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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/783
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > Having semiconductive device
Description: Subject matter wherein a component connected to the printed circuit board is an active solid state device having no structural details to an active solid state device.










Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
8711572 Circuit board having semiconductor chip embedded therein Apr. 29, 2014
8692129 Package-substrate-mounting printed wiring board and method for manufacturing the same Apr. 8, 2014
8683684 Method of manufacturing component embedded printed circuit board Apr. 1, 2014
8681510 Circuit board Mar. 25, 2014
8670243 Semiconductor memory device Mar. 11, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8669477 Wiring substrate and method for manufacturing the same Mar. 11, 2014
8659909 Method for reducing loadline impedance in a system Feb. 25, 2014
8654542 High-frequency switch module Feb. 18, 2014
8638565 Arrangement of optoelectronic components Jan. 28, 2014
8598465 Hermetic circuit ring for BCB WSA circuits Dec. 3, 2013
8593826 Memory module, memory system having the memory module, and method for manufacturing the memory module Nov. 26, 2013
8583043 High-frequency device and wireless IC device Nov. 12, 2013
8582314 Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure Nov. 12, 2013
8576567 Semiconductor device and display apparatus Nov. 5, 2013
8576576 Display apparatus and driving chip mounting film in the display apparatus Nov. 5, 2013
8569633 Feedthrough for microelectromechanical system Oct. 29, 2013
8553426 Circuit board with higher current Oct. 8, 2013
8537553 Devices having anisotropic conductivity heatsinks, and methods of making thereof Sep. 17, 2013
8526199 Semiconductor device Sep. 3, 2013
8524595 Semiconductor package structures Sep. 3, 2013
8526194 Anti-ultraviolet memory device and fabrication method thereof Sep. 3, 2013
8519265 Power module Aug. 27, 2013
8513534 Semiconductor device and bonding material Aug. 20, 2013
8503188 Mountable electronic circuit module Aug. 6, 2013
8503189 Pb-free solder-connected structure and electronic device Aug. 6, 2013
8498125 Instrumentation package in a downhole tool string component Jul. 30, 2013
8498131 Interconnect structure Jul. 30, 2013
8467193 Electronic control unit Jun. 18, 2013
8466997 Fan-out wafer level package for an optical sensor and method of manufacture thereof Jun. 18, 2013
8455770 Method of fabricating wiring board and method of fabricating semiconductor device Jun. 4, 2013
8456850 Memory cards and electronic machines Jun. 4, 2013
8456856 Integrated circuit chip using top post-passivation technology and bottom structure technology Jun. 4, 2013
8452989 Providing security to an electronic device May. 28, 2013
8446735 Semiconductor package May. 21, 2013
8446734 Circuit board and mounting structure May. 21, 2013
8436255 Fan-out wafer level package with polymeric layer for high reliability May. 7, 2013
8437143 Electronic device with rotatable keypad May. 7, 2013
8432704 Clip for BIOS chip Apr. 30, 2013
8432707 Card design with fully buffered memory modules and the use of a chip between two consecutive modules Apr. 30, 2013
8427840 Multi-chip module Apr. 23, 2013
8426745 Thin film resistor Apr. 23, 2013
8426983 Semiconductor device Apr. 23, 2013
8420945 Package substrate, semiconductor package having the package substrate Apr. 16, 2013
8415565 Multilayer circuit substrate Apr. 9, 2013
8416578 Manufacturing method for an electronic substrate Apr. 9, 2013
8411459 Interposer-on-glass package structures Apr. 2, 2013
8411450 Electronic device package, module, and electronic device Apr. 2, 2013
8400777 Electronic member, electronic part and manufacturing method therefor Mar. 19, 2013
8400779 Semiconductor package having multi pitch ball land Mar. 19, 2013

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