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Class Information
Number: 361/718
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > With cooling means > Thermal conduction > For active solid state devices > For integrated circuit
Description: Subject matter wherein the heat is conducted from an electrical network composed of two or more circuit elements inextricably bound on a single semiconductor substrate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602610 |
Electronic device |
Oct. 13, 2009 |
| 7593228 |
Technique for forming a thermally conductive interface with patterned metal foil |
Sep. 22, 2009 |
| 7558064 |
Cooling apparatus |
Jul. 7, 2009 |
| 7558066 |
System and method for cooling a module |
Jul. 7, 2009 |
| 7558072 |
Adapter module |
Jul. 7, 2009 |
| 7554808 |
Heat sink with thermoelectric module |
Jun. 30, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7525804 |
Semiconductor device and method of manufacturing the same |
Apr. 28, 2009 |
| 7523617 |
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
Apr. 28, 2009 |
| 7522886 |
Radio frequency transceivers |
Apr. 21, 2009 |
| 7502229 |
Heat dissipation system for multiple integrated circuits mounted on a printed circuit board |
Mar. 10, 2009 |
| 7486518 |
Cooling device and electronic apparatus |
Feb. 3, 2009 |
| 7477515 |
Electronic apparatus and thermal dissipating module thereof |
Jan. 13, 2009 |
| 7473585 |
Technique for manufacturing an overmolded electronic assembly |
Jan. 6, 2009 |
| 7471534 |
Inverter type motor drive unit |
Dec. 30, 2008 |
| 7468886 |
Method and structure to improve thermal dissipation from semiconductor devices |
Dec. 23, 2008 |
| 7466553 |
Cooling system |
Dec. 16, 2008 |
| 7460371 |
Wiffle tree components, cooling systems, and methods of attaching a printed circuit board to a heat sink |
Dec. 2, 2008 |
| 7453145 |
Electronics unit |
Nov. 18, 2008 |
| 7446410 |
Circuit module with thermal casing systems |
Nov. 4, 2008 |
| 7443023 |
High capacity thin module system |
Oct. 28, 2008 |
| 7442882 |
3D checkerboard perforation pattern for increased shielding effectiveness |
Oct. 28, 2008 |
| 7417861 |
Vehicular power converter |
Aug. 26, 2008 |
| 7408777 |
Plasma display device |
Aug. 5, 2008 |
| 7405935 |
Service tray for a thermal management system |
Jul. 29, 2008 |
| 7394659 |
Apparatus and methods for cooling semiconductor integrated circuit package structures |
Jul. 1, 2008 |
| 7394657 |
Method of obtaining enhanced localized thermal interface regions by particle stacking |
Jul. 1, 2008 |
| 7385824 |
Processor module with rigidly coupled processor and voltage-regulator heat sinks |
Jun. 10, 2008 |
| 7375963 |
System and method for cooling a module |
May. 20, 2008 |
| 7375962 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
May. 20, 2008 |
| 7362574 |
Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
Apr. 22, 2008 |
| 7362577 |
Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member |
Apr. 22, 2008 |
| 7359201 |
Heat-generating electronic part cover and cover mounting method |
Apr. 15, 2008 |
| 7336486 |
Synthetic jet-based heat dissipation device |
Feb. 26, 2008 |
| 7307845 |
Multiple integrated circuit package module |
Dec. 11, 2007 |
| 7295435 |
Heat sink having ferrofluid-based pump for nanoliquid cooling |
Nov. 13, 2007 |
| 7280362 |
Method and apparatus for attaching a processor and corresponding heat sink to a circuit board |
Oct. 9, 2007 |
| 7277282 |
Integrated circuit cooling system including heat pipes and external heat sink |
Oct. 2, 2007 |
| 7265976 |
Microchannel thermal management system |
Sep. 4, 2007 |
| 7265979 |
Cooling integrated circuits using a cold plate with two phase thin film evaporation |
Sep. 4, 2007 |
| 7265982 |
Semiconductor device |
Sep. 4, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7254033 |
Method and apparatus for heat dissipation |
Aug. 7, 2007 |
| 7254032 |
Techniques for providing EMI shielding within a circuit board component |
Aug. 7, 2007 |
| 7245083 |
Incandescent lamp with integral controlling means |
Jul. 17, 2007 |
| 7245495 |
Feedback controlled magneto-hydrodynamic heat sink |
Jul. 17, 2007 |
| 7236367 |
Power electronics component |
Jun. 26, 2007 |
| 7218523 |
Liquid cooling system |
May. 15, 2007 |
| 7218519 |
Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels |
May. 15, 2007 |
| 7209354 |
Ball grid array package with heat sink device |
Apr. 24, 2007 |
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