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Class Information
Number: 264/328.5
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > Shaping against forming surface (e.g., casting, die shaping, etc.) > Applying heat or pressure > Introducing material under pressure into a closed mold cavity (e.g., injection molding, etc.) > Material is nonthermoplastic > Utilizing a transfer chamber > With preformed charge
Description: Processes in which the material to be molded is a preform.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7595017 |
Method for using a pre-formed film in a transfer molding process for an integrated circuit |
Sep. 29, 2009 |
| 7005101 |
Virtual gate design for thin packages |
Feb. 28, 2006 |
| 6808661 |
Method for encapsulating leadframe-mounted integrated circuits |
Oct. 26, 2004 |
| 6558600 |
Method for packaging microelectronic substrates |
May. 6, 2003 |
| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
Mar. 11, 2003 |
| 6503433 |
Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Jan. 7, 2003 |
| 6486445 |
Vacuum cast ceramic fiber insulated band having heating and cooling elements |
Nov. 26, 2002 |
| 6413465 |
Apparatus to actuate injection element |
Jul. 2, 2002 |
| 6315936 |
Encapsulation method using non-homogeneous molding compound pellets |
Nov. 13, 2001 |
| 6205659 |
Method for forming push rod for switch |
Mar. 27, 2001 |
| 6153141 |
Semiconductor packaging method |
Nov. 28, 2000 |
| 6106274 |
Molding apparatus with charge overflow |
Aug. 22, 2000 |
| 6103150 |
Molding overflow feedback method |
Aug. 15, 2000 |
| 6071457 |
Bellows container packaging system and method |
Jun. 6, 2000 |
| 6033614 |
Manual pellet loader for Boschman automolds |
Mar. 7, 2000 |
| 5965078 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Oct. 12, 1999 |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
Jun. 15, 1999 |
| 5906782 |
Method for the simultaneous curing of thermosetting resins |
May. 25, 1999 |
| 5893380 |
Method for cleaning molding compound tablets |
Apr. 13, 1999 |
| 5891377 |
Dambarless leadframe for molded component encapsulation |
Apr. 6, 1999 |
| 5888443 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Mar. 30, 1999 |
| 5885507 |
Method for encasing articles |
Mar. 23, 1999 |
| 5885506 |
Pre-packaged molding for component encapsulation |
Mar. 23, 1999 |
| 5843360 |
Method and pellet for encapsulating lead frames |
Dec. 1, 1998 |
| 5804126 |
Process for making preforms useful for encapsulating semiconductors |
Sep. 8, 1998 |
| 5698152 |
Resin tablet for sealing semiconductor |
Dec. 16, 1997 |
| 5662848 |
Plastic molding method for semiconductor devices |
Sep. 2, 1997 |
| 5653907 |
Lightweight thermally responsive mold for resin transfer molding |
Aug. 5, 1997 |
| 5645787 |
Process for producing semiconductor devices using resin tablets |
Jul. 8, 1997 |
| 5496509 |
Method for producing molded product |
Mar. 5, 1996 |
| 5435953 |
Method of molding resin for sealing an electronic device |
Jul. 25, 1995 |
| 5431854 |
Method for pressing a plastic, which cures by means of a reaction, into a mould cavity, a pressing auxiliary in pill form to be used in this method and a holder composed of such material |
Jul. 11, 1995 |
| 5407505 |
Method of encapsulating temperature sensitive devices in wax-like material having a high coefficient of fusion |
Apr. 18, 1995 |
| 5366368 |
Multi-plunger manual transfer mold die |
Nov. 22, 1994 |
| 5326523 |
Method for the manufacture of a plastic molded part |
Jul. 5, 1994 |
| 5310518 |
Method and device for manufacturing curing bladders |
May. 10, 1994 |
| 5256350 |
Method and device for manufacturing tire forming bladders |
Oct. 26, 1993 |
| 5182071 |
Method of molding a carrier ring to leads |
Jan. 26, 1993 |
| 5169586 |
Method of manufacturing resin-sealed type semiconductor device |
Dec. 8, 1992 |
| 5139728 |
Method of using molding pot having configured bottom |
Aug. 18, 1992 |
| 5098626 |
Method for packing a measured quantity of thermosetting resin and operating a mold for encapsulating a component |
Mar. 24, 1992 |
| 5064705 |
Stabilizing laminate inserts for resin transfer molding |
Nov. 12, 1991 |
| 5061542 |
Stabilizing foam inserts for resin transfer molding |
Oct. 29, 1991 |
| 5043199 |
Resin tablet for plastic encapsulation and method of manufacturing of plastic encapsulation using the resin tablet |
Aug. 27, 1991 |
| 4927590 |
Method for encapsulating integrated circuits |
May. 22, 1990 |
| 4900485 |
Method and apparatus for transfer molding |
Feb. 13, 1990 |
| 4650626 |
Method of producing a golf club head |
Mar. 17, 1987 |
| 4611983 |
Injection press for use in a transfer molding system |
Sep. 16, 1986 |
| 4569814 |
Preforming of preheated plastic pellets for use in transfer molding |
Feb. 11, 1986 |
| 4554126 |
Method for encapsulating semiconductor devices |
Nov. 19, 1985 |
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