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Browse by Category: Main > Electrical & Energy
Class Information
Number: 361/234
Name: Electricity: electrical systems and devices > Electric charge generating or conducting means (e.g., charging of gases) > Use of forces of electric charge or field > Pinning
Description: Subject matter relating to the utilization of the forces generated to effect the holding or pinning of an object or material on a surface.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
5996218 Method of forming an electrostatic chuck suitable for magnetic flux processing Dec. 7, 1999
5998932 Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber Dec. 7, 1999
5995357 Ceramic member-electric power supply connector coupling structure Nov. 30, 1999
5986873 Creating surface topography on an electrostatic chuck with a mandrel Nov. 16, 1999
5986874 Electrostatic support assembly having an integral ion focus ring Nov. 16, 1999
5986875 Puncture resistant electrostatic chuck Nov. 16, 1999
5985035 Method of holding substrate and substrate holding system Nov. 16, 1999
5982607 Monopolar electrostatic chuck having an electrode in contact with a workpiece Nov. 9, 1999
5978202 Electrostatic chuck having a thermal transfer regulator pad Nov. 2, 1999
5969934 Electrostatic wafer clamp having low particulate contamination of wafers Oct. 19, 1999
5961774 Method of holding substrate and substrate holding system Oct. 5, 1999
5956837 Method of detaching object to be processed from electrostatic chuck Sep. 28, 1999
5953200 Multiple pole electrostatic chuck with self healing mechanism for wafer clamping Sep. 14, 1999
5948986 Monitoring of wafer presence and position in semiconductor processing operations Sep. 7, 1999
5946183 Electrostatic chuck Aug. 31, 1999
5946184 Electrostatic chuck, and method of and apparatus for processing sample Aug. 31, 1999
5936829 Thermally conductive chuck for vacuum processor Aug. 10, 1999
5933314 Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks Aug. 3, 1999
5930661 Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers Jul. 27, 1999
5923521 Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck Jul. 13, 1999
5916689 Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect Jun. 29, 1999
5917327 Technique and apparatus for testing electrostatic chucks Jun. 29, 1999
5914568 Plasma processing apparatus Jun. 22, 1999
5909355 Ceramic electrostatic chuck and method of fabricating same Jun. 1, 1999
5909354 Electrostatic chuck member having an alumina-titania spray coated layer and a method of producing the same Jun. 1, 1999
5909086 Plasma generator for generating unipolar plasma Jun. 1, 1999
5906684 Method of holding substrate and substrate holding system May. 25, 1999
5905626 Electrostatic chuck with ceramic pole protection May. 18, 1999
5903428 Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same May. 11, 1999
5901030 Electrostatic chuck employing thermoelectric cooling May. 4, 1999
5900062 Lift pin for dechucking substrates May. 4, 1999
5894400 Method and apparatus for clamping a substrate Apr. 13, 1999
5886865 Method and apparatus for predicting failure of an eletrostatic chuck Mar. 23, 1999
5886866 Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing Mar. 23, 1999
5886863 Wafer support member Mar. 23, 1999
5886864 Substrate support member for uniform heating of a substrate Mar. 23, 1999
5883778 Electrostatic chuck with fluid flow regulator Mar. 16, 1999
5880921 Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology Mar. 9, 1999
5880922 Multilayered electrostatic chuck and method of manufacture thereof Mar. 9, 1999
5880923 Method and apparatus for improved retention of a semiconductor wafer within a semiconductor wafer processing system Mar. 9, 1999
5880924 Electrostatic chuck capable of rapidly dechucking a substrate Mar. 9, 1999
5872694 Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage Feb. 16, 1999
5870271 Pressure actuated sealing diaphragm for chucks Feb. 9, 1999
5867359 Electrostatic chuck Feb. 2, 1999
5864459 Process for providing a glass dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process Jan. 26, 1999
5856906 Backside gas quick dump apparatus for a semiconductor wafer processing system Jan. 5, 1999
5851641 Electrostatic chucking device Dec. 22, 1998
5847918 Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors Dec. 8, 1998
5841623 Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system Nov. 24, 1998
5841624 Cover layer for a substrate support chuck and method of fabricating same Nov. 24, 1998

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