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Class Information
Number: 29/836
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Assembling to base an electrical component, e.g., capacitor, etc. > With component orienting > Different components
Description: Process wherein plural diverse electrical components are assembled to the base.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7437038 |
Z-axis alignment of an optoelectronic component using a spacer tool |
Oct. 14, 2008 |
| 7353593 |
Method for assembling micro structures |
Apr. 8, 2008 |
| 7353594 |
Component mounting method |
Apr. 8, 2008 |
| 7299545 |
Alignment method and mounting method using the alignment method |
Nov. 27, 2007 |
| 7288437 |
Conductive pattern producing method and its applications |
Oct. 30, 2007 |
| 7281323 |
Method for mounting electronic components |
Oct. 16, 2007 |
| 7269897 |
Manufacturing process of a stacked semiconductor device |
Sep. 18, 2007 |
| 7222414 |
Component transfer systems |
May. 29, 2007 |
| 7210222 |
Power supply control method |
May. 1, 2007 |
| 7200925 |
Component mounting method |
Apr. 10, 2007 |
| 7188409 |
Method for rejecting component during a placement cycle |
Mar. 13, 2007 |
| 7181833 |
Method of mounting an electronic part |
Feb. 27, 2007 |
| 7137194 |
Apparatus and method for maintaining a dry atmosphere in a surface mount device placement machine |
Nov. 21, 2006 |
| 7069648 |
Component mounting method |
Jul. 4, 2006 |
| 7047632 |
Method of mounting electronic components |
May. 23, 2006 |
| 7032299 |
Apparatus for mounting electronic parts |
Apr. 25, 2006 |
| 7020956 |
Method and apparatus for feeding components, and method and apparatus for mounting components |
Apr. 4, 2006 |
| 6978537 |
Method of transferring electric charge using a micrometer-scaled device |
Dec. 27, 2005 |
| 6973717 |
Method for producing a semiconductor device in chip format |
Dec. 13, 2005 |
| 6971162 |
Localized enhancement of multilayer substrate thickness for high Q RF components |
Dec. 6, 2005 |
| 6938335 |
Electronic component mounting method |
Sep. 6, 2005 |
| 6928707 |
CCFL wrapped with a heater wire, and machines for manufacturing same |
Aug. 16, 2005 |
| 6910265 |
Air suction component placement nozzle |
Jun. 28, 2005 |
| 6895661 |
Component alignment apparatuses and methods |
May. 24, 2005 |
| 6888072 |
Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same |
May. 3, 2005 |
| 6880242 |
Method for circuit protection during radiation sterilization |
Apr. 19, 2005 |
| 6877220 |
Method for feeding a component |
Apr. 12, 2005 |
| 6864572 |
Base for heat sink |
Mar. 8, 2005 |
| 6779259 |
Electronic component mounting method |
Aug. 24, 2004 |
| 6757965 |
Method of installing a land grid array multi-chip modules |
Jul. 6, 2004 |
| 6735856 |
Apparatus for component placement |
May. 18, 2004 |
| 6725532 |
Method and apparatus for mounting component |
Apr. 27, 2004 |
| 6711811 |
Method to assemble a uniform force hydrostatic bolster plate |
Mar. 30, 2004 |
| 6701611 |
Electronic component mounting apparatus operable to mount electronic components onto a mount object |
Mar. 9, 2004 |
| 6691400 |
High speed electronic parts mounting apparatus having mounting heads which alternately mount components on a printed circuit board |
Feb. 17, 2004 |
| 6675470 |
Method for manufacturing an electro-optical device |
Jan. 13, 2004 |
| 6664481 |
Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
Dec. 16, 2003 |
| 6658727 |
Method for assembling die package |
Dec. 9, 2003 |
| 6594887 |
Part mounting apparatus and part supply apparatus |
Jul. 22, 2003 |
| 6584684 |
Method for assembling a carrier and a semiconductor device |
Jul. 1, 2003 |
| 6571462 |
Electronic component mounting apparatus using duplicate sources of components |
Jun. 3, 2003 |
| 6553658 |
Assembling a stacked die package |
Apr. 29, 2003 |
| 6539622 |
Electronic components mounting device and the mounting method |
Apr. 1, 2003 |
| 6523253 |
Z-axis processor power delivery system |
Feb. 25, 2003 |
| 6519840 |
Apparatus and method for mounting semiconductor chips on a substrate |
Feb. 18, 2003 |
| 6499213 |
Assembling a stacked die package |
Dec. 31, 2002 |
| 6493931 |
Method and device for mounting electronic component |
Dec. 17, 2002 |
| 6467163 |
Universal component mounting structure for surface mountable electronic devices |
Oct. 22, 2002 |
| 6446333 |
Method of mounting a plurality of electronic components |
Sep. 10, 2002 |
| 6408505 |
Component mounting apparatus |
Jun. 25, 2002 |
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