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Class Information
Number: 361/702
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > With cooling means > Fluid > With cold plate or heat sink
Description: Subject matter wherein the cooling means comprises the fluid and (a) a mass of metal that is added to a device for absorption or transfer of heat from critical electrical parts or (b) a plate or bar that transfers heat from critical electrical parts.


Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
7616444 Gimballed attachment for multiple heat exchangers Nov. 10, 2009
7602610 Electronic device Oct. 13, 2009
7595988 Thermal management system and method for electronic assemblies Sep. 29, 2009
7592695 Compound heat sink Sep. 22, 2009
7593230 Apparatus for absorbing and dissipating excess heat generated by a system Sep. 22, 2009
7593235 Thermal conduit Sep. 22, 2009
7583504 Cooling assembly Sep. 1, 2009
7570488 Alternator rectifier Aug. 4, 2009
7558066 System and method for cooling a module Jul. 7, 2009
7554804 Electronic module configured for air flow therethrough and system including same Jun. 30, 2009
7551435 Heat-absorbing member, cooling device, and electronic apparatus Jun. 23, 2009
7551440 System and method for cooling an electronic component Jun. 23, 2009
7548420 Electrical drive unit Jun. 16, 2009
7543457 Systems for integrated pump and reservoir Jun. 9, 2009
7542293 Thermal module Jun. 2, 2009
7529089 Heat-dissipating device connected in series to water-cooling circulation system May. 5, 2009
7525803 Power converter having multiple layer heat sinks Apr. 28, 2009
7522422 Heat sink Apr. 21, 2009
7518871 Liquid-based cooling system for cooling a multi-component electronics system Apr. 14, 2009
7518870 Card slot apparatus having a movable heat radiating unit and electronic machine having the same Apr. 14, 2009
7515416 Structures for holding cards incorporating electronic and/or micromachined components Apr. 7, 2009
7515418 Adjustable height liquid cooler in liquid flow through plate Apr. 7, 2009
7511960 Balanced chilled fluid cooling system for a data center in a shipping container Mar. 31, 2009
7508338 Antenna with compact LRU array Mar. 24, 2009
7508669 Cooling device for an electronic component, especially for a microprocessor Mar. 24, 2009
7501844 Liquid cooled DUT card interface for wafer sort probing Mar. 10, 2009
7499279 Cold plate stability Mar. 3, 2009
7495916 Low cost cold plate with film adhesive Feb. 24, 2009
7486514 Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled Feb. 3, 2009
7486518 Cooling device and electronic apparatus Feb. 3, 2009
7477515 Electronic apparatus and thermal dissipating module thereof Jan. 13, 2009
7477516 Air cooled computer chip Jan. 13, 2009
7475175 Multi-processor module Jan. 6, 2009
7471965 Mobile terminal having a heat releasing member Dec. 30, 2008
7468886 Method and structure to improve thermal dissipation from semiconductor devices Dec. 23, 2008
7457118 Method and apparatus for dispersing heat from high-power electronic devices Nov. 25, 2008
7455103 Electronic equipment provided with cooling system Nov. 25, 2008
7443677 Heat dissipation device Oct. 28, 2008
7440261 Power regulator with a bypass and splice capability Oct. 21, 2008
7433193 Techniques for controlling a position of a transceiver module relative to a connector Oct. 7, 2008
7430119 Impeller and aligned cold plate Sep. 30, 2008
7430121 Heat sink fastener Sep. 30, 2008
7420808 Liquid-based cooling system for cooling a multi-component electronics system Sep. 2, 2008
7417857 Power-electronic-cooling device Aug. 26, 2008
7414845 Circuit board assembly for a liquid submersion cooled electronic device Aug. 19, 2008
7414844 Liquid cooled heat sink with cold plate retention mechanism Aug. 19, 2008
7411790 Heat sink with built-in heat pipes for semiconductor packages Aug. 12, 2008
7408776 Conductive heat transport cooling system and method for a multi-component electronics system Aug. 5, 2008
7408780 Compliant thermal interface structure utilizing spring elements with fins Aug. 5, 2008
7405936 Hybrid cooling system for a multi-component electronics system Jul. 29, 2008

1 2 3 4 5 6 7 8 9


 
 
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