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Class Information
Number: 361/771
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > With mounting pad > Having particular material
Description: Subject matter wherein at least a part of the printed circuit board housing is composed of one or more specific substances.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7455915 |
Selective application of conductive material to substrates by pick and place of compliant contact arrays |
Nov. 25, 2008 |
| 7417197 |
Direct contact power transfer pad and method of making same |
Aug. 26, 2008 |
| 7349223 |
Enhanced compliant probe card systems having improved planarity |
Mar. 25, 2008 |
| 7294928 |
Components, methods and assemblies for stacked packages |
Nov. 13, 2007 |
| 7265994 |
Underfill film for printed wiring assemblies |
Sep. 4, 2007 |
| 7180181 |
Mesh shaped dam mounted on a substrate |
Feb. 20, 2007 |
| 7038142 |
Circuit board and method for fabricating the same, and electronic device |
May. 2, 2006 |
| 7019403 |
Adhesive film and tacking pads for printed wiring assemblies |
Mar. 28, 2006 |
| 6992397 |
Electroless nickel immersion gold semiconductor flip chip package |
Jan. 31, 2006 |
| 6992376 |
Electronic package having a folded package substrate |
Jan. 31, 2006 |
| 6900529 |
Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
May. 31, 2005 |
| 6882545 |
Noncontact ID card and method of manufacturing the same |
Apr. 19, 2005 |
| 6879492 |
Hyperbga buildup laminate |
Apr. 12, 2005 |
| 6829149 |
Placement of sacrificial solder balls underneath the PBGA substrate |
Dec. 7, 2004 |
| 6809407 |
Semiconductor device |
Oct. 26, 2004 |
| 6791035 |
Interposer to couple a microelectronic device package to a circuit board |
Sep. 14, 2004 |
| 6785144 |
High density stackable and flexible substrate-based devices and systems and methods of fabricating |
Aug. 31, 2004 |
| 6740823 |
Solder bonding method, and electronic device and process for fabricating the same |
May. 25, 2004 |
| 6734540 |
Semiconductor package with stress inhibiting intermediate mounting substrate |
May. 11, 2004 |
| 6675474 |
Electronic component mounted member and repair method thereof |
Jan. 13, 2004 |
| 6674016 |
Electronic component |
Jan. 6, 2004 |
| 6664480 |
Singulation methods and substrates for use with same |
Dec. 16, 2003 |
| 6660942 |
Semiconductor device with an exposed external-connection terminal |
Dec. 9, 2003 |
| 6633489 |
Dynamic isolating mount for processor packages |
Oct. 14, 2003 |
| 6617528 |
Electronic package with stacked connections and method for making same |
Sep. 9, 2003 |
| 6617681 |
Interposer and method of making same |
Sep. 9, 2003 |
| 6576848 |
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same |
Jun. 10, 2003 |
| 6535395 |
Processor power delivery system |
Mar. 18, 2003 |
| 6529026 |
Method for fabricating an interconnect for making temporary electrical connections to semiconductor components |
Mar. 4, 2003 |
| 6512183 |
Electronic component mounted member and repair method thereof |
Jan. 28, 2003 |
| 6507497 |
Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer |
Jan. 14, 2003 |
| 6496382 |
Radio frequency identification tag |
Dec. 17, 2002 |
| 6489572 |
Substrate structure for an integrated circuit package and method for manufacturing the same |
Dec. 3, 2002 |
| 6462283 |
Semiconductor package with central circuit pattern |
Oct. 8, 2002 |
| 6455785 |
Bump connection with stacked metal balls |
Sep. 24, 2002 |
| 6452112 |
Electronic circuit unit useful for portable telephone, etc., and a method of manufacturing the same |
Sep. 17, 2002 |
| 6437251 |
Flexible board made by joining two pieces through an adhesive film |
Aug. 20, 2002 |
| 6434017 |
Semiconductor device and electronic apparatus |
Aug. 13, 2002 |
| 6429382 |
Electrical mounting structure having an elution preventive film |
Aug. 6, 2002 |
| 6420658 |
Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
Jul. 16, 2002 |
| 6421249 |
Electronic device with an enhanced attachment to surface mount lamps |
Jul. 16, 2002 |
| 6411518 |
High-density mounted device employing an adhesive sheet |
Jun. 25, 2002 |
| 6403895 |
Wiring substance and semiconductor |
Jun. 11, 2002 |
| 6396706 |
Self-heating circuit board |
May. 28, 2002 |
| 6396712 |
Method and apparatus for coupling circuit components |
May. 28, 2002 |
| 6288905 |
Contact module, as for a smart card, and method for making same |
Sep. 11, 2001 |
| 6281450 |
Substrate for mounting semiconductor chips |
Aug. 28, 2001 |
| 6281445 |
Device and method for connecting two electronic components |
Aug. 28, 2001 |
| 6259038 |
Semiconductor chip mounting board and method of inspecting the same mounting board |
Jul. 10, 2001 |
| 6252175 |
Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
Jun. 26, 2001 |
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