 |
|
 |
| |
 |
|
Class Information
Number: 29/827
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > Beam lead frame or beam lead device
Description: Process of manufacturing either: (1) an integrated circuit having electrical connecting structure in the form of an electrically conductive body having a generally rectangular cross section and wherein the body is mounted in a cantilever fashion to the circuit, or (2) an intermediate article of manufacture utilized to produce electrical connecting structure for integrated circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut, or otherwise deformed to produce an open encasing structure provided with a plurality of generally rectangular cross-sectioned inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4985749 |
Substrate for very large scale integrated circuit and apparatus for selective tinning of the substrate leads |
Jan. 15, 1991 |
| 4982494 |
Methods of making a low capacitance integrated circuit package |
Jan. 8, 1991 |
| 4981776 |
Method of manufacturing a plastic encapsulated semiconductor device with insulated heat sink |
Jan. 1, 1991 |
| 4979289 |
Method of die bonding semiconductor chip by using removable non-wettable by solder frame |
Dec. 25, 1990 |
| 4980219 |
Carrier tape for bonding IC devices and method of using the same |
Dec. 25, 1990 |
| 4974054 |
Resin molded semiconductor device |
Nov. 27, 1990 |
| 4971930 |
EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof |
Nov. 20, 1990 |
| 4967261 |
Tape carrier for assembling an IC chip on a substrate |
Oct. 30, 1990 |
| 4965227 |
Process for manufacturing plastic pin grid arrays and the product produced thereby |
Oct. 23, 1990 |
| 4957876 |
Resin sealed semiconductor device and a method for making the same |
Sep. 18, 1990 |
| 4957882 |
Method for manufacturing semiconductor device |
Sep. 18, 1990 |
| 4951119 |
Lead frame for semiconductor devices |
Aug. 21, 1990 |
| 4949161 |
Interdigitized leadframe strip |
Aug. 14, 1990 |
| 4945634 |
Assembly packaging method for sensor elements |
Aug. 7, 1990 |
| 4944850 |
Tape automated bonded (tab) circuit and method for making the same |
Jul. 31, 1990 |
| 4942140 |
Method of packaging semiconductor device |
Jul. 17, 1990 |
| 4940855 |
Hermetically tight glass-metal housing for semiconductor components and method for producing same |
Jul. 10, 1990 |
| 4939316 |
Aluminum alloy semiconductor packages |
Jul. 3, 1990 |
| 4927491 |
Method of bonding IC unit |
May. 22, 1990 |
| 4920074 |
Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof |
Apr. 24, 1990 |
| 4914806 |
Method of manufacturing contact block |
Apr. 10, 1990 |
| 4910866 |
Method of manufacturing a series of leadframe strip carriers having fixed external dimensions and varied internal dimensions using a common mold |
Mar. 27, 1990 |
| 4908933 |
Method of manufacturing a substrate for mounting electronic components |
Mar. 20, 1990 |
| 4908935 |
Method for fabricating electronic devices |
Mar. 20, 1990 |
| 4908934 |
Process of producing a foil-roll electronic part |
Mar. 20, 1990 |
| 4908337 |
Foil for soldering the terminals of an electronic component |
Mar. 13, 1990 |
| 4903401 |
Leadframe silver bleed elimination |
Feb. 27, 1990 |
| 4896418 |
Direct mounting method for semiconductors |
Jan. 30, 1990 |
| 4891333 |
Semiconductor device and manufacturing method thereof |
Jan. 2, 1990 |
| 4887352 |
Method for making matrix lead frame |
Dec. 19, 1989 |
| 4888449 |
Semiconductor package |
Dec. 19, 1989 |
| 4885837 |
Apparatus for forming leads of semiconductor devices |
Dec. 12, 1989 |
| 4883774 |
Silver flashing process on semiconductor leadframes |
Nov. 28, 1989 |
| 4881318 |
Method of manufacturing a liquid jet recording head |
Nov. 21, 1989 |
| 4879804 |
Method of fabricating a coil |
Nov. 14, 1989 |
| 4881029 |
Semiconductor integrated circuit devices and methods for testing same |
Nov. 14, 1989 |
| 4878990 |
Electroformed and chemical milled bumped tape process |
Nov. 7, 1989 |
| 4874722 |
Process of packaging a semiconductor device with reduced stress forces |
Oct. 17, 1989 |
| 4872260 |
Method of making pre-formed lead-ins for an IC package |
Oct. 10, 1989 |
| 4870224 |
Integrated circuit package for surface mount technology |
Sep. 26, 1989 |
| 4866976 |
Apparatus for the metal working of components |
Sep. 19, 1989 |
| 4867715 |
Interconnection lead with redundant bonding regions |
Sep. 19, 1989 |
| 4862586 |
Lead frame for enclosing semiconductor chips with resin |
Sep. 5, 1989 |
| 4859632 |
Method for manufacturing the same |
Aug. 22, 1989 |
| 4857483 |
Method for the encapsulation of integrated circuits |
Aug. 15, 1989 |
| 4855251 |
Method of manufacturing electronic parts including transfer of bumps of larger particle sizes |
Aug. 8, 1989 |
| 4852250 |
Hermetically sealed package having an electronic component and method of making |
Aug. 1, 1989 |
| 4850105 |
Method of taking out lead of semiconductor tip part |
Jul. 25, 1989 |
| 4850103 |
Method for manufacturing an electronic part |
Jul. 25, 1989 |
| 4849857 |
Heat dissipating interconnect tape for use in tape automated bonding |
Jul. 18, 1989 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
