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Class Information
Number: 361/772
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > With specific lead configuration
Description: Subject matter wherein a particular connection wire structure is provided for facilitating connection between the components and the printed circuit board.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7473854 |
Printed circuit board |
Jan. 6, 2009 |
| 7471520 |
Impedance matching external component connections with uncompensated leads |
Dec. 30, 2008 |
| 7449370 |
Production process for manufacturing such semiconductor package |
Nov. 11, 2008 |
| 7439622 |
Semiconductor device |
Oct. 21, 2008 |
| 7433202 |
Electronic device and method of manufacturing thereof |
Oct. 7, 2008 |
| 7429787 |
Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides |
Sep. 30, 2008 |
| 7426118 |
Printed wiring board |
Sep. 16, 2008 |
| 7417197 |
Direct contact power transfer pad and method of making same |
Aug. 26, 2008 |
| 7414858 |
Method of manufacturing an electronic device |
Aug. 19, 2008 |
| 7408423 |
Semiconductor device and adjusting method for semiconductor device |
Aug. 5, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7368665 |
Circuit board and a power module employing the same |
May. 6, 2008 |
| 7362098 |
Magnetic field sensor |
Apr. 22, 2008 |
| 7355862 |
Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
Apr. 8, 2008 |
| 7355283 |
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
Apr. 8, 2008 |
| 7348497 |
Mounting structure for electronic components |
Mar. 25, 2008 |
| 7342182 |
Printed board |
Mar. 11, 2008 |
| 7339797 |
Chip mount, methods of making same and methods for mounting chips thereon |
Mar. 4, 2008 |
| 7320604 |
Electronic circuit module and method for fabrication thereof |
Jan. 22, 2008 |
| 7316065 |
Method for fabricating a plurality of elastic probes in a row |
Jan. 8, 2008 |
| 7312404 |
Conductive contamination reliability solution for assembling substrates |
Dec. 25, 2007 |
| 7301106 |
Image forming apparatus and electronic apparatus |
Nov. 27, 2007 |
| 7301779 |
Electronic chip and electronic chip assembly |
Nov. 27, 2007 |
| 7291791 |
Resin substrate |
Nov. 6, 2007 |
| 7291788 |
Circuit substrate |
Nov. 6, 2007 |
| 7288723 |
Circuit board including isolated signal transmission channels |
Oct. 30, 2007 |
| 7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Oct. 9, 2007 |
| 7280370 |
Electronic package and circuit board having segmented contact pads |
Oct. 9, 2007 |
| 7245504 |
Power distribution system |
Jul. 17, 2007 |
| 7215555 |
Bus bar structure plate and producing method of circuit structure body by using of the same |
May. 8, 2007 |
| 7190328 |
Three-dimensional display |
Mar. 13, 2007 |
| 7167377 |
Circuit-constituting unit and method of producing the same |
Jan. 23, 2007 |
| 7141876 |
Semiconductor device |
Nov. 28, 2006 |
| 7138673 |
Semiconductor package having encapsulated chip attached to a mounting plate |
Nov. 21, 2006 |
| 7132735 |
Integrated circuit package with lead fingers extending into a slot of a die paddle |
Nov. 7, 2006 |
| 7119430 |
Spacer for mounting a chip package to a substrate |
Oct. 10, 2006 |
| 7109572 |
Quad flat no lead (QFN) grid array package |
Sep. 19, 2006 |
| 7095621 |
Leadless leadframe electronic package and sensor module incorporating same |
Aug. 22, 2006 |
| 7079398 |
Sash for land grid arrays |
Jul. 18, 2006 |
| 7067742 |
Connection component with peelable leads |
Jun. 27, 2006 |
| 7068520 |
Circuit board made of resin with pin |
Jun. 27, 2006 |
| 7061771 |
Mechanism to cross high-speed differential pairs |
Jun. 13, 2006 |
| 7045902 |
Circuitized substrate for fixing solder beads on pads |
May. 16, 2006 |
| 7038321 |
Method of attaching a flip chip device and circuit assembly formed thereby |
May. 2, 2006 |
| 6989591 |
Method for making an integrated circuit of the surface-mount type and resulting circuit |
Jan. 24, 2006 |
| 6984883 |
Semiconductor power module |
Jan. 10, 2006 |
| 6958528 |
Leads under chip IC package |
Oct. 25, 2005 |
| 6939740 |
Method of fabricating an encapsulated semiconductor device with partly exposed leads |
Sep. 6, 2005 |
| 6937477 |
Structure of gold fingers |
Aug. 30, 2005 |
| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
Aug. 23, 2005 |
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