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Class Information
Number: 361/703
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > With cooling means > Fluid > With cooling fins
Description: Subject matter wherein the cooling means comprises the fluid and a metal disk or a thin projecting metal strip attached to a semiconductor to dissipate heat.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7623348 |
Heat sink and cooling apparatus |
Nov. 24, 2009 |
| 7619888 |
Flat heat column and heat dissipating apparatus thereof |
Nov. 17, 2009 |
| 7616444 |
Gimballed attachment for multiple heat exchangers |
Nov. 10, 2009 |
| 7609521 |
Heat dissipation device with a heat pipe |
Oct. 27, 2009 |
| 7606027 |
Electronic apparatus cooling structure |
Oct. 20, 2009 |
| 7600908 |
Light source module and backlight system using the same |
Oct. 13, 2009 |
| 7595989 |
Heat dissipation device |
Sep. 29, 2009 |
| 7595468 |
Passive thermal solution for hand-held devices |
Sep. 29, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7580263 |
Heat dissipation device with a fan holder |
Aug. 25, 2009 |
| 7573709 |
Grounding a heat sink in thermal contact with an electronic component using a grounding spring having multiple-jointed spring fingers |
Aug. 11, 2009 |
| 7567435 |
Heat sink assembly |
Jul. 28, 2009 |
| 7564686 |
Heat-dissipating module |
Jul. 21, 2009 |
| 7539017 |
Heat dissipating device for central processor |
May. 26, 2009 |
| 7539009 |
Cooling unit having a heat radiating portion, and electronic apparatus incorporating a cooling unit |
May. 26, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
| 7529089 |
Heat-dissipating device connected in series to water-cooling circulation system |
May. 5, 2009 |
| 7518874 |
Heat sink assembly |
Apr. 14, 2009 |
| 7515412 |
Cooling structure for power supply |
Apr. 7, 2009 |
| 7508669 |
Cooling device for an electronic component, especially for a microprocessor |
Mar. 24, 2009 |
| 7505273 |
Cooling body and rectifier module for an electrical machine |
Mar. 17, 2009 |
| 7501844 |
Liquid cooled DUT card interface for wafer sort probing |
Mar. 10, 2009 |
| 7495917 |
Heat dissipation device |
Feb. 24, 2009 |
| 7492599 |
Heat sink for LED lamp |
Feb. 17, 2009 |
| 7489513 |
Heat dissipation device |
Feb. 10, 2009 |
| 7486515 |
Fluid circulator for fluid cooled electronic device |
Feb. 3, 2009 |
| 7477515 |
Electronic apparatus and thermal dissipating module thereof |
Jan. 13, 2009 |
| 7468890 |
Graphics card heat-dissipating device |
Dec. 23, 2008 |
| 7466550 |
Integrated heat dissipating assembly |
Dec. 16, 2008 |
| 7466552 |
Heat-radiating structure and plasma display device including the same |
Dec. 16, 2008 |
| 7463484 |
Heatsink apparatus |
Dec. 9, 2008 |
| 7460368 |
Cooling-fan-free system module |
Dec. 2, 2008 |
| 7455103 |
Electronic equipment provided with cooling system |
Nov. 25, 2008 |
| 7457118 |
Method and apparatus for dispersing heat from high-power electronic devices |
Nov. 25, 2008 |
| 7453695 |
Cooling structure of electric device |
Nov. 18, 2008 |
| 7440261 |
Power regulator with a bypass and splice capability |
Oct. 21, 2008 |
| 7423877 |
Heat dissipation device |
Sep. 9, 2008 |
| 7417859 |
Heat radiating assembly for plasma display apparatus and plasma display apparatus including the same |
Aug. 26, 2008 |
| 7414848 |
Heat dissipation device |
Aug. 19, 2008 |
| 7414845 |
Circuit board assembly for a liquid submersion cooled electronic device |
Aug. 19, 2008 |
| 7411791 |
Extendable heat dissipation apparatus |
Aug. 12, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7408780 |
Compliant thermal interface structure utilizing spring elements with fins |
Aug. 5, 2008 |
| 7382615 |
Heat dissipation device |
Jun. 3, 2008 |
| 7382616 |
Cooling system for computer hardware |
Jun. 3, 2008 |
| 7371965 |
Modular cage with heat sink for use with pluggable module |
May. 13, 2008 |
| 7369410 |
Apparatuses for dissipating heat from semiconductor devices |
May. 6, 2008 |
| 7362575 |
Cooling method use diamond pins and heat pipes |
Apr. 22, 2008 |
| 7359196 |
Dual impeller push-pull axial fan heat sink |
Apr. 15, 2008 |
| 7359195 |
Heatsink |
Apr. 15, 2008 |
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