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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4250347 |
Method of encapsulating microelectronic elements |
Feb. 10, 1981 |
| 4241493 |
Method of fabricating solar cell modules |
Dec. 30, 1980 |
| 4216577 |
Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
Aug. 12, 1980 |
| 4203792 |
Method for the fabrication of devices including polymeric materials |
May. 20, 1980 |
| 4188708 |
Integrated circuit package with optical input coupler |
Feb. 19, 1980 |
| 4173821 |
Method of producing semiconductor devices |
Nov. 13, 1979 |
| 4161817 |
Method and apparatus for making a semiconductor device mounting element embodying an embedded fan-out wire arrangement |
Jul. 24, 1979 |
| 4126292 |
Mold die |
Nov. 21, 1978 |
| 4109373 |
Method for manufacturing semiconductor devices |
Aug. 29, 1978 |
| 4081600 |
High density thick foil circuitry laminated package |
Mar. 28, 1978 |
| 4066839 |
Molded body incorporating heat dissipator |
Jan. 3, 1978 |
| 4043027 |
Process for encapsulating electronic components in plastic |
Aug. 23, 1977 |
| 4032963 |
Package and method for a semiconductor radiant energy emitting device |
Jun. 28, 1977 |
| 4017495 |
Encapsulation of integrated circuits |
Apr. 12, 1977 |
| 4010143 |
Molding compound containing N-methyl-Z pyrrolidone and method |
Mar. 1, 1977 |
| 4003544 |
Gateless injection mold for encapsulating semiconductor devices |
Jan. 18, 1977 |
| 3981074 |
Method for producing plastic base caps for split cavity type package semi-conductor units |
Sep. 21, 1976 |
| 3965277 |
Photoformed plated interconnection of embedded integrated circuit chips |
Jun. 22, 1976 |
| 3947953 |
Method of making plastic sealed cavity molded type semi-conductor devices |
Apr. 6, 1976 |
| 3939558 |
Method of forming an electrical network package |
Feb. 24, 1976 |
| 3939488 |
Method of manufacturing semiconductor device and resulting product |
Feb. 17, 1976 |
| 3931454 |
Printed circuit board and method of preparing it |
Jan. 6, 1976 |
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