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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6585927 |
Methods for labeling semiconductor device components |
Jul. 1, 2003 |
| 6585925 |
Process for forming molded heat dissipation devices |
Jul. 1, 2003 |
| 6576178 |
Resin sealing apparatus and resin sealing method |
Jun. 10, 2003 |
| 6562272 |
Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages |
May. 13, 2003 |
| 6563207 |
Split-mold and method for manufacturing semiconductor device by using the same |
May. 13, 2003 |
| 6561782 |
Gate for molding device |
May. 13, 2003 |
| 6562278 |
Methods of fabricating housing structures and micromachines incorporating such structures |
May. 13, 2003 |
| 6558600 |
Method for packaging microelectronic substrates |
May. 6, 2003 |
| 6555924 |
Semiconductor package with flash preventing mechanism and fabrication method thereof |
Apr. 29, 2003 |
| 6554598 |
Mold assembly for encapsulating semiconductor device |
Apr. 29, 2003 |
| 6549821 |
Stereolithographic method and apparatus for packaging electronic components and resulting structures |
Apr. 15, 2003 |
| 6546620 |
Flip chip integrated circuit and passive chip component package fabrication method |
Apr. 15, 2003 |
| 6545368 |
Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device |
Apr. 8, 2003 |
| 6544466 |
Surface modification method for molds used during semiconductor device fabrication |
Apr. 8, 2003 |
| 6544461 |
Test carrier with molded interconnect for testing semiconductor components |
Apr. 8, 2003 |
| 6537051 |
Encapsulation mold with a castellated inner surface |
Mar. 25, 2003 |
| 6537482 |
Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
Mar. 25, 2003 |
| 6531763 |
Interposers having encapsulant fill control features |
Mar. 11, 2003 |
| 6531083 |
Sproutless pre-packaged molding for component encapsulation |
Mar. 11, 2003 |
| 6531080 |
Method for producing and magazining micro-components |
Mar. 11, 2003 |
| 6528000 |
Molding apparatus for use in manufacture of resin shielding semiconductor device |
Mar. 4, 2003 |
| 6527998 |
Method of fabricating integrated circuit pack trays using modules |
Mar. 4, 2003 |
| 6524517 |
Methods for molding and grafting highly uniform polymer layers onto electronic microchips |
Feb. 25, 2003 |
| 6515312 |
Method for packaging organic electroluminescent device |
Feb. 4, 2003 |
| 6508970 |
Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Jan. 21, 2003 |
| 6505955 |
Method for production of conducting element and conducting element |
Jan. 14, 2003 |
| 6506328 |
Process for producing an electronic component |
Jan. 14, 2003 |
| 6503433 |
Liquid transfer molding system for encapsulating semiconductor integrated circuits |
Jan. 7, 2003 |
| 6497837 |
Method using a saw tooth mold |
Dec. 24, 2002 |
| 6495083 |
Method of underfilling an integrated circuit chip |
Dec. 17, 2002 |
| 6491857 |
Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein |
Dec. 10, 2002 |
| 6491508 |
Molding die set |
Dec. 10, 2002 |
| 6488879 |
Method of producing an electronic device having a sheathed body |
Dec. 3, 2002 |
| 6489178 |
Method of fabricating a molded package for micromechanical devices |
Dec. 3, 2002 |
| 6482346 |
Method for manufacturing an in-mold display |
Nov. 19, 2002 |
| 6482287 |
Method for including an electronic label in the wall of a heat-transformed object and preparatory device for this method |
Nov. 19, 2002 |
| 6478562 |
Resin molding machine |
Nov. 12, 2002 |
| 6468361 |
PBGA singulated substrate for model melamine cleaning |
Oct. 22, 2002 |
| 6462273 |
Semiconductor card and method of fabrication |
Oct. 8, 2002 |
| 6461558 |
Injection molding apparatus and method |
Oct. 8, 2002 |
| 6457963 |
Resin-sealing apparatus |
Oct. 1, 2002 |
| 6459159 |
Apparatus for sealing a semiconductor device utilizing a release film |
Oct. 1, 2002 |
| 6444157 |
Method of resin molding |
Sep. 3, 2002 |
| 6444035 |
Conveyorized vacuum injection system |
Sep. 3, 2002 |
| 6439869 |
Apparatus for molding semiconductor components |
Aug. 27, 2002 |
| 6436318 |
Paper substrates for use in integrated circuit packaging molding processes |
Aug. 20, 2002 |
| 6436331 |
Method of resin sealing a gap between a semiconductor chip and a substrate |
Aug. 20, 2002 |
| 6436509 |
Electrically insulating sealing structure and its method of use in a semiconductor manufacturing apparatus |
Aug. 20, 2002 |
| 6433285 |
Printed wiring board, IC card module using the same, and method for producing IC card module |
Aug. 13, 2002 |
| 6428731 |
Mould part, mould and method for encapsulating electronic components mounted on a carrier |
Aug. 6, 2002 |
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