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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4649637 |
Method for producing resin-molded semiconductor device having heat radiating plate embedded in the resin |
Mar. 17, 1987 |
| 4644384 |
Apparatus and method for packaging eprom integrated circuits |
Feb. 17, 1987 |
| 4641418 |
Molding process for semiconductor devices and lead frame structure therefor |
Feb. 10, 1987 |
| 4637130 |
Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
Jan. 20, 1987 |
| 4632798 |
Encapsulation of electronic components with anisotropic thermoplastic polymers |
Dec. 30, 1986 |
| 4623500 |
Method of mounting a plurality of coupons in molded material and polishing surfaces thereof for cross-sectional analysis of printed circuit boards |
Nov. 18, 1986 |
| 4617160 |
Method for fabricating modules comprising uniformly stacked, aligned circuit-carrying layers |
Oct. 14, 1986 |
| 4615857 |
Encapsulation means and method for reducing flash |
Oct. 7, 1986 |
| 4614963 |
Plastics encapsulated electronic devices |
Sep. 30, 1986 |
| 4604799 |
Method of making molded circuit board |
Aug. 12, 1986 |
| 4599062 |
Encapsulation molding apparatus |
Jul. 8, 1986 |
| 4595647 |
Method for encapsulating and marking electronic devices |
Jun. 17, 1986 |
| 4592131 |
Method for manufacturing resin-sealed semiconductor device |
Jun. 3, 1986 |
| 4582556 |
Adhesion primers for encapsulating epoxies |
Apr. 15, 1986 |
| 4569814 |
Preforming of preheated plastic pellets for use in transfer molding |
Feb. 11, 1986 |
| 4567006 |
Method for encapsulating microelectronic sensor devices |
Jan. 28, 1986 |
| 4559697 |
Method of fixing insertion electrode panel in compression-bonded semiconductor device |
Dec. 24, 1985 |
| 4558510 |
Method of producing a semiconductor device |
Dec. 17, 1985 |
| 4556896 |
Lead frame structure |
Dec. 3, 1985 |
| 4554126 |
Method for encapsulating semiconductor devices |
Nov. 19, 1985 |
| 4546951 |
Mould for encapsulating parts of elements into a plastic material |
Oct. 15, 1985 |
| 4542260 |
Encapsulated assemblies |
Sep. 17, 1985 |
| 4540533 |
Method of encapsulating electronic components by extrusion of plastic material |
Sep. 10, 1985 |
| 4534921 |
Method and apparatus for mold cleaning by reverse sputtering |
Aug. 13, 1985 |
| 4529790 |
Epoxy resin composition |
Jul. 16, 1985 |
| 4514752 |
Displacement compensating module |
Apr. 30, 1985 |
| 4513942 |
Plate molding apparatus with interlocking cavity plates |
Apr. 30, 1985 |
| 4514588 |
Encapsulated electronic components and encapsulation compositions |
Apr. 30, 1985 |
| 4511317 |
Apparatus for enclosing semiconductors with resin by molding |
Apr. 16, 1985 |
| 4504427 |
Solder preform stabilization for lead frames |
Mar. 12, 1985 |
| 4504435 |
Method for semiconductor device packaging |
Mar. 12, 1985 |
| 4486364 |
Method and apparatus for molding a synthetic resin lens for a light emitting diode |
Dec. 4, 1984 |
| 4480975 |
Apparatus for encapsulating electronic components |
Nov. 6, 1984 |
| 4467522 |
Process for manufacturing plastic containers incorporating a heat disperser for integrated circuits |
Aug. 28, 1984 |
| 4460537 |
Slot transfer molding apparatus and methods |
Jul. 17, 1984 |
| 4451973 |
Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor |
Jun. 5, 1984 |
| 4450024 |
Identification card with an IC-module and method for producing it |
May. 22, 1984 |
| 4442056 |
Encapsulation mold with gate plate and method of using same |
Apr. 10, 1984 |
| 4439006 |
Low cost electro-optical connector |
Mar. 27, 1984 |
| 4410469 |
Method for manufacturing a module for a fiber optic link |
Oct. 18, 1983 |
| 4397803 |
Method of making a photoflash device having a radiant energy-activated disconnect switch as part of the circuitry thereof |
Aug. 9, 1983 |
| 4395817 |
Method of making keyboard switches |
Aug. 2, 1983 |
| 4374080 |
Method and apparatus for encapsulation casting |
Feb. 15, 1983 |
| 4370292 |
Encapsulation of electronic device |
Jan. 25, 1983 |
| 4368168 |
Method for encapsulating electrical components |
Jan. 11, 1983 |
| 4365947 |
Apparatus for molding stress control cones insitu on the terminations of insulated high voltage power cables |
Dec. 28, 1982 |
| 4358331 |
Method of embedding semiconductor components in plastics |
Nov. 9, 1982 |
| 4337182 |
Poly (arylene sulfide) composition suitable for use in semi-conductor encapsulation |
Jun. 29, 1982 |
| 4327369 |
Encapsulating moisture-proof coating |
Apr. 27, 1982 |
| 4282136 |
Flame retardant epoxy molding compound method and encapsulated device |
Aug. 4, 1981 |
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