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Class Information
Number: 361/777
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > By specific pattern on board
Description: Subject matter wherein the lead structure provided for facilitating connection comprises a specific geometric arrangement of printed conductors on the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/778 Cross-connected 227
361/779 With specific connection material 290


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18

Patent Number Title Of Patent Date Issued
6407460 Multilayer circuit board Jun. 18, 2002
6407930 Structure of printed circuit board with stacked daughter board Jun. 18, 2002
6403896 Substrate having specific pad distribution Jun. 11, 2002
6400575 Integrated circuits packaging system and method Jun. 4, 2002
6396000 Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board May. 28, 2002
6388886 Semiconductor memory module and module system May. 14, 2002
6384346 Trace layout of a printed circuit board with AGP and PCI slots May. 7, 2002
6384706 Multilayer printed board with a double plane spiral interconnection structure May. 7, 2002
6379772 Avoiding polymer fill of alignment sites Apr. 30, 2002
6377464 Multiple chip module with integrated RF capabilities Apr. 23, 2002
6373139 Layout for a ball grid array Apr. 16, 2002
6373709 Flexible wiring board Apr. 16, 2002
6370033 Electronic device having printed circuit board joined to cavity resonance filter Apr. 9, 2002
6370029 Method and system for creating and using an electrostatic discharge (ESD) protected logotype contact module with a smart card Apr. 9, 2002
6366466 Multi-layer printed circuit board with signal traces of varying width Apr. 2, 2002
6362997 Memory system for use on a circuit board in which the number of loads are minimized Mar. 26, 2002
6356451 Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus Mar. 12, 2002
6346679 Substrate on which ball grid array type electrical part is mounted and method for mounting ball grid array type electrical part on substrate Feb. 12, 2002
6347041 Incremental phase correcting mechanisms for differential signals to decrease electromagnetic emissions Feb. 12, 2002
6344974 Printed circuit board and method of producing same Feb. 5, 2002
6340798 Printed circuit board with reduced crosstalk noise and method of forming wiring lines on a board to form such a printed circuit board Jan. 22, 2002
6339534 Compliant leads for area array surface mounted components Jan. 15, 2002
6333472 Reduction of crosstalk in data transmission system Dec. 25, 2001
6329608 Key-shaped solder bumps and under bump metallurgy Dec. 11, 2001
6326797 Apparatus and method for evaluating printed circuit board assembly manufacturing processes Dec. 4, 2001
6327168 Single-source or single-destination signal routing through identical electronics module Dec. 4, 2001
6324068 Electronic component device, and main board for circuit boards Nov. 27, 2001
6320137 Flexible circuit with coverplate layer and overlapping protective layer Nov. 20, 2001
6320139 Reflow selective shorting Nov. 20, 2001
6320753 Integrated circuit board combining external contact zones and an antenna, and process for manufacturing such a board Nov. 20, 2001
6320757 Electronic package Nov. 20, 2001
6316738 Printed wiring board and manufacturing method thereof Nov. 13, 2001
6316736 Anti-bridging solder ball collection zones Nov. 13, 2001
6313747 Resonant tag Nov. 6, 2001
6313998 Circuit board assembly having a three dimensional array of integrated circuit packages Nov. 6, 2001
6313413 Wire structure of substrate for layout detection Nov. 6, 2001
6303871 Degassing hole design for olga trace impedance Oct. 16, 2001
6303878 Mounting structure of electronic component on substrate board Oct. 16, 2001
6300577 Film carrier and method of burn-in testing Oct. 9, 2001
6301121 Direct-chip-attach (DCA) multiple chip module (MCM) with repair-chip ready site to simplify assembling and testing process Oct. 9, 2001
6297458 Printed circuit board and method for evaluating the inner layer hole registration process capability of the printed circuit board manufacturing process Oct. 2, 2001
6297965 Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board Oct. 2, 2001
6294742 Apparatus and method for adapting surface mount solder pad for heat sink function Sep. 25, 2001
6291775 Flip chip bonding land waving prevention pattern Sep. 18, 2001
6288904 Chip module, in particular for implantation in a smart card body Sep. 11, 2001
6288346 System and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board Sep. 11, 2001
6285560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified Sep. 4, 2001
6274824 Method of arranging signal and destination pads to provide multiple signal/destination connection combinations Aug. 14, 2001
6275158 Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component Aug. 14, 2001
6268568 Printed circuit board with oval solder ball lands for BGA semiconductor packages Jul. 31, 2001

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