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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6403009 |
Circuit encapsulation |
Jun. 11, 2002 |
| 6399004 |
Method for encapsulating a chip on a carrier |
Jun. 4, 2002 |
| 6373132 |
Semiconductor die with attached heat sink and transfer mold |
Apr. 16, 2002 |
| 6368895 |
Method of producing an electronic circuit device |
Apr. 9, 2002 |
| 6355199 |
Method of molding flexible circuit with molded stiffener |
Mar. 12, 2002 |
| 6352423 |
Apparatus for underfilling semiconductor devices |
Mar. 5, 2002 |
| 6352422 |
Method and apparatus for epoxy loc die attachment |
Mar. 5, 2002 |
| 6350113 |
Resin molding machine |
Feb. 26, 2002 |
| 6344161 |
Device encapsulation process utilizing pre-cut slots in flexible film substrate |
Feb. 5, 2002 |
| 6344162 |
Method of manufacturing semiconductor devices and resin molding machine |
Feb. 5, 2002 |
| 6338813 |
Molding method for BGA semiconductor chip package |
Jan. 15, 2002 |
| 6334971 |
Manufacturing method for diode group processed by injection molding on the surface |
Jan. 1, 2002 |
| 6332766 |
Apparatus for encasing array packages |
Dec. 25, 2001 |
| 6325606 |
Apparatus for filling a gap between spaced layers of a semiconductor |
Dec. 4, 2001 |
| 6324069 |
Chip package with molded underfill |
Nov. 27, 2001 |
| 6319450 |
Encapsulated circuit using vented mold |
Nov. 20, 2001 |
| 6319448 |
Process for the production of an apparatus or instrument by overmolding and apparatus or instrument thus obtained |
Nov. 20, 2001 |
| 6315540 |
Molding die for concurrently molding semiconductor chips without voids and wire weep |
Nov. 13, 2001 |
| 6315936 |
Encapsulation method using non-homogeneous molding compound pellets |
Nov. 13, 2001 |
| 6309575 |
Transfer molding method for forming integrated circuit package |
Oct. 30, 2001 |
| 6309914 |
Method for making a semiconductor package |
Oct. 30, 2001 |
| 6306331 |
Ultra mold for encapsulating very thin packages |
Oct. 23, 2001 |
| 6302461 |
Transport and/or collection device made of molded plastics material and including an identity device, and a method of manufacture |
Oct. 16, 2001 |
| RE37413 |
Semiconductor package for a semiconductor chip having centrally located bottom bond pads |
Oct. 16, 2001 |
| 6290481 |
Flash-free mold structure for integrated circuit package |
Sep. 18, 2001 |
| 6287503 |
Method for encasing array packages |
Sep. 11, 2001 |
| 6284173 |
Method for vacuum encapsulation of semiconductor chip packages |
Sep. 4, 2001 |
| 6276913 |
Mold for resin sealing |
Aug. 21, 2001 |
| 6270712 |
Molding die and marking method for semiconductor devices |
Aug. 7, 2001 |
| 6264862 |
Method for manufacturing a plug |
Jul. 24, 2001 |
| 6262480 |
Package for electronic device having a fully insulated dissipator |
Jul. 17, 2001 |
| 6261508 |
Method for making a shielding composition |
Jul. 17, 2001 |
| 6261492 |
Method for fitting a semiconductor chip |
Jul. 17, 2001 |
| 6261502 |
Method for injection molding a plastic material composite device |
Jul. 17, 2001 |
| 6261501 |
Resin sealing method for a semiconductor device |
Jul. 17, 2001 |
| 6258314 |
Method for manufacturing resin-molded semiconductor device |
Jul. 10, 2001 |
| 6257857 |
Molding apparatus for flexible substrate based package |
Jul. 10, 2001 |
| 6254815 |
Molded packaging method for a sensing die having a pressure sensing diaphragm |
Jul. 3, 2001 |
| 6249050 |
Encapsulated transfer molding of a semiconductor die with attached heat sink |
Jun. 19, 2001 |
| 6247229 |
Method of forming an integrated circuit device package using a plastic tape as a base |
Jun. 19, 2001 |
| 6248424 |
Method and apparatus for indicating degree of manufacture of an article |
Jun. 19, 2001 |
| 6243945 |
Method for manufacturing electronic parts |
Jun. 12, 2001 |
| 6224810 |
Method of plastic molding |
May. 1, 2001 |
| 6213747 |
Package stack via bottom leaded plastic (BLP) packaging |
Apr. 10, 2001 |
| 6214152 |
Lead frame moisture barrier for molded plastic electronic packages |
Apr. 10, 2001 |
| 6214273 |
Molding method with the use of modified runners |
Apr. 10, 2001 |
| 6200504 |
Method for encapsulating with plastic a lead frame with chips |
Mar. 13, 2001 |
| 6200630 |
Producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
Mar. 13, 2001 |
| 6200121 |
Process for concurrently molding semiconductor chips without void and wire weep and molding die used therein |
Mar. 13, 2001 |
| 6196821 |
Mold assembly for injection molding flat-type heat sinks |
Mar. 6, 2001 |
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