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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6196821 |
Mold assembly for injection molding flat-type heat sinks |
Mar. 6, 2001 |
| 6193493 |
Injection of encapsulating material on an optocomponent |
Feb. 27, 2001 |
| 6191955 |
Encapsulation and enclosure of electronic modules |
Feb. 20, 2001 |
| 6187248 |
Nanoporous polymer films for extreme low and interlayer dielectrics |
Feb. 13, 2001 |
| 6187243 |
Method of resin molding |
Feb. 13, 2001 |
| 6179598 |
Apparatus for filling a gap between spaced layers of a semiconductor |
Jan. 30, 2001 |
| 6180045 |
Method of forming an overmolded electronic assembly |
Jan. 30, 2001 |
| 6177040 |
Method for making light transparent package for integrated circuit |
Jan. 23, 2001 |
| 6173490 |
Method for forming a panel of packaged integrated circuits |
Jan. 16, 2001 |
| 6165405 |
Press for encapsulating electronic components and methods for use of the press |
Dec. 26, 2000 |
| 6164946 |
Ball grid array (BGA) encapsulation mold |
Dec. 26, 2000 |
| 6153287 |
Food product packaging with a hidden built-in anti-theft device and a method for preparing such packaging |
Nov. 28, 2000 |
| 6153141 |
Semiconductor packaging method |
Nov. 28, 2000 |
| 6130383 |
Solder ball array package and a method of encapsulation |
Oct. 10, 2000 |
| 6126885 |
Method for manufacturing resin-molded semiconductor device |
Oct. 3, 2000 |
| 6126428 |
Vacuum dispense apparatus for dispensing an encapsulant |
Oct. 3, 2000 |
| 6117382 |
Method for encasing array packages |
Sep. 12, 2000 |
| 6106259 |
Transfer molding apparatus with a cull-block having protrusion |
Aug. 22, 2000 |
| 6099783 |
Photopolymerizable compositions for encapsulating microelectronic devices |
Aug. 8, 2000 |
| 6094354 |
Chip component mounting board, chip component mounting structure, and method of manufacturing chip component mounting board |
Jul. 25, 2000 |
| 6087006 |
Surface-protecting film and resin-sealed semiconductor device having said film |
Jul. 11, 2000 |
| 6084053 |
Electronic part and process for manufacturing the same |
Jul. 4, 2000 |
| 6081997 |
System and method for packaging an integrated circuit using encapsulant injection |
Jul. 4, 2000 |
| 6080354 |
Resin molding method in which a movable cavity piece allows a direct resin feed |
Jun. 27, 2000 |
| 6071758 |
Process for manufacturing a chip card micromodule with protection barriers |
Jun. 6, 2000 |
| 6071457 |
Bellows container packaging system and method |
Jun. 6, 2000 |
| 6056909 |
Casting mold for precisely aligning an electronic circuit with a cast wall and method of using same |
May. 2, 2000 |
| 6048483 |
Resin sealing method for chip-size packages |
Apr. 11, 2000 |
| 6030569 |
Packaging process using a wedge device for linear force amplification in a press |
Feb. 29, 2000 |
| 6027590 |
Method for minimizing warp and die stress in the production of an electronic assembly |
Feb. 22, 2000 |
| 6019588 |
Moulding apparatus with compensation element |
Feb. 1, 2000 |
| 6015280 |
Apparatus for reducing warping of plastic packages |
Jan. 18, 2000 |
| 6013947 |
Substrate having gate recesses or slots and molding device and molding method thereof |
Jan. 11, 2000 |
| 6014318 |
Resin-sealed type ball grid array IC package and manufacturing method thereof |
Jan. 11, 2000 |
| 6007317 |
Ball grid array (BGA) encapsulation mold |
Dec. 28, 1999 |
| 6001672 |
Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
Dec. 14, 1999 |
| 6000924 |
Pressurized underfill encapsulation of integrated circuits |
Dec. 14, 1999 |
| 5997798 |
Biasing mold for integrated circuit chip assembly encapsulation |
Dec. 7, 1999 |
| 5995374 |
Resin-coated mount substrate and method of producing the same |
Nov. 30, 1999 |
| 5989474 |
Method for fabricating resin-sealed semiconductor device using leadframe provided with resin dam bar |
Nov. 23, 1999 |
| 5985185 |
Optocomponent capsule having an optical interface |
Nov. 16, 1999 |
| 5980683 |
Production of a support element module for embedding into smart cards or other data carrier cards |
Nov. 9, 1999 |
| 5971734 |
Mold for ball grid array semiconductor package |
Oct. 26, 1999 |
| 5964030 |
Mold flow regulating dam ring |
Oct. 12, 1999 |
| 5965078 |
Method for manufacturing prepackaged molding compound for component encapsulation |
Oct. 12, 1999 |
| 5961912 |
Encapsulating method of substrate based electronic device |
Oct. 5, 1999 |
| 5958466 |
Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
Sep. 28, 1999 |
| 5955021 |
Method of making smart cards |
Sep. 21, 1999 |
| 5955115 |
Pre-packaged liquid molding for component encapsulation |
Sep. 21, 1999 |
| 5951804 |
Method for simultaneously manufacturing chip-scale package using lead frame strip with a plurality of lead frames |
Sep. 14, 1999 |
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