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Class Information
Number: 361/762
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > Printed circuit board > Connection of components to board > Component within printed circuit board > With specific dielectric material or layer
Description: Subject matter wherein the printed circuit board contains a particular insulating medium which intervenes between two conductors and permits electrostatic attraction and repulsion to take place across it.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7359693 |
Enclosure and substrate structure for a tuner module |
Apr. 15, 2008 |
| 7348069 |
Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate |
Mar. 25, 2008 |
| 7342181 |
Maximizing capacitance per unit area while minimizing signal transmission delay in PCB |
Mar. 11, 2008 |
| 7339795 |
Structure for fastening a circuit board on a case |
Mar. 4, 2008 |
| 7332231 |
Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same |
Feb. 19, 2008 |
| 7332799 |
Packaged chip having features for improved signal transmission on the package |
Feb. 19, 2008 |
| 7309838 |
Multi-layered circuit board assembly with improved thermal dissipation |
Dec. 18, 2007 |
| 7304248 |
Multi-layer printed circuit board and method for manufacturing the same |
Dec. 4, 2007 |
| 7282648 |
Capacitor-embedded PCB having blind via hole and method of manufacturing the same |
Oct. 16, 2007 |
| 7262974 |
Techniques for alleviating the need for DC blocking capacitors in high-speed differential signal pairs |
Aug. 28, 2007 |
| 7230332 |
Chip package with embedded component |
Jun. 12, 2007 |
| 7230187 |
Printed wire board and associated mobile terminal |
Jun. 12, 2007 |
| 7226654 |
Laminated wiring board and its mounting structure |
Jun. 5, 2007 |
| 7221960 |
Mobile telephone device comprising multiwire electrical connection devices |
May. 22, 2007 |
| 7190592 |
Integrated library core for embedded passive components and method for forming electronic device thereon |
Mar. 13, 2007 |
| 7149090 |
Structure of flexible printed circuit board |
Dec. 12, 2006 |
| 7120031 |
Data processing system comprising ceramic/organic hybrid substrate with embedded capacitors |
Oct. 10, 2006 |
| 7102873 |
Capacitor element and method for trimming a capacitor element |
Sep. 5, 2006 |
| 7068519 |
Printed circuit board and method manufacturing the same |
Jun. 27, 2006 |
| 7034231 |
Method for the manufacture of printed circuit boards with plated resistors |
Apr. 25, 2006 |
| 7026547 |
Semiconductor device and a method for fabricating a semiconductor device |
Apr. 11, 2006 |
| 7006359 |
Modular electronic assembly and method of making |
Feb. 28, 2006 |
| 6992375 |
Anchor for device package |
Jan. 31, 2006 |
| 6975516 |
Component built-in module and method for producing the same |
Dec. 13, 2005 |
| 6964884 |
Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same |
Nov. 15, 2005 |
| 6939738 |
Component built-in module and method for producing the same |
Sep. 6, 2005 |
| 6923658 |
Support for an integrated circuit package having a column grid array interconnect |
Aug. 2, 2005 |
| 6914785 |
Variable electronic circuit component |
Jul. 5, 2005 |
| 6876091 |
Wiring board |
Apr. 5, 2005 |
| 6872251 |
Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element |
Mar. 29, 2005 |
| 6868604 |
Method for forming an electrical structure |
Mar. 22, 2005 |
| 6862189 |
Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
Mar. 1, 2005 |
| 6852931 |
Configuration having an electronic device electrically connected to a printed circuit board |
Feb. 8, 2005 |
| 6847527 |
Interconnect module with reduced power distribution impedance |
Jan. 25, 2005 |
| 6845492 |
Signal via impedance adjustment tool |
Jan. 18, 2005 |
| 6813162 |
Method and apparatus for supporting circuit component having solder column array interconnects using interposed support shims |
Nov. 2, 2004 |
| 6809935 |
Thermally compliant PCB substrate for the application of chip scale packages |
Oct. 26, 2004 |
| 6805940 |
Method for making conductive circuits using powdered metals |
Oct. 19, 2004 |
| 6801437 |
Electronic organic substrate |
Oct. 5, 2004 |
| 6771348 |
Displaying substrate and liquid crystal display device having the same |
Aug. 3, 2004 |
| 6756663 |
Semiconductor device including wiring board with three dimensional wiring pattern |
Jun. 29, 2004 |
| 6747352 |
Integrated circuit having multiple power/ground connections to a single external terminal |
Jun. 8, 2004 |
| 6747356 |
Semiconductor device |
Jun. 8, 2004 |
| 6707677 |
Chip-packaging substrate and test method therefor |
Mar. 16, 2004 |
| 6680130 |
High K dielectric material and method of making a high K dielectric material |
Jan. 20, 2004 |
| 6680436 |
Reflow encapsulant |
Jan. 20, 2004 |
| 6677669 |
Semiconductor package including two semiconductor die disposed within a common clip |
Jan. 13, 2004 |
| 6633489 |
Dynamic isolating mount for processor packages |
Oct. 14, 2003 |
| 6625040 |
Shielded PC board for magnetically sensitive integrated circuits |
Sep. 23, 2003 |
| 6625037 |
Printed circuit board and method manufacturing the same |
Sep. 23, 2003 |
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