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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
6064113 Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signa May. 16, 2000
6061245 Free standing, three dimensional, multi-chip, carrier package with air flow baffle May. 9, 2000
6061241 Line interface module May. 9, 2000
6061246 Microelectric packages including flexible layers and flexible extensions, and liquid crystal display modules using the same May. 9, 2000
6061248 Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon May. 9, 2000
6060665 Grooved paths for printed wiring board with obstructions May. 9, 2000
6054653 Apparatus for attaching a surface mount component Apr. 25, 2000
6054720 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture Apr. 25, 2000
6052286 Restrained center core anisotropically conductive adhesive Apr. 18, 2000
6043988 Hard disk drive and hard disk apparatus having bus and its installing method Mar. 28, 2000
6040530 Versatile printed circuit board for testing processing reliability Mar. 21, 2000
6040985 Circuit board having general purpose region and programmable region Mar. 21, 2000
6040984 Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels Mar. 21, 2000
6040529 Flexible substrate Mar. 21, 2000
6038135 Wiring board and semiconductor device Mar. 14, 2000
6037547 Via configuration with decreased pitch and/or increased routing space Mar. 14, 2000
6037665 Mounting assembly of integrated circuit device and method for production thereof Mar. 14, 2000
6025997 Chip module for semiconductor chips having arbitrary footprints Feb. 15, 2000
6020561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof Feb. 1, 2000
6018462 Multi-tip module Jan. 25, 2000
6013876 Method and device for electrically connecting circuits to opposite surfaces of a printed circuit board Jan. 11, 2000
6011695 External bus interface printed circuit board routing for a ball grid array integrated circuit package Jan. 4, 2000
6008532 Integrated circuit package having bond fingers with alternate bonding areas Dec. 28, 1999
6002592 Electronic device and method for manufacturing electronic device Dec. 14, 1999
6002172 Substrate structure and method for improving attachment reliability of semiconductor chips and modules Dec. 14, 1999
5998739 Stepped configured circuit board Dec. 7, 1999
5995405 Memory module with flexible serial presence detect configuration Nov. 30, 1999
5986893 Apparatus for controlling the impedance of high speed signals on a printed circuit board Nov. 16, 1999
5982632 Short power signal path integrated circuit package Nov. 9, 1999
5982633 Opposed ball grid array mounting Nov. 9, 1999
5982635 Signal adaptor board for a pin grid array Nov. 9, 1999
5982628 Circuit configuration having a smart card module and a coil connected thereto Nov. 9, 1999
5978230 Battery mounting apparatuses, electronic devices, and methods of forming electrical connections Nov. 2, 1999
5969461 Surface acoustic wave device package and method Oct. 19, 1999
5969924 Spark gap for overcoated printed circuit boards Oct. 19, 1999
5959845 Universal chip carrier connector Sep. 28, 1999
5955704 Optimal PWA high density routing to minimize EMI substrate coupling in a computer system Sep. 21, 1999
5951304 Fanout interconnection pad arrays Sep. 14, 1999
5953216 Method and apparatus for replacing a defective integrated circuit device Sep. 14, 1999
5946195 Semiconductor device, method of making the same and mounting the same, circuit board and flexible substrate Aug. 31, 1999
5943217 Printed circuit board for mounting at least one electronic part Aug. 24, 1999
5936848 Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias Aug. 10, 1999
5930119 Backplane having reduced LC product Jul. 27, 1999
5925445 Printed wiring board Jul. 20, 1999
5923539 Multilayer circuit substrate with circuit repairing function, and electronic circuit device Jul. 13, 1999
5920461 Surface mount power supply device Jul. 6, 1999
5920242 Multielement-type piezoelectric filter with through-hole connection of resonators to a base substrate circuit Jul. 6, 1999
5920464 Reworkable microelectronic multi-chip module Jul. 6, 1999
5917709 Multiple circuit board assembly having an interconnect mechanism that includes a flex connector Jun. 29, 1999
5917156 Circuit board having electrodes and pre-deposit solder receiver Jun. 29, 1999

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