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Class Information
Number: 29/827
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > Beam lead frame or beam lead device
Description: Process of manufacturing either: (1) an integrated circuit having electrical connecting structure in the form of an electrically conductive body having a generally rectangular cross section and wherein the body is mounted in a cantilever fashion to the circuit, or (2) an intermediate article of manufacture utilized to produce electrical connecting structure for integrated circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut, or otherwise deformed to produce an open encasing structure provided with a plurality of generally rectangular cross-sectioned inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4845842 |
Process for reducing lead sweep in integrated circuit packages |
Jul. 11, 1989 |
| 4843695 |
Method of assembling tab bonded semiconductor chip package |
Jul. 4, 1989 |
| 4842662 |
Process for bonding integrated circuit components |
Jun. 27, 1989 |
| 4841630 |
Fabrication of leaded packages |
Jun. 27, 1989 |
| 4841609 |
A method of manufacturing piezoelectric vibrators |
Jun. 27, 1989 |
| 4837928 |
Method of producing a jumper chip for semiconductor devices |
Jun. 13, 1989 |
| 4837184 |
Process of making an electronic device package with peripheral carrier structure of low-cost plastic |
Jun. 6, 1989 |
| 4835847 |
Method and apparatus for mounting a flexible film electronic device carrier on a substrate |
Jun. 6, 1989 |
| 4835846 |
Method of manufacture of electronic modules for cards with microcircuits |
Jun. 6, 1989 |
| 4835120 |
Method of making a multilayer molded plastic IC package |
May. 30, 1989 |
| 4831723 |
Direct bond circuit assembly with crimped lead frame |
May. 23, 1989 |
| 4829669 |
Method of manufacturing a chip carrier |
May. 16, 1989 |
| 4829666 |
Method for producing a carrier element for an IC-chip |
May. 16, 1989 |
| 4829362 |
Lead frame with die bond flag for ceramic packages |
May. 9, 1989 |
| 4827376 |
Heat dissipating interconnect tape for use in tape automated bonding |
May. 2, 1989 |
| 4820658 |
Method of making a packaged IC chip |
Apr. 11, 1989 |
| 4821148 |
Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound |
Apr. 11, 1989 |
| 4818726 |
Process for curing epoxy encapsulant on integrated circuit dice |
Apr. 4, 1989 |
| 4818727 |
Method of improving the corrosion resistance of aluminum contacts on semiconductors |
Apr. 4, 1989 |
| 4818960 |
Composite part and method of manufacturing same |
Apr. 4, 1989 |
| 4816426 |
Process for manufacturing plastic pin grid arrays and the product produced thereby |
Mar. 28, 1989 |
| 4816427 |
Process for connecting lead frame to semiconductor device |
Mar. 28, 1989 |
| 4812420 |
Method of producing a semiconductor device having a light transparent window |
Mar. 14, 1989 |
| 4812421 |
Tab-type semiconductor process |
Mar. 14, 1989 |
| 4809054 |
Semiconductor lead frame |
Feb. 28, 1989 |
| 4807018 |
Method and package for dissipating heat generated by an integrated circuit chip |
Feb. 21, 1989 |
| 4806106 |
Interconnect lead frame for thermal ink jet printhead and methods of manufacture |
Feb. 21, 1989 |
| 4806503 |
Method for the replacement of semiconductor devices |
Feb. 21, 1989 |
| 4806409 |
Process for providing an improved electroplated tape automated bonding tape and the product produced thereby |
Feb. 21, 1989 |
| 4801765 |
Electronic component package using multi-level lead frames |
Jan. 31, 1989 |
| 4801992 |
Three dimensional interconnected integrated circuit |
Jan. 31, 1989 |
| 4801561 |
Method for making a pre-testable semiconductor die package |
Jan. 31, 1989 |
| 4800178 |
Method of electroplating a copper lead frame with copper |
Jan. 24, 1989 |
| 4796239 |
Circuit unit for timepiece and process for fabricating the same |
Jan. 3, 1989 |
| 4792532 |
Semiconductor device and process for producing the same, and tape carrier used in said process |
Dec. 20, 1988 |
| 4791031 |
Lead frame for IC having a wire bonding part composed of multi-layer structure of iron containing alloy, refractory metal and aluminum |
Dec. 13, 1988 |
| 4788765 |
Method of making circuit assembly with hardened direct bond lead frame |
Dec. 6, 1988 |
| 4785533 |
Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same |
Nov. 22, 1988 |
| 4785990 |
Electronic component with lead terminals and method of manufacturing said electronic component |
Nov. 22, 1988 |
| 4785532 |
Method of making electrical connector assembly for antiskid braking system |
Nov. 22, 1988 |
| 4784974 |
Method of making a hermetically sealed semiconductor casing |
Nov. 15, 1988 |
| 4783906 |
Method of making a customizable electrical article |
Nov. 15, 1988 |
| 4783428 |
Method of producing a thermogenetic semiconductor device |
Nov. 8, 1988 |
| 4782589 |
Process of connecting lead frame to a semi-conductor device and a device to effect same |
Nov. 8, 1988 |
| 4778146 |
Leadframe for flash-free insert molding and method therefor |
Oct. 18, 1988 |
| 4778564 |
Process for producing an assembly tape for bonding metal fingers to electronic devices |
Oct. 18, 1988 |
| 4769908 |
Method of manufacturing a plurality of contact terminals |
Sep. 13, 1988 |
| 4769345 |
Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor |
Sep. 6, 1988 |
| 4769344 |
Method of resin encapsulating a semiconductor device |
Sep. 6, 1988 |
| 4766095 |
Method of manufacturing eprom device |
Aug. 23, 1988 |
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