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Class Information
Number: 29/852
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Manufacturing circuit on or in base > By forming conductive walled aperture in base
Description: Process of shaping a hole in the base and attaching electrically conductive material to the walls of the hole.


Sub-classes under this class:

Class Number Class Name Patents
29/853 With deforming of conductive path 86


Patents under this class:

Patent Number Title Of Patent Date Issued
7621041 Methods for forming multilayer structures Nov. 24, 2009
7621036 Method of manufacturing implantable wireless sensor for in vivo pressure measurement Nov. 24, 2009
7617598 Method of making a thermally isolated via structure Nov. 17, 2009
7615709 Circuit board through-hole impedance tuning using clearance size variations Nov. 10, 2009
7614147 Method of creating contour structures to highlight inspection region Nov. 10, 2009
7614146 Method for fabricating circuit board structure Nov. 10, 2009
7612296 Visually inspectable surface mount device pad Nov. 3, 2009
7605075 Multilayer circuit board and method of manufacturing the same Oct. 20, 2009
7603772 Methods of fabricating substrates including one or more conductive vias Oct. 20, 2009
7603771 Method of manufacturing a combined multilayer circuit board having embedded chips Oct. 20, 2009
7600315 Method of manufacturing printed circuit board Oct. 13, 2009
7600313 Part cartridge for mounter device Oct. 13, 2009
7596864 Stacked module connector Oct. 6, 2009
7596863 Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein Oct. 6, 2009
7596862 Method of making a circuitized substrate Oct. 6, 2009
7594322 Methods of fabricating substrates including at least one conductive via Sep. 29, 2009
7594321 Substrate-imprinting methods Sep. 29, 2009
7594320 Method of manufacturing printed wiring board Sep. 29, 2009
7594316 Method of manufacturing composite electronic component Sep. 29, 2009
7594105 Multilayer print circuit board Sep. 22, 2009
7591937 Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof Sep. 22, 2009
7591067 Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same Sep. 22, 2009
7587816 Method of improving the stability of a circuit board Sep. 15, 2009
7587815 Resin-coated metal plate and method of drilling printed wiring board using the metal plate Sep. 15, 2009
7585419 Substrate structure and the fabrication method thereof Sep. 8, 2009
7584535 Method of manufacturing multi-layer wiring board Sep. 8, 2009
7581314 Method of forming noble metal contacts Sep. 1, 2009
7581312 Method for manufacturing multilayer flexible printed circuit board Sep. 1, 2009
7574793 Process of forming a laminate ceramic circuit board Aug. 18, 2009
7571540 Production method of suspension board with circuit Aug. 11, 2009
7571536 Method of making capacitive/resistive devices Aug. 11, 2009
7568278 Method of manufacturing inductor Aug. 4, 2009
7565739 Method of making zinc-aluminum alloy connection Jul. 28, 2009
7565738 Method for manufacturing circuit device Jul. 28, 2009
7565725 Method for forming a variable capacitor Jul. 28, 2009
7562447 Method of manufacturing printed circuit board for fine circuit formation Jul. 21, 2009
7562446 Method for manufacturing substrate with cavity Jul. 21, 2009
7552531 Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit Jun. 30, 2009
7552530 Method of manufacturing a PCB having improved cooling Jun. 30, 2009
7549222 Method of producing wiring board Jun. 23, 2009
7543376 Manufacturing method of flexible printed wiring board Jun. 9, 2009
7543375 Process for filling via hole in a substrate Jun. 9, 2009
7540082 Method for manufacturing printed wiring board Jun. 2, 2009
7536780 Method of manufacturing wiring substrate to which semiconductor chip is mounted May. 26, 2009
7530167 Method of making a printed circuit board with low cross-talk noise May. 12, 2009
7530163 Electronic parts packaging structure and method of manufacturing the same May. 12, 2009
7523550 Process to open connection vias on a planarized surface Apr. 28, 2009
7523546 Method for manufacturing a composite layer for an electronic device Apr. 28, 2009
7523545 Methods of manufacturing printed circuit boards with stacked micro vias Apr. 28, 2009
7521779 Roughened printed circuit board Apr. 21, 2009



 
 
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