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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
5912808 Semiconductor component Jun. 15, 1999
5905639 Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds May. 18, 1999
5903442 Hard disk drive and hard disk apparatus having bus and its installing method May. 11, 1999
5903440 Method of forming assemblies of circuit boards in different planes May. 11, 1999
5901044 Mini-module with upwardly directed leads May. 4, 1999
5898574 Self aligning electrical component Apr. 27, 1999
5895554 Alignment method and apparatus for mounting electronic components Apr. 20, 1999
5894410 Perimeter matrix ball grid array circuit package with a populated center Apr. 13, 1999
5889655 Integrated circuit package substrate with stepped solder mask openings Mar. 30, 1999
5877942 Circuit card assembly footprint providing reworkable interconnection paths for use with a surface mount device Mar. 2, 1999
5875102 Eclipse via in pad structure Feb. 23, 1999
5872338 Multilayer board having insulating isolation rings Feb. 16, 1999
5867419 Processor-inclusive memory module Feb. 2, 1999
5864470 Flexible circuit board for ball grid array semiconductor package Jan. 26, 1999
5856913 Multilayer semiconductor device having high packing density Jan. 5, 1999
5847985 Memory modules Dec. 8, 1998
5847936 Optimized routing scheme for an integrated circuit/printed circuit board Dec. 8, 1998
5847935 Electronic circuit chip package Dec. 8, 1998
5847451 Multi-layered printed circuit board, and grid array package adopting the same Dec. 8, 1998
5847931 Contactless integrated circuit card with a conductive polymer antenna Dec. 8, 1998
5844783 Flexible printed circuit harness device and flexible printed circuit used thereof Dec. 1, 1998
5838549 Memory module and an IC card Nov. 17, 1998
5831656 Compact recording apparatus with efficient space utilization Nov. 3, 1998
5831832 Molded plastic ball grid array package Nov. 3, 1998
5825146 Motor drive device Oct. 20, 1998
5825629 Print circuit board product with stencil controlled fine pitch solder formation for fine and coarse pitch component attachment Oct. 20, 1998
5825628 Electronic package with enhanced pad design Oct. 20, 1998
5818699 Multi-chip module and production method thereof Oct. 6, 1998
5815374 Method and apparatus for redirecting certain input/output connections of integrated circuit chip configurations Sep. 29, 1998
5812379 Small diameter ball grid array pad size for improved motherboard routing Sep. 22, 1998
5812378 Microelectronic connector for engaging bump leads Sep. 22, 1998
5808876 Multi-function power distribution system Sep. 15, 1998
5808241 Shielded delay line and method of manufacture Sep. 15, 1998
5808875 Integrated circuit solder-rack interconnect module Sep. 15, 1998
5805424 Microelectronic assemblies including Z-axis conductive films Sep. 8, 1998
5805428 Transistor/resistor printed circuit board layout Sep. 8, 1998
5801927 Ceramic package used for semiconductor chips different in layout of bonding pads Sep. 1, 1998
5796590 Assembly aid for mounting packaged integrated circuit devices to printed circuit boards Aug. 18, 1998
5796589 Ball grid array integrated circuit package that has vias located within the solder pads of a package Aug. 18, 1998
5793098 Package including conductive layers having notches formed Aug. 11, 1998
5790386 High I/O density MLC flat pack electronic component Aug. 4, 1998
5790384 Bare die multiple dies for direct attach Aug. 4, 1998
5784258 Wiring board for supporting an array of imaging chips Jul. 21, 1998
5784264 MCM (Multi Chip Module) carrier with external connection teminals BGA (Ball Grid Array) type matrix array form Jul. 21, 1998
5784260 Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate Jul. 21, 1998
5784262 Arrangement of pads and through-holes for semiconductor packages Jul. 21, 1998
5781413 Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations Jul. 14, 1998
5781415 Semiconductor package and mounting method Jul. 14, 1998
5777853 Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size Jul. 7, 1998
5777277 Printed circuit board Jul. 7, 1998

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