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Class Information
Number: 29/842
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Assembling terminal to base
Description: Process of assembling a terminal (*) to the base.










Sub-classes under this class:

Class Number Class Name Patents
29/844 By deforming or shaping 207
29/843 By metal fusion bonding 649


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Patent Number Title Of Patent Date Issued
8028402 Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof Oct. 4, 2011
8024856 Method for manufacturing printed circuit board Sep. 27, 2011
8020290 Processes for IC fabrication Sep. 20, 2011
8015703 Method of manufacturing a wired circuit board Sep. 13, 2011
8017876 Terminal portion of flexible print circuit board or flexible flat cable Sep. 13, 2011
8011089 Method of repairing segmented contactor Sep. 6, 2011
8011088 Method for securing a circuit board to a socket Sep. 6, 2011
8001683 Solder ball loading method Aug. 23, 2011
8001685 Method for manufacturing probe card needles Aug. 23, 2011
7975379 Method of making a land-grid-array (LGA) interposer Jul. 12, 2011
7975380 Method of fabricating a probe card Jul. 12, 2011
7963031 Package for semiconductor device and method of manufacturing the same Jun. 21, 2011
7941916 Manufacturing method for memory card May. 17, 2011
7937829 Method for manufacturing a conductive grid for attachment to a blister package May. 10, 2011
7918019 Method for fabricating thin touch sensor panels Apr. 5, 2011
7913366 Ultrasonic probe and manufacturing process thereof Mar. 29, 2011
7912549 Housing for a medical implant Mar. 22, 2011
7908746 Method of removing a backplane from an electrical enclosure Mar. 22, 2011
7911037 Method and structure for creating embedded metal features Mar. 22, 2011
7906364 Methods for manufacturing a sensor assembly Mar. 15, 2011
7905011 Bump forming method and bump forming apparatus Mar. 15, 2011
7891090 Method for manufacturing an interposer Feb. 22, 2011
7886421 Method for manufacturing integrated circuit device having antenna conductors Feb. 15, 2011
7882628 Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias Feb. 8, 2011
7884006 Method to build a wirebond probe card in a many at a time fashion Feb. 8, 2011
7877866 Flexible circuit electrode array and method of manufacturing the same Feb. 1, 2011
7877869 Lead body-to-connector transition zone Feb. 1, 2011
7861407 Busbar structure, method of producing the busbar structure, and electric motor having the busbar structure Jan. 4, 2011
7861406 Method of forming CMOS transistors with dual-metal silicide formed through the contact openings Jan. 4, 2011
7856710 Method of manufacturing printed wiring board Dec. 28, 2010
7845072 Method and apparatus for adjusting a multi-substrate probe structure Dec. 7, 2010
7845074 Method for manufacturing electronic parts module Dec. 7, 2010
7841074 Method of fabricating paste bump for printed circuit board Nov. 30, 2010
7841081 Method for manufacturing electronic parts module Nov. 30, 2010
7841781 Methods and apparatuses for providing a hermetic sealing system for an optical transceiver module Nov. 30, 2010
7836567 Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor Nov. 23, 2010
7832097 Shielded trace structure and fabrication method Nov. 16, 2010
7832069 Capacitor device and method of manufacturing the same Nov. 16, 2010
7823278 Method for fabricating electrical contact buttons Nov. 2, 2010
7823277 Pre-nesting of the active area on plates to reduce thickness variation Nov. 2, 2010
7823281 Method for compensating for crosstalk Nov. 2, 2010
7823283 Method of forming a land grid array interposer Nov. 2, 2010
7814648 Method of disposing an electronic device on an electrode formed on substrate Oct. 19, 2010
7814650 Process of fabricating microelectronic structures Oct. 19, 2010
7811849 Placing a MEMS part on an application platform using a guide mask Oct. 12, 2010
7810233 System of fabricating a flexible electrode array Oct. 12, 2010
7805835 Method for selectively processing surface tension of solder mask layer in circuit board Oct. 5, 2010
7802361 Method for manufacturing the BGA package board Sep. 28, 2010
7793414 Methods for forming connection structures for microelectronic devices Sep. 14, 2010
7779538 Method for mutually connecting circuit boards Aug. 24, 2010

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15










 
 
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