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Class Information
Number: 361/773
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > With specific lead configuration > Shaped lead on components
Description: Subject matter wherein the connection wire is located on the components.










Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8631706 Noise suppressor for semiconductor packages Jan. 21, 2014
8633408 Miniature housing and support arrangement having at least one miniature housing Jan. 21, 2014
8619432 Implementing high-speed signaling via dedicated printed circuit-board media Dec. 31, 2013
8547701 Electronics module and method for manufacturing the same Oct. 1, 2013
8513819 Low loop wire bonding Aug. 20, 2013
8472208 Submount and method of manufacturing the same Jun. 25, 2013
8472205 Adaptive printed circuit board connector Jun. 25, 2013
8379402 Wiring board having lead pin, and lead pin Feb. 19, 2013
8355262 Electronic component built-in substrate and method of manufacturing electronic component built-in substrate Jan. 15, 2013
8345441 Stub minimization for multi-die wirebond assemblies with parallel windows Jan. 1, 2013
8315065 Self-locking features in a multi-chip module Nov. 20, 2012
8310838 Electric drive with a circuit board Nov. 13, 2012
8304665 Package substrate having landless conductive traces Nov. 6, 2012
8279028 Electromagnetic relay Oct. 2, 2012
8274798 Carrier substrate and method for making the same Sep. 25, 2012
8212156 Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction Jul. 3, 2012
8183607 Semiconductor device May. 22, 2012
8159827 Circuit board and method of mounting electronic component on printed board Apr. 17, 2012
8159825 Method for fabrication of electrical contacts to superconducting circuits Apr. 17, 2012
8125058 Faraday cage for circuitry using substrates Feb. 28, 2012
8116089 Method and apparatus for securing a magnetic component to a printed circuit board for soldering Feb. 14, 2012
8081485 Component assembly Dec. 20, 2011
8067779 Light emitting device with a recess lead portion Nov. 29, 2011
8059420 Surface mountable device Nov. 15, 2011
8058720 Semiconductor package Nov. 15, 2011
7989945 Spring connector for making electrical contact at semiconductor scales Aug. 2, 2011
7985991 MOSFET package Jul. 26, 2011
7978479 WLAN SiP module Jul. 12, 2011
7944710 Termination apparatus and method for planar components on printed circuit boards May. 17, 2011
7916496 Printed circuit board and electronic apparatus having printed circuit board Mar. 29, 2011
7902658 Integrated circuit having wide power lines Mar. 8, 2011
7884288 Screened housing with press-fit pins and method for production thereof Feb. 8, 2011
7885083 Input transient protection for electronic devices Feb. 8, 2011
7821115 Tape carrier package including a heat dissipation element Oct. 26, 2010
7813142 Portable electronic device with conducting pole Oct. 12, 2010
7777309 Amplifier chip mounted on a lead frame Aug. 17, 2010
7766499 Light source unit, backlight unit and liquid crystal display including the same, and method thereof Aug. 3, 2010
7755911 Printed wiring board Jul. 13, 2010
7742313 Stacked microfeature devices Jun. 22, 2010
7718902 Z interconnect structure and method May. 18, 2010
7684205 System and method of using a compliant lead interposer Mar. 23, 2010
7642467 Method for fabrication of separators for electrode pairs in diodes Jan. 5, 2010
7629677 Semiconductor package with inner leads exposed from an encapsulant Dec. 8, 2009
7618165 LED lamp unit Nov. 17, 2009
7538441 Chip with power and signal pads connected to power and signal lines on substrate May. 26, 2009
7532484 Electronic component assembly May. 12, 2009
7449370 Production process for manufacturing such semiconductor package Nov. 11, 2008
7425756 Semiconductor device and electronic device Sep. 16, 2008
7400002 MOSFET package Jul. 15, 2008
7394146 MOSFET package Jul. 1, 2008

1 2 3 4 5 6 7 8










 
 
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