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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5645864 |
Resin encapsulating molding die for manufacturing a semiconductor device |
Jul. 8, 1997 |
| 5645776 |
Method of encapsulating semiconductor devices by a direct drive electro-mechanical press |
Jul. 8, 1997 |
| 5639403 |
Method of molding a resin article with an embedded workpiece |
Jun. 17, 1997 |
| 5637273 |
Method for molding of integrated circuit package |
Jun. 10, 1997 |
| H1654 |
Transfer molding process for encapsulating semiconductor devices |
Jun. 3, 1997 |
| 5635115 |
Method for producing semiconductor device |
Jun. 3, 1997 |
| 5635220 |
Molding die for sealing semiconductor device with reduced resin burrs |
Jun. 3, 1997 |
| 5626886 |
Transfer molding machine for encapsulation of semiconductor devices |
May. 6, 1997 |
| 5626887 |
Air exhaust mold plunger |
May. 6, 1997 |
| 5627107 |
Semiconductor devices encapsulated with aluminum nitride-filled resins and process for preparing same |
May. 6, 1997 |
| 5624691 |
Transfer mold design |
Apr. 29, 1997 |
| 5622873 |
Process for manufacturing a resin molded image pick-up semiconductor chip having a window |
Apr. 22, 1997 |
| 5622731 |
Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor |
Apr. 22, 1997 |
| 5619794 |
Complex structure molding process and apparatus |
Apr. 15, 1997 |
| 5620647 |
Process for potting electrical circuits |
Apr. 15, 1997 |
| 5614131 |
Method of making an optoelectronic device |
Mar. 25, 1997 |
| 5609889 |
Apparatus for encapsulating electronic packages |
Mar. 11, 1997 |
| 5610443 |
Method for encapsulating a semiconductor utilizing an epoxy resin and an onium salt compound |
Mar. 11, 1997 |
| 5607882 |
Multi-component electronic devices and methods for making them |
Mar. 4, 1997 |
| 5603879 |
Method of molding resin to seal electronic parts using two evacuation steps |
Feb. 18, 1997 |
| 5592736 |
Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads |
Jan. 14, 1997 |
| 5589129 |
Method of manufacturing a molding using a filler or an additive concentrated on an arbitrary portion or distributed at a gradient concentration |
Dec. 31, 1996 |
| 5580509 |
Method for electrically contacting thin-film solar modules |
Dec. 3, 1996 |
| 5578261 |
Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling |
Nov. 26, 1996 |
| 5577319 |
Method of encapsulating a crystal oscillator |
Nov. 26, 1996 |
| 5569625 |
Process for manufacturing a plural stacked leadframe semiconductor device |
Oct. 29, 1996 |
| 5570272 |
Apparatus for encapsulating an integrated circuit package |
Oct. 29, 1996 |
| 5568684 |
Method of encapsulating an electronic device |
Oct. 29, 1996 |
| 5563103 |
Method for manufacturing thermoplastic resin molded semiconductor |
Oct. 8, 1996 |
| 5560968 |
Semiconductor device encapsulated with an epoxy resin and a process for encapsulation |
Oct. 1, 1996 |
| 5558884 |
System for rapidly producing either integrated circuits on a substrate, Interconnections on a printed circuit board or rapidly performing lithography |
Sep. 24, 1996 |
| 5542171 |
Method of selectively releasing plastic molding material from a surface |
Aug. 6, 1996 |
| 5529474 |
System for preheating a molding compound |
Jun. 25, 1996 |
| 5527743 |
Method for encapsulating an integrated circuit package |
Jun. 18, 1996 |
| 5522713 |
Direct drive electro-mechanical press for encapsulating semiconductor devices |
Jun. 4, 1996 |
| 5520863 |
Method of making IC card |
May. 28, 1996 |
| 5510074 |
Method for manufacturing smart cards |
Apr. 23, 1996 |
| 5501587 |
Molding machine for semiconductor package |
Mar. 26, 1996 |
| 5501588 |
Mold for a semiconductor package |
Mar. 26, 1996 |
| 5498388 |
Production method for an IC card |
Mar. 12, 1996 |
| 5492586 |
Method for fabricating encased molded multi-chip module substrate |
Feb. 20, 1996 |
| 5490319 |
Thermotropic liquid crystal polymer composition and insulator |
Feb. 13, 1996 |
| 5480296 |
Transfer molding apparatus for encapsulating an electrical element in resin |
Jan. 2, 1996 |
| 5478226 |
Automatic plunger apparatus for use in forming encapsulated semiconductor chips |
Dec. 26, 1995 |
| 5478517 |
Method for molding IC chips |
Dec. 26, 1995 |
| 5472646 |
Method for fabricating a transfer model optical semiconductor apparatus |
Dec. 5, 1995 |
| 5468910 |
Semiconductor device package and method of making |
Nov. 21, 1995 |
| 5460767 |
Hot melt masking materials |
Oct. 24, 1995 |
| 5460502 |
Plunger apparatus used in a resin molding device for encapsulating electronic components |
Oct. 24, 1995 |
| 5454705 |
Semiconductor mold having cavity blocks with cavities on top and bottom surfaces |
Oct. 3, 1995 |
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