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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5783134 |
Method of resin-sealing semiconductor device |
Jul. 21, 1998 |
| 5779958 |
Method for packaging electronic device |
Jul. 14, 1998 |
| 5780772 |
Solution to mold wire sweep in fine pitch devices |
Jul. 14, 1998 |
| 5776512 |
Apparatus for encapsulating electronic packages |
Jul. 7, 1998 |
| 5773322 |
Molded encapsulated electronic component |
Jun. 30, 1998 |
| 5770128 |
Method of transfer molding and a transfer molding machine |
Jun. 23, 1998 |
| 5766535 |
Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
Jun. 16, 1998 |
| 5766649 |
Resin sealing mold die set with less resin remainder for semiconductor device |
Jun. 16, 1998 |
| 5766972 |
Method of making resin encapsulated semiconductor device with bump electrodes |
Jun. 16, 1998 |
| 5766985 |
Process for encapsulating a semiconductor device having a heat sink |
Jun. 16, 1998 |
| 5755027 |
Manufacturing method for electrical circuit board |
May. 26, 1998 |
| 5753538 |
Method of sealing electronic parts with molded resin and mold employed therefor |
May. 19, 1998 |
| 5750154 |
Resin sealing/molding apparatus for electronic parts |
May. 12, 1998 |
| 5744083 |
Method for molding semiconductor packages |
Apr. 28, 1998 |
| 5744171 |
System for fabricating conductive epoxy grid array semiconductor packages |
Apr. 28, 1998 |
| 5744084 |
Method of improving molding of an overmolded package body on a substrate |
Apr. 28, 1998 |
| 5741530 |
Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips |
Apr. 21, 1998 |
| 5739054 |
Process for forming an encapsulated electronic component having an integral resin projection |
Apr. 14, 1998 |
| 5735040 |
Method of making IC card |
Apr. 7, 1998 |
| 5733800 |
Underfill coating for LOC package |
Mar. 31, 1998 |
| 5732465 |
Method of manufacturing one side resin sealing type semiconductor devices |
Mar. 31, 1998 |
| 5729898 |
Method of making electrical socket |
Mar. 24, 1998 |
| 5728600 |
Circuit encapsulation process |
Mar. 17, 1998 |
| 5726391 |
Thermosetting Encapsulants for electronics packaging |
Mar. 10, 1998 |
| 5722161 |
Method of making a packaged semiconductor die including heat sink with locking feature |
Mar. 3, 1998 |
| 5723156 |
Mold for molding a semiconductor package |
Mar. 3, 1998 |
| 5700723 |
Method of packaging an integrated circuit |
Dec. 23, 1997 |
| 5692296 |
Method for encapsulating an integrated circuit package |
Dec. 2, 1997 |
| 5690885 |
Method for forming encapsulated semicondcutor chips |
Nov. 25, 1997 |
| 5690773 |
Method for the manufacture of a contact-free or hybrid card |
Nov. 25, 1997 |
| 5690877 |
Method of processing a semiconductor chip package |
Nov. 25, 1997 |
| 5689137 |
Method for transfer molding standard electronic packages and apparatus formed thereby |
Nov. 18, 1997 |
| 5681356 |
Method and apparatus for producing a plastic molded chip card having reduced wall thickness |
Oct. 28, 1997 |
| 5674343 |
Method for manufacturing a semiconductor |
Oct. 7, 1997 |
| 5672550 |
Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame |
Sep. 30, 1997 |
| 5670429 |
Process of conveying an encapsulated electronic component by engaging an integral resin projection |
Sep. 23, 1997 |
| 5665296 |
Molding technique for molding plastic packages |
Sep. 9, 1997 |
| 5665653 |
Method for encapsulating an electrochemical sensor |
Sep. 9, 1997 |
| 5665281 |
Method for molding using venting pin |
Sep. 9, 1997 |
| 5662848 |
Plastic molding method for semiconductor devices |
Sep. 2, 1997 |
| 5663104 |
Method of manufacturing a semiconductor device for power supply use |
Sep. 2, 1997 |
| 5663106 |
Method of encapsulating die and chip carrier |
Sep. 2, 1997 |
| 5656549 |
Method of packaging a semiconductor device |
Aug. 12, 1997 |
| 5656305 |
System for dosed conveying and selecting of cylindrical pellets for molding apparatus for lead frames |
Aug. 12, 1997 |
| 5653020 |
Method for forming plastic packages, in particular thin packages, for semiconductor electronic devices |
Aug. 5, 1997 |
| 5654017 |
Modular molding apparatus |
Aug. 5, 1997 |
| 5650177 |
Resin molding apparatus |
Jul. 22, 1997 |
| 5647122 |
Manufacturing method for an integrated circuit card |
Jul. 15, 1997 |
| 5645776 |
Method of encapsulating semiconductor devices by a direct drive electro-mechanical press |
Jul. 8, 1997 |
| 5645864 |
Resin encapsulating molding die for manufacturing a semiconductor device |
Jul. 8, 1997 |
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