player Apr. 29, 2014
8704351 Stacked microelectronic assemblies Apr. 22, 2014
8694709 Systems and methods for improving connections to an information handling system Apr. 8, 2014
8675369 Module board Mar. 18, 2014
8665599 Portable external power-supplying device Mar. 4, 2014
8654543 Circuit board assembly Feb. 18, 2014
8649186 Package substrate and semiconductor package having the same Feb. 11, 2014
8643188 Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector Feb. 4, 2014
8635763 Method for manufacturing a portable computing device Jan. 28, 2014
8605456 Electronic apparatus Dec. 10, 2013
8599572 Printed circuit board with integrated thin film battery Dec. 3, 2013
8589608 Logic node connection system Nov. 19, 2013
8564969 Component arrangement and method for production thereof Oct. 22, 2013
8559185 Integrated circuit package system with stackable devices and a method of manufacture thereof Oct. 15, 2013
8559238 Configurable inputs and outputs for memory stacking system and method Oct. 15, 2013
8536693 Tiered integrated circuit assembly and a method for manufacturing the same Sep. 17, 2013
8520402 Decoupling capacitor circuit assembly Aug. 27, 2013
8508954 Systems employing a stacked semiconductor package Aug. 13, 2013
8498171 Distributed semiconductor device methods, apparatus, and systems Jul. 30, 2013
8498125 Instrumentation package in a downhole tool string component Jul. 30, 2013
8488326 Memory support structure Jul. 16, 2013
8488331 Electrical connection interfaces and methods for adjacently positioned circuit components Jul. 16, 2013
8477510 Fixing structure of multi-layer printed circuit board Jul. 2, 2013
8477512 Electronic device Jul. 2, 2013
8456857 Backplane for an electronic mounting rack Jun. 4, 2013
8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices May. 28, 2013
8451621 Semiconductor component and method of manufacture May. 28, 2013
8446736 Circuit board and manufacturing method thereof May. 21, 2013
8431829 Printed wiring board and method for manufacturing the same Apr. 30, 2013
8432708 Motherboard assembly having serial advanced technology attachment dual in-line memory module Apr. 30, 2013
8427839 Arrangement comprising an optoelectronic component Apr. 23, 2013
8400780 Stacked microfeature devices Mar. 19, 2013
8400781 Using interrupted through-silicon-vias in integrated circuits adapted for stacking Mar. 19, 2013
8391022 Multi-function mezzanine board alignment and mounting device, with integrated handle Mar. 5, 2013
8391018 Semiconductor die-based packaging interconnect Mar. 5, 2013
8389870 Coreless multi-layer circuit substrate with minimized pad capacitance Mar. 5, 2013
8379400 Interposer mounted wiring board and electronic component device Feb. 19, 2013
8379406 Package and method for manufacturing the same Feb. 19, 2013
8379409 Touch panel Feb. 19, 2013
8362366 Circuit board, its manufacturing method, and joint box using circuit board Jan. 29, 2013
8355262 Electronic component built-in substrate and method of manufacturing electronic component built-in substrate Jan. 15, 2013
8345441 Stub minimization for multi-die wirebond assemblies with parallel windows Jan. 1, 2013
8339797 Package substrate Dec. 25, 2012
8335086 Semiconductor module Dec. 18, 2012
8315068 Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same Nov. 20, 2012
8309397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof Nov. 13, 2012
8310835 Systems and methods for providing vias through a modular component Nov. 13, 2012
8310841 Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same Nov. 13, 2012

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