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Class Information
Number: 29/827
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > Beam lead frame or beam lead device
Description: Process of manufacturing either: (1) an integrated circuit having electrical connecting structure in the form of an electrically conductive body having a generally rectangular cross section and wherein the body is mounted in a cantilever fashion to the circuit, or (2) an intermediate article of manufacture utilized to produce electrical connecting structure for integrated circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut, or otherwise deformed to produce an open encasing structure provided with a plurality of generally rectangular cross-sectioned inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6735859 |
Method of manufacturing chip scale package |
May. 18, 2004 |
| 6725529 |
Method for making overlay surface mount resistor |
Apr. 27, 2004 |
| 6726533 |
Method for polishing leads for semiconductor packages |
Apr. 27, 2004 |
| 6708386 |
Method for probing an electrical device having a layer of oxide thereon |
Mar. 23, 2004 |
| 6709892 |
Electronic device fabrication method comprising twofold cutting of conductor member |
Mar. 23, 2004 |
| 6707135 |
Semiconductor leadframe for staggered board attach |
Mar. 16, 2004 |
| 6707149 |
Low cost and compliant microelectronic packages for high i/o and fine pitch |
Mar. 16, 2004 |
| 6706561 |
Method for fabricating preplated nickel/palladium and tin leadframes |
Mar. 16, 2004 |
| 6703656 |
Semiconductor memory circuitry including die sites sized for 256M to 275M memory cells in a 12" wafer |
Mar. 9, 2004 |
| 6703261 |
Semiconductor device and manufacturing the same |
Mar. 9, 2004 |
| 6701604 |
Method for assembling a power tool |
Mar. 9, 2004 |
| 6696747 |
Semiconductor package having reduced thickness |
Feb. 24, 2004 |
| 6691398 |
Electronic packaging device and method |
Feb. 17, 2004 |
| 6687980 |
Apparatus for processing flexible tape for microelectronic assemblies |
Feb. 10, 2004 |
| 6687983 |
Non leadframe clamping for matrix leadless leadframe package molding |
Feb. 10, 2004 |
| 6684496 |
Method of making an integrated circuit package |
Feb. 3, 2004 |
| 6677181 |
Method for fabricating stacked chip package device |
Jan. 13, 2004 |
| 6667547 |
High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
Dec. 23, 2003 |
| 6655022 |
Implementing micro BGA assembly techniques for small die |
Dec. 2, 2003 |
| 6643919 |
Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame |
Nov. 11, 2003 |
| 6646339 |
Thin and heat radiant semiconductor package and method for manufacturing |
Nov. 11, 2003 |
| 6637103 |
Method of tape bonding |
Oct. 28, 2003 |
| 6637100 |
Method for mounting external heat dissipater to light emitting diode |
Oct. 28, 2003 |
| 6634098 |
Methods for assembling, modifying and manufacturing a vertical surface mount package |
Oct. 21, 2003 |
| 6634101 |
Method of manufacturing metal fittings for connection with a joint connector |
Oct. 21, 2003 |
| 6625885 |
Method of making an electrical contact device |
Sep. 30, 2003 |
| 6610162 |
Methods for stress reduction feature for LOC lead frame |
Aug. 26, 2003 |
| 6606788 |
Component recognizing method and apparatus |
Aug. 19, 2003 |
| 6604281 |
Circuit board packaging process for preventing electromagnetic interference |
Aug. 12, 2003 |
| 6605868 |
Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer |
Aug. 12, 2003 |
| 6602735 |
Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips |
Aug. 5, 2003 |
| 6594889 |
Method for processing leadframe |
Jul. 22, 2003 |
| 6593732 |
Sensor module |
Jul. 15, 2003 |
| 6581279 |
Method of collectively packaging electronic components |
Jun. 24, 2003 |
| 6581277 |
Workpiece moving methods |
Jun. 24, 2003 |
| 6574862 |
Method for coupling PCB sheet |
Jun. 10, 2003 |
| 6574858 |
Method of manufacturing a chip package |
Jun. 10, 2003 |
| 6568053 |
Method for manufacturing a ceramic resonator |
May. 27, 2003 |
| 6564447 |
Non lead frame clamping for matrix leadless leadframe package molding |
May. 20, 2003 |
| 6557253 |
Method of making components with releasable leads |
May. 6, 2003 |
| 6553657 |
Semiconductor device |
Apr. 29, 2003 |
| 6551859 |
Chip scale and land grid array semiconductor packages |
Apr. 22, 2003 |
| 6543267 |
Apparatus and methods for substantial planarization of solder bumps |
Apr. 8, 2003 |
| 6543131 |
Microelectronic joining processes with temporary securement |
Apr. 8, 2003 |
| 6540927 |
Semiconductor packaging part and method producing the same |
Apr. 1, 2003 |
| 6531334 |
Method for fabricating hollow package with a solid-state image device |
Mar. 11, 2003 |
| 6523254 |
Method for gate blocking x-outs during a molding process |
Feb. 25, 2003 |
| 6518098 |
IC package with dual heat spreaders |
Feb. 11, 2003 |
| 6505400 |
Method of making chip scale package with heat spreader |
Jan. 14, 2003 |
| 6500698 |
Method for fabricating a stacked semiconductor chip package |
Dec. 31, 2002 |
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