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Class Information
Number: 264/272.17
Name: Plastic and nonmetallic article shaping or treating: processes > Mechanical shaping or molding to form or reform shaped article > To produce composite, plural part or multilayered article > Shaping material and uniting to a preform > Preform embedded in or surrounded by shaped material > Electrical component encapsulating > Semiconductor or barrier layer device (e.g., integrated circuit, transistor, etc.)
Description: Processes in which the component exhibits asymmetrical voltage current conduction characteristics.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 4946633 |
Method of producing semiconductor devices |
Aug. 7, 1990 |
| 4944908 |
Method for forming a molded plastic article |
Jul. 31, 1990 |
| 4927590 |
Method for encapsulating integrated circuits |
May. 22, 1990 |
| 4927580 |
Method for manufacturing electronic device including a vibration generating element |
May. 22, 1990 |
| 4919857 |
Method of molding a pin holder on a lead frame |
Apr. 24, 1990 |
| 4915607 |
Lead frame assembly for an integrated circuit molding system |
Apr. 10, 1990 |
| 4916518 |
Plastic encapsulated semiconductor device and method for manufacturing the same |
Apr. 10, 1990 |
| 4913930 |
Method for coating semiconductor components on a dielectric film |
Apr. 3, 1990 |
| 4910867 |
Method of forming a sealed electrical connector |
Mar. 27, 1990 |
| 4908178 |
Method of molding a semiconductor device |
Mar. 13, 1990 |
| 4900485 |
Method and apparatus for transfer molding |
Feb. 13, 1990 |
| 4900501 |
Method and apparatus for encapsulating semi-conductors |
Feb. 13, 1990 |
| 4890780 |
Manufacturing apparatus |
Jan. 2, 1990 |
| 4890152 |
Plastic molded chip carrier package and method of fabricating the same |
Dec. 26, 1989 |
| 4888307 |
Method for manufacturing plastic encapsulated semiconductor devices |
Dec. 19, 1989 |
| 4881885 |
Dam for lead encapsulation |
Nov. 21, 1989 |
| 4868638 |
Plastic molded pin grid chip carrier package |
Sep. 19, 1989 |
| 4862586 |
Lead frame for enclosing semiconductor chips with resin |
Sep. 5, 1989 |
| 4861251 |
Apparatus for encapsulating selected portions of a printed circuit board |
Aug. 29, 1989 |
| 4860436 |
Method of manufacturing a compact switch |
Aug. 29, 1989 |
| 4857483 |
Method for the encapsulation of integrated circuits |
Aug. 15, 1989 |
| 4842800 |
Method of encapsulating electronic devices |
Jun. 27, 1989 |
| 4830038 |
Photovoltaic module |
May. 16, 1989 |
| 4829406 |
Square body leadless electrical device |
May. 9, 1989 |
| 4823234 |
Semiconductor device and its manufacture |
Apr. 18, 1989 |
| 4822536 |
Method of encapsulating an electronic component with a synthetic resin |
Apr. 18, 1989 |
| 4822550 |
Method of molding a protective cover on a pin grid array |
Apr. 18, 1989 |
| 4812420 |
Method of producing a semiconductor device having a light transparent window |
Mar. 14, 1989 |
| 4792752 |
Sensor for measuring partial pressures of gases |
Dec. 20, 1988 |
| 4782195 |
Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
Nov. 1, 1988 |
| 4778146 |
Leadframe for flash-free insert molding and method therefor |
Oct. 18, 1988 |
| 4778641 |
Method of molding a pin grid array package |
Oct. 18, 1988 |
| 4769344 |
Method of resin encapsulating a semiconductor device |
Sep. 6, 1988 |
| 4764235 |
Process and apparatus for sealing semiconductor packages |
Aug. 16, 1988 |
| 4764327 |
Process of producing plastic-molded printed circuit boards |
Aug. 16, 1988 |
| 4753863 |
Laser markable molding compound |
Jun. 28, 1988 |
| 4746392 |
Method for producing an identification card with an integrated circuit |
May. 24, 1988 |
| 4741787 |
Method and apparatus for packaging semiconductor device and the like |
May. 3, 1988 |
| 4741507 |
Self-cleaning mold |
May. 3, 1988 |
| 4733014 |
Lead frame |
Mar. 22, 1988 |
| H445 |
Method of forming light emitting device with direct contact lens |
Mar. 1, 1988 |
| 4720424 |
Electronic component encapsulated with a composition comprising a polymer which is capable of forming an anisotropic melt phase and substantially incapable of further chain growth upon heating |
Jan. 19, 1988 |
| 4711688 |
Method for encapsulating semiconductor components mounted on a carrier tape |
Dec. 8, 1987 |
| 4701999 |
Method of making sealed housings containing delicate structures |
Oct. 27, 1987 |
| 4688152 |
Molded pin grid array package GPT |
Aug. 18, 1987 |
| 4686764 |
Membrane protected pressure sensor |
Aug. 18, 1987 |
| 4675989 |
Method of making an electrical circuit package |
Jun. 30, 1987 |
| 4663833 |
Method for manufacturing IC plastic package with window |
May. 12, 1987 |
| 4653993 |
Apparatus for encapsulating electronic components in plastic material |
Mar. 31, 1987 |
| 4654290 |
Laser markable molding compound, method of use and device therefrom |
Mar. 31, 1987 |
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