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Class Information
Number: 29/827
Name: Metal working > Method of mechanical manufacture > Electrical device making > Conductor or circuit manufacturing > Beam lead frame or beam lead device
Description: Process of manufacturing either: (1) an integrated circuit having electrical connecting structure in the form of an electrically conductive body having a generally rectangular cross section and wherein the body is mounted in a cantilever fashion to the circuit, or (2) an intermediate article of manufacture utilized to produce electrical connecting structure for integrated circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut, or otherwise deformed to produce an open encasing structure provided with a plurality of generally rectangular cross-sectioned inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Sep. 16, 2008 |
| 7405467 |
Power module package structure |
Jul. 29, 2008 |
| 7370414 |
Methods for manufacturing lead frame connectors for optical transceiver modules |
May. 13, 2008 |
| 7367119 |
Method for forming a reinforced tip for a probe storage device |
May. 6, 2008 |
| 7367120 |
Method for producing a solid-state imaging device |
May. 6, 2008 |
| 7363704 |
RFID tag and method of manufacturing RFID tag |
Apr. 29, 2008 |
| 7354804 |
Method for fabricating lead frame and method of fabricating semiconductor device using the same |
Apr. 8, 2008 |
| 7350293 |
Low profile ball-grid array package for high power |
Apr. 1, 2008 |
| 7346976 |
Method for manufacturing a suspension for disc drive |
Mar. 25, 2008 |
| 7339262 |
Tape circuit substrate and semiconductor apparatus employing the same |
Mar. 4, 2008 |
| 7308752 |
Method for making an optical pickup apparatus having a movable unit supported by springs attached to a fixed unit |
Dec. 18, 2007 |
| 7299546 |
Method for manufacturing an electronic module |
Nov. 27, 2007 |
| 7299544 |
Apparatus for separating cull of semiconductor package molding system |
Nov. 27, 2007 |
| 7278202 |
Method for making overlay surface mount resistor |
Oct. 9, 2007 |
| 7251872 |
Method for forming a chip package |
Aug. 7, 2007 |
| 7247520 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Jul. 24, 2007 |
| 7237724 |
Smart card and method for manufacturing a smart card |
Jul. 3, 2007 |
| 7234231 |
Method of manufacturing a lead frame |
Jun. 26, 2007 |
| 7230829 |
Overmolded electronic assembly with insert molded heat sinks |
Jun. 12, 2007 |
| 7228622 |
Electronic device carrier and manufacture tape |
Jun. 12, 2007 |
| 7225537 |
Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
Jun. 5, 2007 |
| 7219421 |
Method of a coating heat spreader |
May. 22, 2007 |
| 7204010 |
Method of making a load sensor plate |
Apr. 17, 2007 |
| 7204017 |
Manufacturing method of a modularized leadframe |
Apr. 17, 2007 |
| 7185425 |
Method for connecting printed circuit boards |
Mar. 6, 2007 |
| 7181835 |
Universal clamping mechanism |
Feb. 27, 2007 |
| 7174627 |
Method of fabricating known good dies from packaged integrated circuits |
Feb. 13, 2007 |
| 7174626 |
Method of manufacturing a plated electronic termination |
Feb. 13, 2007 |
| 7152316 |
Hybrid integrated circuit device and method of manufacturing the same |
Dec. 26, 2006 |
| 7134311 |
Device and method for fabricating lead frame by press forming |
Nov. 14, 2006 |
| 7131192 |
Method of manufacturing printed circuit boards using miniature contact block packagings |
Nov. 7, 2006 |
| 7132734 |
Microelectronic component assemblies and microelectronic component lead frame structures |
Nov. 7, 2006 |
| 7127805 |
Electronic device carrier and manufacturing tape |
Oct. 31, 2006 |
| 7127794 |
Auto-boating process |
Oct. 31, 2006 |
| 7117587 |
Method for fabricating a substrate, including a plurality of chip package substrates |
Oct. 10, 2006 |
| 7114248 |
Method of handling an electrical component |
Oct. 3, 2006 |
| 7112252 |
Assembly method for semiconductor die and lead frame |
Sep. 26, 2006 |
| 7107671 |
Method of processing a strip of lead frames |
Sep. 19, 2006 |
| 7103969 |
Methods and systems for forming a die package |
Sep. 12, 2006 |
| 7094619 |
Method of fabricating a light emitting device |
Aug. 22, 2006 |
| 7082678 |
Method of fabricating an integrated circuit package |
Aug. 1, 2006 |
| 7082681 |
Methods for modifying a vertical surface mount package |
Aug. 1, 2006 |
| 7069653 |
Method for electrically connecting a semiconductor component to an electrical subassembly |
Jul. 4, 2006 |
| 7064420 |
Integrated circuit leadframe with ground plane |
Jun. 20, 2006 |
| 7059042 |
Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink |
Jun. 13, 2006 |
| 7055241 |
Method of fabricating an integrated circuit package |
Jun. 6, 2006 |
| 7056769 |
Method of manufacturing an electronic device |
Jun. 6, 2006 |
| 7056448 |
Method for forming circuit pattern |
Jun. 6, 2006 |
| 7051428 |
In line system used in a semiconductor package assembling |
May. 30, 2006 |
| 7043831 |
Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate |
May. 16, 2006 |
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