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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
6853557 Multi-channel memory architecture Feb. 8, 2005
6853086 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument Feb. 8, 2005
6842346 Semiconductor device Jan. 11, 2005
6835897 Warpage preventing substrate Dec. 28, 2004
6833509 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder Dec. 21, 2004
6833513 Crosstalk reduction in a PWB connector footprint Dec. 21, 2004
6831233 Chip package with degassing holes Dec. 14, 2004
6831234 Multilayer printed circuit board Dec. 14, 2004
6822321 Packaged RF power transistor having RF bypassing/output matching network Nov. 23, 2004
6822875 Assembly of opto-electronic module with improved heat sink Nov. 23, 2004
6818838 PCB component placement and trace routing therebetween Nov. 16, 2004
6815619 Circuit board Nov. 9, 2004
6816385 Compliant laminate connector Nov. 9, 2004
6812409 Layer allocating apparatus for multi-layer circuit board Nov. 2, 2004
6813154 Reversible heat sink packaging assembly for an integrated circuit Nov. 2, 2004
6804122 Self-stabilizing card edge terminal Oct. 12, 2004
6803664 Semiconductor package Oct. 12, 2004
6800939 Apparatus and method for providing low-loss transmission lines in interconnected mesh plane systems Oct. 5, 2004
6801438 Electrical circuit and method of formation Oct. 5, 2004
6794582 Mask for screen printing, the method for producing same and circuit board produced by screen printing with such mask Sep. 21, 2004
6791186 Mounting substrate and structure having semiconductor element mounted on substrate Sep. 14, 2004
6788548 Adapter apparatus for memory modules Sep. 7, 2004
6788546 Multi-chip module Sep. 7, 2004
6788073 Data processing systems having mismatched impedance components Sep. 7, 2004
6787984 Wiring substrate, manufacturing method therefor, and image display device Sep. 7, 2004
6787920 Electronic circuit board manufacturing process and associated apparatus Sep. 7, 2004
6784526 Integrated circuit device module Aug. 31, 2004
6782615 Method of surface-mounting electronic components Aug. 31, 2004
6778407 Portable data carrier Aug. 17, 2004
6778403 Wiring board having terminal Aug. 17, 2004
6770980 Semiconductor device having semiconductor element packaged on interposer Aug. 3, 2004
6759597 Wire bonding to dual metal covered pad surfaces Jul. 6, 2004
6753595 Substrates for semiconductor devices with shielding for NC contacts Jun. 22, 2004
6747878 Data I/O management system and method Jun. 8, 2004
6740821 Selectively configurable circuit board May. 25, 2004
6736306 Semiconductor chip package comprising enhanced pads May. 18, 2004
6735090 High-speed memory device, socket mounting structure for mounting a high-speed memory device and mounting method of mounting high-speed memory device May. 11, 2004
6735651 Multi-chip module having chips coupled in a ring May. 11, 2004
6730860 Electronic assembly and a method of constructing an electronic assembly May. 4, 2004
6731013 Wiring substrate, semiconductor device and package stack semiconductor device May. 4, 2004
6729024 Method of forming a non-continuous conductive layer for laminated substrates May. 4, 2004
6731513 Shielded multi-conductor interconnect bus for MEMS May. 4, 2004
6727437 Non-continuous conductive layer for laminated substrates Apr. 27, 2004
6724082 Systems having modules with selectable on die terminations Apr. 20, 2004
6721188 Power supply for low profile equipment housing Apr. 13, 2004
6717825 Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other Apr. 6, 2004
6717819 Solderable flexible adhesive interposer as for an electronic package, and method for making same Apr. 6, 2004
6714421 Flip chip package substrate Mar. 30, 2004
6711027 Modules having paths of different impedances Mar. 23, 2004
6711025 Combination device of the IC connection device and the main board Mar. 23, 2004

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18










 
 
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