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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 5935502 |
Method for manufacturing plastic package for electronic device having a fully insulated dissipator |
Aug. 10, 1999 |
| 5935497 |
Method of printing a graphic on a memory card |
Aug. 10, 1999 |
| 5932160 |
Process and mold for encapsulating semiconductor chips having radial runners |
Aug. 3, 1999 |
| 5932254 |
System for encapsulating microelectronic devices |
Aug. 3, 1999 |
| 5929517 |
Compliant integrated circuit package and method of fabricating the same |
Jul. 27, 1999 |
| 5928595 |
Method of manufacturing a semiconductor component |
Jul. 27, 1999 |
| 5928598 |
Method of making a microelectronic device package |
Jul. 27, 1999 |
| 5925384 |
Manual pellet loader for Boschman automolds |
Jul. 20, 1999 |
| 5912024 |
Sproutless pre-packaged molding for component encapsulation |
Jun. 15, 1999 |
| 5910010 |
Semiconductor integrated circuit device, and process and apparatus for manufacturing the same |
Jun. 8, 1999 |
| 5904505 |
Process for producing encapsulated semiconductor device having metal foil material covering and metal foil |
May. 18, 1999 |
| 5897883 |
Mold having projections for inhibiting the formation of air pockets |
Apr. 27, 1999 |
| 5895620 |
Process for encapsulating an electronic component |
Apr. 20, 1999 |
| 5894006 |
Method for producing plastic material objects |
Apr. 13, 1999 |
| 5893723 |
Manufacturing method for semiconductor unit |
Apr. 13, 1999 |
| 5891377 |
Dambarless leadframe for molded component encapsulation |
Apr. 6, 1999 |
| 5891483 |
Automatic molding machine using release film |
Apr. 6, 1999 |
| 5891384 |
Method of operating a molding machine with release film |
Apr. 6, 1999 |
| 5888443 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Mar. 30, 1999 |
| 5887342 |
Method for making an electronic control unit |
Mar. 30, 1999 |
| 5885506 |
Pre-packaged molding for component encapsulation |
Mar. 23, 1999 |
| 5885507 |
Method for encasing articles |
Mar. 23, 1999 |
| 5885505 |
Method for producing electronic part sealed body |
Mar. 23, 1999 |
| 5879502 |
Method for making an electronic module and electronic module obtained according to the method |
Mar. 9, 1999 |
| 5876765 |
Injection molding equipment for encapsulating semiconductor die and the like |
Mar. 2, 1999 |
| 5874324 |
Method of sealing electronic component with molded resin |
Feb. 23, 1999 |
| 5871782 |
Transfer molding apparatus having laminated chase block |
Feb. 16, 1999 |
| 5868887 |
Method for minimizing warp and die stress in the production of an electronic assembly |
Feb. 9, 1999 |
| 5855924 |
Closed-mold for LED alphanumeric displays |
Jan. 5, 1999 |
| 5853771 |
Molding die set and mold package |
Dec. 29, 1998 |
| 5850690 |
Method of manufacturing and assembling an integrated circuit card |
Dec. 22, 1998 |
| 5851449 |
Method for manufacturing a surface-mounted type optical semiconductor device |
Dec. 22, 1998 |
| 5851559 |
Transfer molding press |
Dec. 22, 1998 |
| 5849230 |
Method of manufacturing a card with a built-in electronic part, formed of a plurality of resin layers |
Dec. 15, 1998 |
| 5846476 |
Optical curing process for intergrated circuit package assembly |
Dec. 8, 1998 |
| 5846477 |
Production method for encapsulating a semiconductor device |
Dec. 8, 1998 |
| 5842257 |
Apparatus for and method of fabricating semiconductor devices |
Dec. 1, 1998 |
| 5833903 |
Injection molding encapsulation for an electronic device directly onto a substrate |
Nov. 10, 1998 |
| 5833909 |
Transfer molding process using self-straightening alignment pins |
Nov. 10, 1998 |
| 5832600 |
Method of mounting electronic parts |
Nov. 10, 1998 |
| 5830403 |
Method of post mold curing plastic encapsulated semiconductor chips mounted on lead frames by operating a post mold curing apparatus in association with a molding line system |
Nov. 3, 1998 |
| 5824252 |
Method of resin molding and resin molding machine for the same |
Oct. 20, 1998 |
| 5819394 |
Method of making board matched nested support fixture |
Oct. 13, 1998 |
| 5811132 |
Mold for semiconductor packages |
Sep. 22, 1998 |
| 5804026 |
Method for producing identity cards, and identity card produced according to that method |
Sep. 8, 1998 |
| 5800841 |
Resin molding machine |
Sep. 1, 1998 |
| 5800747 |
Method for molding using an ion implanted mold |
Sep. 1, 1998 |
| 5798070 |
Encapsulation method |
Aug. 25, 1998 |
| 5793613 |
Heat-dissipating and supporting structure for a plastic package with a fully insulated heat sink for an electronic device |
Aug. 11, 1998 |
| 5787569 |
Encapsulated package for power magnetic devices and method of manufacture therefor |
Aug. 4, 1998 |
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