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Browse by Category: Main > Electrical & Energy
Class Information
Number: 333/247
Name: Wave transmission lines and networks > Long line elements and components > Strip type > Semiconductor mounts
Description: Subject matter wherein a strip-type board is used to hold or support a solid-state device such as a transistor.










Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
6528732 Circuit device board, semiconductor component, and method of making the same Mar. 4, 2003
6507495 Three-dimensional technique for improving the EMC characteristics of a printed circuit board Jan. 14, 2003
6501343 Integrated circuit tester with high bandwidth probe assembly Dec. 31, 2002
6498551 Millimeter wave module (MMW) for microwave monolithic integrated circuit (MMIC) Dec. 24, 2002
6489680 Semiconductor device Dec. 3, 2002
6489866 Microwave module Dec. 3, 2002
6483406 High-frequency module using slot coupling Nov. 19, 2002
6472961 Non-radiative dielectric line including convex or concave portion, and integrated circuit comprising the non-radiative dielectric line Oct. 29, 2002
6469592 High-frequency interconnection for circuits Oct. 22, 2002
6467152 Method of fabricating a microwave microstrip/waveguide transition structure Oct. 22, 2002
6466113 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices Oct. 15, 2002
6459343 Integrated circuit interconnect system forming a multi-pole filter Oct. 1, 2002
6459347 Method for vertical connection of conductors in a device in the microwave range Oct. 1, 2002
6452267 Selective flip chip underfill processing for high speed signal isolation Sep. 17, 2002
6448865 Integrated circuit interconnect system Sep. 10, 2002
6445256 Oscillator and radio equipment Sep. 3, 2002
6437669 Microwave to millimeter wave frequency substrate interface Aug. 20, 2002
6426686 Microwave circuit packages having a reduced number of vias in the substrate Jul. 30, 2002
6417747 Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards Jul. 9, 2002
6418031 Method and means for decoupling a printed circuit board Jul. 9, 2002
6384701 Microwave and millimeter wave device mounted on a semiconductive substrate and comprised of different kinds of functional blocks May. 7, 2002
6369411 Semiconductor device for controlling high-power electricity with improved heat dissipation Apr. 9, 2002
6369678 RF assembly with ground-plane slot between components and method therefor Apr. 9, 2002
6366770 High-frequency semiconductor device and radio transmitter/receiver device Apr. 2, 2002
6359536 High frequency multi-layer module with electronic component receiving aperture and conductive via Mar. 19, 2002
6356173 High-frequency module coupled via aperture in a ground plane Mar. 12, 2002
6347041 Incremental phase correcting mechanisms for differential signals to decrease electromagnetic emissions Feb. 12, 2002
6335669 RF circuit module Jan. 1, 2002
6331806 Microwave circuit package and edge conductor structure Dec. 18, 2001
6307450 Millimeter wave module and radio apparatus Oct. 23, 2001
6297965 Wiring arrangement including capacitors for suppressing electromagnetic wave radiation from a printed circuit board Oct. 2, 2001
6294966 Interconnection device Sep. 25, 2001
6285269 High-frequency semiconductor device having microwave transmission line being formed by a gate electrode source electrode and a dielectric layer in between Sep. 4, 2001
6265937 Push-pull amplifier with dual coplanar transmission line Jul. 24, 2001
6249439 Millimeter wave multilayer assembly Jun. 19, 2001
6239669 High frequency package May. 29, 2001
6225878 Millimeter wave module and radio apparatus May. 1, 2001
6218910 High bandwidth passive integrated circuit tester probe card assembly Apr. 17, 2001
6215377 Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format Apr. 10, 2001
6207906 PCB having holes between terminals and method of making the same Mar. 27, 2001
6204448 High frequency microwave packaging having a dielectric gap Mar. 20, 2001
6201454 Compensation structure for a bond wire at high frequency operation Mar. 13, 2001
6198635 Interconnect layout pattern for integrated circuit packages and the like Mar. 6, 2001
6181278 Antenna-integral high frequency circuit electromagnetically coupling feeder circuit connected to high frequency circuit to microstrip antenna via slot coupling hole Jan. 30, 2001
6175287 Direct backside interconnect for multiple chip assemblies Jan. 16, 2001
6172305 Multilayer circuit board Jan. 9, 2001
6166457 Printed-circuit assembly Dec. 26, 2000
6166613 Voltage-controlled resonator, method of fabricating the same, method of tuning the same, and mobile communication apparatus Dec. 26, 2000
6118357 Wireless MMIC chip packaging for microwave and millimeterwave frequencies Sep. 12, 2000
6114716 Heterolithic microwave integrated circuits Sep. 5, 2000

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