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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
5777851 Circuit board having a wiring structure buried in a resin layer Jul. 7, 1998
5774340 Planar redistribution structure and printed wiring device Jun. 30, 1998
5771157 Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads Jun. 23, 1998
5771158 Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device Jun. 23, 1998
5768105 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board Jun. 16, 1998
5764491 Power distribution system for a multi-layer circuit board having a component layer, a ground layer, and an insulation layer Jun. 9, 1998
5764489 Apparatus for controlling the impedance of high speed signals on a printed circuit board Jun. 9, 1998
5764488 Printed circuit board having a dual pattern footprint for receiving one of two component packages Jun. 9, 1998
5764485 Multi-layer PCB blockade-via pad-connection Jun. 9, 1998
5761049 Inductance cancelled condenser implemented apparatus Jun. 2, 1998
5761051 Multi-layer circuit board having a supply bus and discrete voltage supply planes Jun. 2, 1998
5755580 Universal cable connecting box for vehicles May. 26, 1998
5754410 Multi-chip module with accessible test pads May. 19, 1998
5751554 Testable chip carrier May. 12, 1998
5751557 Printed circuit board having a triple pattern footprint for receiving one of three component packages May. 12, 1998
5748450 BGA package using a dummy ball and a repairing method thereof May. 5, 1998
5744224 Board for mounting semiconductor chip Apr. 28, 1998
5742484 Flexible connector for circuit boards Apr. 21, 1998
5742483 Method for producing circuit board assemblies using surface mount components with finely spaced leads Apr. 21, 1998
5742009 Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the p Apr. 21, 1998
5739588 Semiconductor device Apr. 14, 1998
5737191 Structure and process for mounting semiconductor chip Apr. 7, 1998
5734560 Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap Mar. 31, 1998
5729437 Electronic part including a thin body of molding resin Mar. 17, 1998
5726860 Method and apparatus to reduce cavity size and the bondwire length in three tier PGA packages by interdigitating the VCC/VSS Mar. 10, 1998
5726861 Surface mount component height control Mar. 10, 1998
5712768 Space-saving assemblies for connecting integrated circuits to circuit boards Jan. 27, 1998
5710733 Processor-inclusive memory module Jan. 20, 1998
5706178 Ball grid array integrated circuit package that has vias located within the solder pads of a package Jan. 6, 1998
5703759 Multi-chip electrically reconfigurable module with predominantly extra-package inter-chip connections Dec. 30, 1997
5696667 Backplane for high speed data processing system Dec. 9, 1997
5686699 Semiconductor board providing high signal pin utilization Nov. 11, 1997
5683788 Apparatus for multi-component PCB mounting Nov. 4, 1997
5682297 Dual pattern microprocessor package footprint Oct. 28, 1997
5679929 Anti-bridging pads for printed circuit boards and interconnecting substrates Oct. 21, 1997
5671123 IC card with a discharge pattern and a ground pattern separated from each other Sep. 23, 1997
5671125 Vertical package mounted on both sides of a printed circuit board Sep. 23, 1997
5663870 Printed circuit board for connectors Sep. 2, 1997
5660269 Switch Aug. 26, 1997
5650665 Hybrid integrated circuit device including circuit patterns of different conductivity and circuit elements mounted on an insulating substrate Jul. 22, 1997
5642262 High-density programmable logic device in a multi-chip module package with improved interconnect scheme Jun. 24, 1997
5640308 Field programmable circuit module Jun. 17, 1997
5637835 Automatic test detection of unsoldered thru-hole connector leads Jun. 10, 1997
5636104 Printed circuit board having solder ball mounting groove pads and a ball grid array package using such a board Jun. 3, 1997
5636105 Electronic equipment device having clamps Jun. 3, 1997
5622769 Ceramic circuit board having a thermal conductivity substrate Apr. 22, 1997
5620782 Method of fabricating a flex laminate package Apr. 15, 1997
5613033 Laminated module for stacking integrated circuits Mar. 18, 1997
5608192 Multilayer thin-film wiring board Mar. 4, 1997
5604330 Staggered land pad pattern on substrate for tab interconnection Feb. 18, 1997

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