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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5355283 |
Ball grid array with via interconnection |
Oct. 11, 1994 |
| 5346748 |
Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding |
Sep. 13, 1994 |
| 5345365 |
Interconnection system for high performance electronic hybrids |
Sep. 6, 1994 |
| 5315484 |
Printed circuit board and method for attaching movable switch thereto |
May. 24, 1994 |
| 5315485 |
Variable size capture pads for multilayer ceramic substrates and connectors therefor |
May. 24, 1994 |
| 5311407 |
Printed circuit based for mounted semiconductors and other electronic components |
May. 10, 1994 |
| 5311401 |
Stacked chip assembly and manufacturing method therefor |
May. 10, 1994 |
| 5303116 |
Surge protector |
Apr. 12, 1994 |
| 5289346 |
Peripheral to area adapter with protective bumper for an integrated circuit chip |
Feb. 22, 1994 |
| 5281151 |
Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module |
Jan. 25, 1994 |
| 5280414 |
Au-Sn transient liquid bonding in high performance laminates |
Jan. 18, 1994 |
| 5268536 |
Method of connecting a lead of a mounting part with a land of a circuit substrate |
Dec. 7, 1993 |
| 5264664 |
Programmable chip to circuit board connection |
Nov. 23, 1993 |
| 5258890 |
Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways |
Nov. 2, 1993 |
| 5251108 |
Laminated electronic device with staggered holes in the conductors |
Oct. 5, 1993 |
| 5251107 |
Semiconductor package |
Oct. 5, 1993 |
| 5245750 |
Method of connecting a spaced IC chip to a conductor and the article thereby obtained |
Sep. 21, 1993 |
| 5243140 |
Direct distribution repair and engineering change system |
Sep. 7, 1993 |
| 5241133 |
Leadless pad array chip carrier |
Aug. 31, 1993 |
| 5241455 |
L-shaped channel wiring method |
Aug. 31, 1993 |
| 5239127 |
Electrical interconnect apparatus |
Aug. 24, 1993 |
| 5239126 |
High-frequency circuit package |
Aug. 24, 1993 |
| 5224022 |
Reroute strategy for high density substrates |
Jun. 29, 1993 |
| 5220490 |
Substrate interconnect allowing personalization using spot surface links |
Jun. 15, 1993 |
| 5173574 |
Soldering connector and method for manufacturing an electric circuit with this soldering connector |
Dec. 22, 1992 |
| 5170337 |
Low-inductance package for multiple paralleled devices operating at high frequency |
Dec. 8, 1992 |
| 5164888 |
Method and structure for implementing dynamic chip burn-in |
Nov. 17, 1992 |
| 5159536 |
Panel board |
Oct. 27, 1992 |
| 5155577 |
Integrated circuit carriers and a method for making engineering changes in said carriers |
Oct. 13, 1992 |
| 5151771 |
High lead count circuit board for connecting electronic components to an external circuit |
Sep. 29, 1992 |
| 5131140 |
Method for evaluating plane splits in printed circuit boards |
Jul. 21, 1992 |
| 5132864 |
Printed circuit board |
Jul. 21, 1992 |
| 5130894 |
Three-dimensional circuit modules |
Jul. 14, 1992 |
| 5091822 |
Radial type of parallel system bus structure with printed, twisted conductor lines |
Feb. 25, 1992 |
| 5068596 |
Internal grounding arrangement in a switching power converter |
Nov. 26, 1991 |
| 5067042 |
Wiring board for flat package type integrated circuit device |
Nov. 19, 1991 |
| 5065502 |
Method for modifying electrical performance characteristics of circuit paths on circuit panels |
Nov. 19, 1991 |
| 5061989 |
Mechanical translator for semiconductor chips |
Oct. 29, 1991 |
| 5060116 |
Electronics system with direct write engineering change capability |
Oct. 22, 1991 |
| 5056217 |
Method for manufacturing semiconductor elements equipped with leads |
Oct. 15, 1991 |
| 5043859 |
Half bridge device package, packaged devices and circuits |
Aug. 27, 1991 |
| 5042147 |
Method of preparing surface-mounted wiring board |
Aug. 27, 1991 |
| 5038251 |
Electronic apparatus and a method for manufacturing the same |
Aug. 6, 1991 |
| 5015917 |
Adaptor for small fluorescent tubes |
May. 14, 1991 |
| 5012390 |
Mounting and connection system for electrical communications equipment |
Apr. 30, 1991 |
| 5012389 |
Board wiring pattern for a high density memory module |
Apr. 30, 1991 |
| 5010448 |
Printed circuit board |
Apr. 23, 1991 |
| 4994902 |
Semiconductor devices and electronic system incorporating them |
Feb. 19, 1991 |
| 4980802 |
Flexible printed circuit |
Dec. 25, 1990 |
| 4912603 |
High density printed wiring board |
Mar. 27, 1990 |
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