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Class Information
Number: 361/699
Name: Electricity: electrical systems and devices > Housing or mounting assemblies with diverse electrical components > For electronic systems and devices > With cooling means > Fluid > Liquid
Description: Subject matter wherein the fluid comprises a substance characterized by free movement of constituent molecules among themselves but without tendency to separate.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7619889 |
Controllable heat transfer medium system and method for use with a circuit board |
Nov. 17, 2009 |
| 7619887 |
Arrangement for cooling electronic modular units in equipment and network cabinets |
Nov. 17, 2009 |
| 7616444 |
Gimballed attachment for multiple heat exchangers |
Nov. 10, 2009 |
| 7616443 |
Cooling device for electrical power units of electrically operated vehicles |
Nov. 10, 2009 |
| 7614247 |
Cooling arrangement |
Nov. 10, 2009 |
| 7613001 |
Heat dissipation device with heat pipe |
Nov. 3, 2009 |
| 7609519 |
Coolant control unit and cooled electronics system employing the same |
Oct. 27, 2009 |
| 7609518 |
Cooling computer components |
Oct. 27, 2009 |
| 7605456 |
Inverter unit |
Oct. 20, 2009 |
| 7604040 |
Integrated liquid cooled heat sink for electronic components |
Oct. 20, 2009 |
| 7602609 |
Cooling system and method of use |
Oct. 13, 2009 |
| 7602608 |
Narrow gap spray cooling in a globally cooled enclosure |
Oct. 13, 2009 |
| 7599184 |
Liquid cooling loops for server applications |
Oct. 6, 2009 |
| 7595988 |
Thermal management system and method for electronic assemblies |
Sep. 29, 2009 |
| 7595987 |
Heat dissipation assembly for computing devices |
Sep. 29, 2009 |
| 7593227 |
Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing |
Sep. 22, 2009 |
| 7586747 |
Scalable subsystem architecture having integrated cooling channels |
Sep. 8, 2009 |
| 7583501 |
Electronic apparatus |
Sep. 1, 2009 |
| 7580261 |
Semiconductor cooling system for use in electric or hybrid vehicle |
Aug. 25, 2009 |
| 7573715 |
High density storage system |
Aug. 11, 2009 |
| 7564685 |
Motherboards with integrated cooling |
Jul. 21, 2009 |
| 7561429 |
Power converter unit |
Jul. 14, 2009 |
| 7561424 |
Method for cooling electronic components in an unmanned flying vehicle and a device for carrying out the method |
Jul. 14, 2009 |
| 7559209 |
Liquid cooling system |
Jul. 14, 2009 |
| 7558064 |
Cooling apparatus |
Jul. 7, 2009 |
| 7558063 |
Server with a flexible cooling scheme |
Jul. 7, 2009 |
| 7551443 |
Heat-dissipating module connecting to a plurality of heat-generating components and related device thereof |
Jun. 23, 2009 |
| 7551442 |
Embedded heat pipe in a hybrid cooling system |
Jun. 23, 2009 |
| 7551441 |
Heat dissipation assembly for computing devices |
Jun. 23, 2009 |
| 7551440 |
System and method for cooling an electronic component |
Jun. 23, 2009 |
| 7551439 |
Fluid cooled electronic assembly |
Jun. 23, 2009 |
| 7551438 |
Information processing blade and information processing apparatus using the same |
Jun. 23, 2009 |
| 7551435 |
Heat-absorbing member, cooling device, and electronic apparatus |
Jun. 23, 2009 |
| 7548428 |
Computer device heat dissipation system |
Jun. 16, 2009 |
| 7548427 |
Apparatus and docking station for cooling of computing devices |
Jun. 16, 2009 |
| 7548425 |
Heat-Receiving apparatus and electronic equipment |
Jun. 16, 2009 |
| 7548424 |
Distributed transmit/receive integrated microwave module chip level cooling system |
Jun. 16, 2009 |
| 7545648 |
Cooling structure using rigid movable elements |
Jun. 9, 2009 |
| 7545644 |
Nano-patch thermal management devices, methods, & systems |
Jun. 9, 2009 |
| 7544049 |
Cooling device and centrifugal pump to be used in the same device |
Jun. 9, 2009 |
| 7543457 |
Systems for integrated pump and reservoir |
Jun. 9, 2009 |
| 7542292 |
System for efficiently cooling a processor |
Jun. 2, 2009 |
| 7542291 |
Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink |
Jun. 2, 2009 |
| 7542290 |
Computer device cooling system |
Jun. 2, 2009 |
| 7539016 |
Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewalls |
May. 26, 2009 |
| 7537048 |
Integrated liquid cooling system for electronic components |
May. 26, 2009 |
| 7537047 |
Liquid-cooling heat sink |
May. 26, 2009 |
| 7532467 |
Thermal management devices, systems, and methods |
May. 12, 2009 |
| 7529091 |
Power semiconductor module and method for cooling a power semiconductor module |
May. 5, 2009 |
| 7529089 |
Heat-dissipating device connected in series to water-cooling circulation system |
May. 5, 2009 |
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