| |
 |
|
Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5449480 |
Method of producing boards for printed wiring |
Sep. 12, 1995 |
| 5447888 |
Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins |
Sep. 5, 1995 |
| 5444909 |
Method of making a drop-in heat sink |
Aug. 29, 1995 |
| 5445995 |
Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink |
Aug. 29, 1995 |
| 5444025 |
Process for encapsulating a semiconductor package having a heat sink using a jig |
Aug. 22, 1995 |
| 5441684 |
Method of forming molded plastic packages with integrated heat sinks |
Aug. 15, 1995 |
| 5435953 |
Method of molding resin for sealing an electronic device |
Jul. 25, 1995 |
| 5434107 |
Method for planarization |
Jul. 18, 1995 |
| 5431863 |
Method of mounting semiconductor device |
Jul. 11, 1995 |
| 5429488 |
Encapsulating molding equipment and method |
Jul. 4, 1995 |
| 5427938 |
Method of manufacturing a resin-sealed semiconductor device |
Jun. 27, 1995 |
| 5424251 |
Method of producing semiconductor device having radiation part made of resin containing insulator powders |
Jun. 13, 1995 |
| 5424249 |
Method of making mold-packaged pressure sensing semiconductor device |
Jun. 13, 1995 |
| 5420752 |
GPT system for encapsulating an integrated circuit package |
May. 30, 1995 |
| 5415535 |
Semiconductor resin sealing apparatus |
May. 16, 1995 |
| 5413471 |
Resin-sealing apparatus including a gas spring |
May. 9, 1995 |
| 5409866 |
Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe |
Apr. 25, 1995 |
| 5409362 |
Encapsulation molding equipment |
Apr. 25, 1995 |
| 5407505 |
Method of encapsulating temperature sensitive devices in wax-like material having a high coefficient of fusion |
Apr. 18, 1995 |
| 5405255 |
Encapsulaton molding equipment |
Apr. 11, 1995 |
| 5401155 |
Metal mold for forming a transparent-resin-sealed semiconductor element |
Mar. 28, 1995 |
| 5395226 |
Molding machine and method |
Mar. 7, 1995 |
| 5391346 |
Method for making molded photointerrupters |
Feb. 21, 1995 |
| 5390082 |
Chip carrier with protective coating for circuitized surface |
Feb. 14, 1995 |
| 5387306 |
Manufacturing integrated circuit cards |
Feb. 7, 1995 |
| 5385869 |
Semiconductor chip bonded to a substrate and method of making |
Jan. 31, 1995 |
| 5384286 |
Process for encapsulating a semiconductor chip, leadframe and heatsink |
Jan. 24, 1995 |
| 5376326 |
Methods for making multilayer printed circuit boards |
Dec. 27, 1994 |
| 5371044 |
Method of uniformly encapsulating a semiconductor device in resin |
Dec. 6, 1994 |
| 5370517 |
Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device |
Dec. 6, 1994 |
| 5367766 |
Ultra high density integrated circuit packages method |
Nov. 29, 1994 |
| 5368805 |
Method for producing resin sealed type semiconductor device |
Nov. 29, 1994 |
| 5366364 |
Plastic molding apparatus |
Nov. 22, 1994 |
| 5365655 |
Method of making an electronic module for a memory card and an electronic module thus obtained |
Nov. 22, 1994 |
| 5366368 |
Multi-plunger manual transfer mold die |
Nov. 22, 1994 |
| 5358396 |
Multi-functional mould |
Oct. 25, 1994 |
| 5356283 |
Metal mold for sealing semiconductor devices with a resin |
Oct. 18, 1994 |
| 5350553 |
Method for the manufacture of a decorated chip card |
Sep. 27, 1994 |
| 5349136 |
Mold tool assembly |
Sep. 20, 1994 |
| 5346576 |
Method of manufacturing IC card |
Sep. 13, 1994 |
| 5343615 |
Semiconductor device and a process for making same having improved leads |
Sep. 6, 1994 |
| 5344600 |
Method for encapsulating semiconductor devices with package bodies |
Sep. 6, 1994 |
| 5344296 |
Method and apparatus for forming a runner in a mold assembly |
Sep. 6, 1994 |
| 5344795 |
Method for encapsulating an integrated circuit using a removable heatsink support block |
Sep. 6, 1994 |
| 5337588 |
Electronic lock and key system |
Aug. 16, 1994 |
| 5336272 |
Method for molding a semiconductor package on a continuous leadframe |
Aug. 9, 1994 |
| 5336456 |
Method of producing a scribelined layout structure for plastic encapsulated circuits |
Aug. 9, 1994 |
| 5333379 |
Method of producing a three-dimensional wiring board |
Aug. 2, 1994 |
| 5328347 |
Device for introducing a plastic material into a mould cavity |
Jul. 12, 1994 |
| 5328870 |
Method for forming plastic molded package with heat sink for integrated circuit devices |
Jul. 12, 1994 |
|
|
|
