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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6890459 |
Method for manufacturing semiconductor laser package |
May. 10, 2005 |
| 6890460 |
Method for manufacturing lens cap for optical module |
May. 10, 2005 |
| 6881611 |
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
Apr. 19, 2005 |
| 6869556 |
Molding system for semiconductor packages |
Mar. 22, 2005 |
| 6869811 |
Methods for transfer molding encapsulation of a semiconductor die with attached heat sink |
Mar. 22, 2005 |
| 6863516 |
Transfer molding and underfilling apparatus |
Mar. 8, 2005 |
| 6858910 |
Method of fabricating a molded package for micromechanical devices |
Feb. 22, 2005 |
| 6840751 |
Vertical mold die press machine |
Jan. 11, 2005 |
| 6838184 |
Aromatic polyimide film for electro-conductive sealing element of packaged semi-conductor device |
Jan. 4, 2005 |
| 6835596 |
Method of manufacturing a semiconductor device |
Dec. 28, 2004 |
| 6830719 |
Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board |
Dec. 14, 2004 |
| 6818169 |
Molding device and molding method |
Nov. 16, 2004 |
| 6811738 |
Manufacturing method of an electronic device package |
Nov. 2, 2004 |
| 6808661 |
Method for encapsulating leadframe-mounted integrated circuits |
Oct. 26, 2004 |
| 6805829 |
Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
Oct. 19, 2004 |
| 6805541 |
Resin encapsulating apparatus used in a manufacture of a semiconductor device |
Oct. 19, 2004 |
| 6797542 |
Fabrication method of semiconductor integrated circuit device |
Sep. 28, 2004 |
| 6787093 |
Semiconductor resin molding method |
Sep. 7, 2004 |
| 6780067 |
Combined integral molded product using pre-molded member |
Aug. 24, 2004 |
| 6770163 |
Mold and method for encapsulation of electronic device |
Aug. 3, 2004 |
| 6770236 |
Method of resin molding |
Aug. 3, 2004 |
| 6767484 |
Transfer molding method for manufacturing semiconductor devices |
Jul. 27, 2004 |
| 6758999 |
Forming method of magnetic body and printed circuit board |
Jul. 6, 2004 |
| 6752951 |
Method of manufacture of an integrated camera and lighting device |
Jun. 22, 2004 |
| 6743389 |
Resin molding machine and method of resin molding |
Jun. 1, 2004 |
| 6737002 |
Fabrication of plastic module with exposed backside contact |
May. 18, 2004 |
| 6733711 |
Plastic packaging of LED arrays |
May. 11, 2004 |
| 6724072 |
Lead frame, resin sealing mold and method for manufacturing a semiconductor device using the same |
Apr. 20, 2004 |
| 6719550 |
Apparatus for epoxy loc die attachment |
Apr. 13, 2004 |
| 6694707 |
Apparatus and method for populating transport tapes |
Feb. 24, 2004 |
| 6696006 |
Mold for flashless injection molding to encapsulate an integrated circuit chip |
Feb. 24, 2004 |
| 6682674 |
Method of making a shield can |
Jan. 27, 2004 |
| 6676885 |
Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding di |
Jan. 13, 2004 |
| 6670220 |
Semiconductor device and manufacture method of that |
Dec. 30, 2003 |
| 6666997 |
Method for removing cleaning compound flash from mold vents |
Dec. 23, 2003 |
| 6653173 |
Method and apparatus for packaging a microelectronic die |
Nov. 25, 2003 |
| 6652799 |
Method for molding semiconductor components |
Nov. 25, 2003 |
| 6652795 |
Production method for semiconductor devices using resin molding mold |
Nov. 25, 2003 |
| 6650020 |
Resin-sealed semiconductor device |
Nov. 18, 2003 |
| 6649108 |
Method of manufacturing a U-shaped heat sink assembly |
Nov. 18, 2003 |
| 6643919 |
Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame |
Nov. 11, 2003 |
| 6641382 |
Resin encapsulation mold |
Nov. 4, 2003 |
| 6635209 |
Method of encapsulating a substrate-based package assembly without causing mold flash |
Oct. 21, 2003 |
| 6629351 |
Apparatus and method for separating cull in a package assembly process |
Oct. 7, 2003 |
| 6617200 |
System and method for fabricating a semiconductor device |
Sep. 9, 2003 |
| 6616880 |
Method for encasing array packages |
Sep. 9, 2003 |
| 6604281 |
Circuit board packaging process for preventing electromagnetic interference |
Aug. 12, 2003 |
| 6596212 |
Method and apparatus for increasing thickness of molded body on semiconductor package |
Jul. 22, 2003 |
| 6592352 |
Offset edges mold for plastic packaging of integrated semiconductor devices |
Jul. 15, 2003 |
| 6589820 |
Method and apparatus for packaging a microelectronic die |
Jul. 8, 2003 |
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