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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
6529022 Wafer testing interposer for a conventional package Mar. 4, 2003
6525275 Multilayer printed circuit boards Feb. 25, 2003
6518512 Structure for inspecting electrical component alignment Feb. 11, 2003
6515236 Printed wiring board and manufacturing method of the printed wiring board Feb. 4, 2003
6512180 Printed-wiring board, method for identifying same, and method for manufacturing same Jan. 28, 2003
6512181 Multilayer type printed-wiring board and method of measuring impedance of multilayer type printed-wiring board Jan. 28, 2003
6512187 Lattice-shaped circuit board Jan. 28, 2003
6512681 Method and arrangement for implementing EMC shielding in electronic device, and circuit board of electronic device Jan. 28, 2003
6512680 Semiconductor package Jan. 28, 2003
6507122 Pre-bond encapsulation of area array terminated chip and wafer scale packages Jan. 14, 2003
6504241 Stackable semiconductor device and method for manufacturing the same Jan. 7, 2003
6504239 Semiconductor device having dummy pattern that relieves stress Jan. 7, 2003
6501664 Decoupling structure and method for printed circuit board component Dec. 31, 2002
6498308 Semiconductor module Dec. 24, 2002
6498306 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder Dec. 24, 2002
6495768 Tape carrier package and method of fabricating the same Dec. 17, 2002
6492598 Printed circuit board assembly and method for making a printed circuit board assembly Dec. 10, 2002
6489574 Printed-wiring board Dec. 3, 2002
6490170 Package substrate Dec. 3, 2002
6489680 Semiconductor device Dec. 3, 2002
6486412 Wiring board, method for producing same, display device, and electronic device Nov. 26, 2002
6483714 Multilayered wiring board Nov. 19, 2002
6483039 Substrate of semiconductor package Nov. 19, 2002
6479755 Printed circuit board and pad apparatus having a solder deposit Nov. 12, 2002
6479758 Wiring board, semiconductor package and semiconductor device Nov. 12, 2002
6477058 Integrated circuit device package including multiple stacked components Nov. 5, 2002
6473311 Gate area relief strip for a molded I/C package Oct. 29, 2002
6472607 Electronic circuit board with known flow soldering warp direction Oct. 29, 2002
6469907 Packaging for power and other circuitry Oct. 22, 2002
6465745 Micro-BGA beam lead connection Oct. 15, 2002
6462957 High performance orthogonal interconnect architecture without midplane Oct. 8, 2002
6462956 Arrangement for reducing non-uniformity in current flow through various power pins within a printed wiring board connector for a removable module Oct. 8, 2002
6459049 High density signal routing Oct. 1, 2002
6457234 Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond Oct. 1, 2002
6460104 SCSI connector Oct. 1, 2002
6452808 Electronics module having power components, and a method of manufacture Sep. 17, 2002
6452115 Circuit pattern for multi-layer circuit board for mounting electronic parts Sep. 17, 2002
6448505 Substrate for mounting an optical component, a method for producing the same, and an optical module using the same Sep. 10, 2002
6448640 Ball array layout in chip assembly Sep. 10, 2002
6448639 Substrate having specific pad distribution Sep. 10, 2002
6444925 Press-fit pin connection checking method and system Sep. 3, 2002
6441479 System-on-a-chip with multi-layered metallized through-hole interconnection Aug. 27, 2002
6437985 Disposable electronic chip device and process of manufacture Aug. 20, 2002
6434009 Power distribution module with reversible relay footprint Aug. 13, 2002
6434016 Apparatus for interconnecting multiple devices on a circuit board Aug. 13, 2002
6429385 Non-continuous conductive layer for laminated substrates Aug. 6, 2002
6421248 Chip card module Jul. 16, 2002
6418490 Electronic circuit interconnection system using a virtual mirror cross over package Jul. 9, 2002
6410937 Integrated circuit chip carrier Jun. 25, 2002
6411519 Package substrate Jun. 25, 2002

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18










 
 
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