| |
 |
|
Class Information
Number: 29/852
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Manufacturing circuit on or in base > By forming conductive walled aperture in base
Description: Process of shaping a hole in the base and attaching electrically conductive material to the walls of the hole.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7621041 |
Methods for forming multilayer structures |
Nov. 24, 2009 |
| 7621036 |
Method of manufacturing implantable wireless sensor for in vivo pressure measurement |
Nov. 24, 2009 |
| 7617598 |
Method of making a thermally isolated via structure |
Nov. 17, 2009 |
| 7615709 |
Circuit board through-hole impedance tuning using clearance size variations |
Nov. 10, 2009 |
| 7614147 |
Method of creating contour structures to highlight inspection region |
Nov. 10, 2009 |
| 7614146 |
Method for fabricating circuit board structure |
Nov. 10, 2009 |
| 7612296 |
Visually inspectable surface mount device pad |
Nov. 3, 2009 |
| 7605075 |
Multilayer circuit board and method of manufacturing the same |
Oct. 20, 2009 |
| 7603772 |
Methods of fabricating substrates including one or more conductive vias |
Oct. 20, 2009 |
| 7603771 |
Method of manufacturing a combined multilayer circuit board having embedded chips |
Oct. 20, 2009 |
| 7600315 |
Method of manufacturing printed circuit board |
Oct. 13, 2009 |
| 7600313 |
Part cartridge for mounter device |
Oct. 13, 2009 |
| 7596864 |
Stacked module connector |
Oct. 6, 2009 |
| 7596863 |
Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein |
Oct. 6, 2009 |
| 7596862 |
Method of making a circuitized substrate |
Oct. 6, 2009 |
| 7594322 |
Methods of fabricating substrates including at least one conductive via |
Sep. 29, 2009 |
| 7594321 |
Substrate-imprinting methods |
Sep. 29, 2009 |
| 7594320 |
Method of manufacturing printed wiring board |
Sep. 29, 2009 |
| 7594316 |
Method of manufacturing composite electronic component |
Sep. 29, 2009 |
| 7594105 |
Multilayer print circuit board |
Sep. 22, 2009 |
| 7591937 |
Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof |
Sep. 22, 2009 |
| 7591067 |
Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same |
Sep. 22, 2009 |
| 7587816 |
Method of improving the stability of a circuit board |
Sep. 15, 2009 |
| 7587815 |
Resin-coated metal plate and method of drilling printed wiring board using the metal plate |
Sep. 15, 2009 |
| 7585419 |
Substrate structure and the fabrication method thereof |
Sep. 8, 2009 |
| 7584535 |
Method of manufacturing multi-layer wiring board |
Sep. 8, 2009 |
| 7581314 |
Method of forming noble metal contacts |
Sep. 1, 2009 |
| 7581312 |
Method for manufacturing multilayer flexible printed circuit board |
Sep. 1, 2009 |
| 7574793 |
Process of forming a laminate ceramic circuit board |
Aug. 18, 2009 |
| 7571540 |
Production method of suspension board with circuit |
Aug. 11, 2009 |
| 7571536 |
Method of making capacitive/resistive devices |
Aug. 11, 2009 |
| 7568278 |
Method of manufacturing inductor |
Aug. 4, 2009 |
| 7565739 |
Method of making zinc-aluminum alloy connection |
Jul. 28, 2009 |
| 7565738 |
Method for manufacturing circuit device |
Jul. 28, 2009 |
| 7565725 |
Method for forming a variable capacitor |
Jul. 28, 2009 |
| 7562447 |
Method of manufacturing printed circuit board for fine circuit formation |
Jul. 21, 2009 |
| 7562446 |
Method for manufacturing substrate with cavity |
Jul. 21, 2009 |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit |
Jun. 30, 2009 |
| 7552530 |
Method of manufacturing a PCB having improved cooling |
Jun. 30, 2009 |
| 7549222 |
Method of producing wiring board |
Jun. 23, 2009 |
| 7543376 |
Manufacturing method of flexible printed wiring board |
Jun. 9, 2009 |
| 7543375 |
Process for filling via hole in a substrate |
Jun. 9, 2009 |
| 7540082 |
Method for manufacturing printed wiring board |
Jun. 2, 2009 |
| 7536780 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted |
May. 26, 2009 |
| 7530167 |
Method of making a printed circuit board with low cross-talk noise |
May. 12, 2009 |
| 7530163 |
Electronic parts packaging structure and method of manufacturing the same |
May. 12, 2009 |
| 7523550 |
Process to open connection vias on a planarized surface |
Apr. 28, 2009 |
| 7523546 |
Method for manufacturing a composite layer for an electronic device |
Apr. 28, 2009 |
| 7523545 |
Methods of manufacturing printed circuit boards with stacked micro vias |
Apr. 28, 2009 |
| 7521779 |
Roughened printed circuit board |
Apr. 21, 2009 |
|
|
|