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Class Information
Number: 361/772
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > With specific lead configuration
Description: Subject matter wherein a particular connection wire structure is provided for facilitating connection between the components and the printed circuit board.










Sub-classes under this class:

Class Number Class Name Patents
361/775 Busbar 252
361/776 Flexible connecting lead 298
361/774 Shaped lead on board 498
361/773 Shaped lead on components 386


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8705249 Method for manufacture of a fuse for a printed circuit board Apr. 22, 2014
8701971 Printed board and bus bar assembly Apr. 22, 2014
8687378 High-frequency module Apr. 1, 2014
8674488 Light emitting diode (LED) packages Mar. 18, 2014
8625302 Electronic device and port connector thereof Jan. 7, 2014
8611101 Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly Dec. 17, 2013
8598693 Die pad package with a concave portion in the sealing resin Dec. 3, 2013
8581106 Submount Nov. 12, 2013
8570715 Load center with branch-level current sensors integrated into power buses on a unit with on-board circuit breaker mounts Oct. 29, 2013
8547706 Electronic component, board unit, and information-processing device Oct. 1, 2013
8531821 System for securing a semiconductor device to a printed circuit board Sep. 10, 2013
8508952 Electrical assembly Aug. 13, 2013
8487441 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Jul. 16, 2013
8477511 Package structure and electronic apparatus of the same Jul. 2, 2013
8472208 Submount and method of manufacturing the same Jun. 25, 2013
8462510 Board-level package with tuned mass damping structure Jun. 11, 2013
8440915 Device mounting board and semiconductor module May. 14, 2013
8441808 Interposer with microspring contacts May. 14, 2013
8421208 Electrode pad having a recessed portion Apr. 16, 2013
8400778 Layout schemes and apparatus for multi-phase power switch-mode voltage regulator Mar. 19, 2013
8400780 Stacked microfeature devices Mar. 19, 2013
8402406 Controlling plating stub reflections in a chip package Mar. 19, 2013
8390041 High efficiency module Mar. 5, 2013
8383952 Printed compatible designs and layout schemes for printed electronics Feb. 26, 2013
8385082 Electrical connection arrangement having PCB with contacts received therein Feb. 26, 2013
8379402 Wiring board having lead pin, and lead pin Feb. 19, 2013
8373075 Implantable co-fired electrical feedthroughs Feb. 12, 2013
8350159 Printed circuit board and method of manufacturing the same Jan. 8, 2013
8345441 Stub minimization for multi-die wirebond assemblies with parallel windows Jan. 1, 2013
8314479 Leadframe package with recessed cavity for LED Nov. 20, 2012
8315065 Self-locking features in a multi-chip module Nov. 20, 2012
8310838 Electric drive with a circuit board Nov. 13, 2012
8300421 Electronic component and method of manufacturing electronic component Oct. 30, 2012
8300423 Stackable treated via package and method Oct. 30, 2012
8294042 Connector and manufacturing method thereof Oct. 23, 2012
8289727 Package substrate Oct. 16, 2012
8274798 Carrier substrate and method for making the same Sep. 25, 2012
8270178 Active device array substrate Sep. 18, 2012
8243465 Semiconductor device with additional power supply paths Aug. 14, 2012
8243468 Low-thickness electronic module comprising a stack of electronic packages provided with connection balls Aug. 14, 2012
8238111 Printed circuit board Aug. 7, 2012
8232480 Interconnect pattern for high performance interfaces Jul. 31, 2012
8233288 Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board Jul. 31, 2012
8203848 Circuit device and method of manufacturing the same Jun. 19, 2012
8179693 Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements May. 15, 2012
8174841 Adaptive interconnect structure May. 8, 2012
8158460 Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds Apr. 17, 2012
8125058 Faraday cage for circuitry using substrates Feb. 28, 2012
8119928 Multi-layered wiring substrate and method of manufacturing the same Feb. 21, 2012
8097935 Quad flat package Jan. 17, 2012

1 2 3 4 5 6 7 8 9 10 11 12










 
 
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