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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
5355283 Ball grid array with via interconnection Oct. 11, 1994
5346748 Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding Sep. 13, 1994
5345365 Interconnection system for high performance electronic hybrids Sep. 6, 1994
5315484 Printed circuit board and method for attaching movable switch thereto May. 24, 1994
5315485 Variable size capture pads for multilayer ceramic substrates and connectors therefor May. 24, 1994
5311407 Printed circuit based for mounted semiconductors and other electronic components May. 10, 1994
5311401 Stacked chip assembly and manufacturing method therefor May. 10, 1994
5303116 Surge protector Apr. 12, 1994
5289346 Peripheral to area adapter with protective bumper for an integrated circuit chip Feb. 22, 1994
5281151 Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module Jan. 25, 1994
5280414 Au-Sn transient liquid bonding in high performance laminates Jan. 18, 1994
5268536 Method of connecting a lead of a mounting part with a land of a circuit substrate Dec. 7, 1993
5264664 Programmable chip to circuit board connection Nov. 23, 1993
5258890 Device for connecting the connection pins of an integrated circuit mounted in a dual-in-line (DIL) package to printed circuitry on a printed circuit board in n different ways Nov. 2, 1993
5251108 Laminated electronic device with staggered holes in the conductors Oct. 5, 1993
5251107 Semiconductor package Oct. 5, 1993
5245750 Method of connecting a spaced IC chip to a conductor and the article thereby obtained Sep. 21, 1993
5243140 Direct distribution repair and engineering change system Sep. 7, 1993
5241133 Leadless pad array chip carrier Aug. 31, 1993
5241455 L-shaped channel wiring method Aug. 31, 1993
5239127 Electrical interconnect apparatus Aug. 24, 1993
5239126 High-frequency circuit package Aug. 24, 1993
5224022 Reroute strategy for high density substrates Jun. 29, 1993
5220490 Substrate interconnect allowing personalization using spot surface links Jun. 15, 1993
5173574 Soldering connector and method for manufacturing an electric circuit with this soldering connector Dec. 22, 1992
5170337 Low-inductance package for multiple paralleled devices operating at high frequency Dec. 8, 1992
5164888 Method and structure for implementing dynamic chip burn-in Nov. 17, 1992
5159536 Panel board Oct. 27, 1992
5155577 Integrated circuit carriers and a method for making engineering changes in said carriers Oct. 13, 1992
5151771 High lead count circuit board for connecting electronic components to an external circuit Sep. 29, 1992
5131140 Method for evaluating plane splits in printed circuit boards Jul. 21, 1992
5132864 Printed circuit board Jul. 21, 1992
5130894 Three-dimensional circuit modules Jul. 14, 1992
5091822 Radial type of parallel system bus structure with printed, twisted conductor lines Feb. 25, 1992
5068596 Internal grounding arrangement in a switching power converter Nov. 26, 1991
5067042 Wiring board for flat package type integrated circuit device Nov. 19, 1991
5065502 Method for modifying electrical performance characteristics of circuit paths on circuit panels Nov. 19, 1991
5061989 Mechanical translator for semiconductor chips Oct. 29, 1991
5060116 Electronics system with direct write engineering change capability Oct. 22, 1991
5056217 Method for manufacturing semiconductor elements equipped with leads Oct. 15, 1991
5043859 Half bridge device package, packaged devices and circuits Aug. 27, 1991
5042147 Method of preparing surface-mounted wiring board Aug. 27, 1991
5038251 Electronic apparatus and a method for manufacturing the same Aug. 6, 1991
5015917 Adaptor for small fluorescent tubes May. 14, 1991
5012390 Mounting and connection system for electrical communications equipment Apr. 30, 1991
5012389 Board wiring pattern for a high density memory module Apr. 30, 1991
5010448 Printed circuit board Apr. 23, 1991
4994902 Semiconductor devices and electronic system incorporating them Feb. 19, 1991
4980802 Flexible printed circuit Dec. 25, 1990
4912603 High density printed wiring board Mar. 27, 1990

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18










 
 
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