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Class Information
Number: 29/846
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Manufacturing circuit on or in base
Description: Process of manufacturing a conductive path to, on, or in an insulative base.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6733711 |
Plastic packaging of LED arrays |
May. 11, 2004 |
| 6729001 |
Method for making a sonoprobe |
May. 4, 2004 |
| 6729022 |
Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards |
May. 4, 2004 |
| 6729023 |
Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material |
May. 4, 2004 |
| 6729024 |
Method of forming a non-continuous conductive layer for laminated substrates |
May. 4, 2004 |
| 6729025 |
Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
May. 4, 2004 |
| 6725528 |
Microsolenoid coil and its manufacturing method |
Apr. 27, 2004 |
| 6718619 |
Method of manufacturing a central stem monopole antenna |
Apr. 13, 2004 |
| 6718631 |
Process for producing a flexible wiring board |
Apr. 13, 2004 |
| 6715197 |
Laminated ceramic electronic component and method for manufacturing same |
Apr. 6, 2004 |
| 6711812 |
Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
Mar. 30, 2004 |
| 6711813 |
Method for fabricating a thin film build-up structure on a sequentially laminated printed circuit board base |
Mar. 30, 2004 |
| 6711815 |
Fabricating method of semiconductor devices |
Mar. 30, 2004 |
| 6713686 |
Apparatus and method for repairing electronic packages |
Mar. 30, 2004 |
| 6708398 |
Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package |
Mar. 23, 2004 |
| 6708399 |
Method for fabricating a test interconnect for bumped semiconductor components |
Mar. 23, 2004 |
| 6708404 |
Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole |
Mar. 23, 2004 |
| 6709803 |
Process for producing printed wiring board |
Mar. 23, 2004 |
| 6705005 |
Method of forming assemblies of circuit boards in different planes |
Mar. 16, 2004 |
| 6705007 |
Method for manufacturing double-sided flexible printed board |
Mar. 16, 2004 |
| 6701613 |
Multilayer circuit board and method of manufacturing the same |
Mar. 9, 2004 |
| 6701614 |
Method for making a build-up package of a semiconductor |
Mar. 9, 2004 |
| 6698072 |
Method of manufacturing piezoelectric actuators |
Mar. 2, 2004 |
| 6698073 |
Method of manufacturing a piezoelectric filter with an acoustic resonator situated on an acoustic reflector layer formed by a carrier substrate |
Mar. 2, 2004 |
| 6698085 |
Method for manufacturing low cost electroluminescent (EL) illuminated membrane switches |
Mar. 2, 2004 |
| 6698091 |
Method and apparatus for coupling circuit boards |
Mar. 2, 2004 |
| 6698093 |
Method of manufacturing circuit forming board to improve adhesion of a circuit to the circuit forming board |
Mar. 2, 2004 |
| 6694583 |
Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
Feb. 24, 2004 |
| 6694611 |
Method for manufacturing a thin-film structure having a reliably removable oxide layer |
Feb. 24, 2004 |
| 6694612 |
Mask film having a non-parting portion |
Feb. 24, 2004 |
| 6694613 |
Method for producing a printed-circuit board having projection electrodes |
Feb. 24, 2004 |
| 6693243 |
Surface mounting component and mounted structure of surface mounting component |
Feb. 17, 2004 |
| 6691404 |
Fabricating of a flat-panel displace using porous spacer |
Feb. 17, 2004 |
| 6691408 |
Printed circuit board electrical interconnects |
Feb. 17, 2004 |
| 6691409 |
Method of producing a circuit board |
Feb. 17, 2004 |
| 6687973 |
Optimized metal fuse process |
Feb. 10, 2004 |
| 6687989 |
Method for fabricating interconnect having support members for preventing component flexure |
Feb. 10, 2004 |
| 6684469 |
Method for forming an actuator array device |
Feb. 3, 2004 |
| 6684484 |
Method for manufacturing acoustical transducer with reduced parasitic capacitance |
Feb. 3, 2004 |
| 6684496 |
Method of making an integrated circuit package |
Feb. 3, 2004 |
| 6684497 |
Manufacturing methods for printed circuit boards |
Feb. 3, 2004 |
| 6686824 |
Toroidal printed coil |
Feb. 3, 2004 |
| 6681463 |
Manufacturing method of piezoelectric components |
Jan. 27, 2004 |
| 6681483 |
Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
Jan. 27, 2004 |
| 6678950 |
Method for forming a bonding pad on a substrate |
Jan. 20, 2004 |
| 6678952 |
Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof |
Jan. 20, 2004 |
| 6680517 |
Anisotropic conductive film, production method thereof, and display apparatus using anisotropic film |
Jan. 20, 2004 |
| 6675450 |
Method of manufacturing and mounting electronic devices to limit the effects of parasitics |
Jan. 13, 2004 |
| 6675469 |
Vapor phase connection techniques |
Jan. 13, 2004 |
| 6675471 |
Method of producing high-frequency modules |
Jan. 13, 2004 |
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