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Class Information
Number: 29/834
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > On flat or curved insulated base, e.g., printed circuit, etc. > Assembling to base an electrical component, e.g., capacitor, etc. > With component orienting
Description: Process including the specific step of aligning or positioning the electrical component with respect to a portion of the base.










Sub-classes under this class:

Class Number Class Name Patents
29/835 And shaping, e.g., cutting or bending, etc. 199
29/836 Different components 134


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
5384956 Method for mounting components Jan. 31, 1995
5342460 Outer lead bonding apparatus Aug. 30, 1994
5317222 Workpiece transporter device with replaceable grip May. 31, 1994
5315189 Actuator with translational and rotational control May. 24, 1994
5313401 Mounting system including a plurality of hand mechanisms for picking up, moving and mounting works on an object board May. 17, 1994
5310701 Method for fixing semiconductor bodies on a substrate using wires May. 10, 1994
5297333 Packaging method for flip-chip type semiconductor device Mar. 29, 1994
5297107 Interconnect arrangement for electronic components disposed on a circuit board Mar. 22, 1994
5285571 Method for extending an electrical conductor over an edge of an HDI substrate Feb. 15, 1994
5232372 Land grid array connector and method of manufacture Aug. 3, 1993
5224325 Packaging sequence determining method Jul. 6, 1993
5225026 Bonding method and apparatus therefor Jul. 6, 1993
5222293 System for placing an object on a carrier and method Jun. 29, 1993
5216804 Method and device for placing a component on a printed circuit board Jun. 8, 1993
5216933 Tool holding mechanism for use in a bonder Jun. 8, 1993
5195821 Electronic-component mounting apparatus with laser monitoring device Mar. 23, 1993
5194948 Article alignment method and apparatus Mar. 16, 1993
5175456 Workpiece transporter Dec. 29, 1992
5153985 Method of assembly for the application of electronic components to flexible printed circuits Oct. 13, 1992
5153983 Rotary head type electrical component placing apparatus Oct. 13, 1992
5152055 Article alignment method Oct. 6, 1992
5144747 Apparatus and method for positioning an integrated circuit chip within a multichip module Sep. 8, 1992
5127570 Flexible automated bonding method and apparatus Jul. 7, 1992
5115545 Apparatus for connecting semiconductor devices to wiring boards May. 26, 1992
5113565 Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames May. 19, 1992
5104827 Method of making a plastic-packaged semiconductor device having lead support and alignment structure Apr. 14, 1992
5094382 Method of bonding leads to semiconductor elements Mar. 10, 1992
5092033 Method for packaging semiconductor device Mar. 3, 1992
5086559 Electrical component placing apparatus and method of placing electrical component Feb. 11, 1992
5086557 Method of assembling electronic component systems Feb. 11, 1992
5074036 Method of die bonding semiconductor chip by using removable frame Dec. 24, 1991
5058263 Manipulation device Oct. 22, 1991
5048178 Alignment--registration tool for fabricating multi-layer electronic packages Sep. 17, 1991
5044875 Method and apparatus for positioning components Sep. 3, 1991
5044072 Vision system apparatus and method for component/pad alignment Sep. 3, 1991
5042709 Methods and apparatus for precise alignment of objects Aug. 27, 1991
5034802 Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates Jul. 23, 1991
5022580 Vernier structure for flip chip bonded devices Jun. 11, 1991
5021736 Speed/position sensor calibration method with angular adjustment of a magnetoresistive element Jun. 4, 1991
5007162 Method and device for placing components on a support Apr. 16, 1991
5003692 Electric component mounting method Apr. 2, 1991
4999077 Method of fabricating full width scanning or imaging arrays from subunits Mar. 12, 1991
4995157 Component feeder system Feb. 26, 1991
4990462 Method for coplanar integration of semiconductor ic devices Feb. 5, 1991
4987676 End effector for a robotic system Jan. 29, 1991
4980002 Method of fabricating a layered electronic assembly having compensation for chips of different thickness and different I/O lead offsets Dec. 25, 1990
4979289 Method of die bonding semiconductor chip by using removable non-wettable by solder frame Dec. 25, 1990
4979286 Electric parts mounting apparatus and electric parts mounting method Dec. 25, 1990
4979663 Outer lead tape automated bonding system Dec. 25, 1990
4969256 Method of mounting electronic parts to circuit board Nov. 13, 1990

1 2 3 4 5 6 7 8 9 10 11










 
 
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